Composition for preparing semiconductor electrothermal film, electrothermal film and preparation method

Abstract

The invention relates to a composition for preparing a semiconductor electrothermal film. The composition is prepared from the following components in parts by weight: 15-20 parts of stannic chloride, 6-10 parts of nickel tetrachloride, 10-30 parts of graphite, 3-6 parts of antimony trichloride, 0.2-0.4 part of titanium tetrachloride, 0.2-0.6 part of antimonous oxide, 0.1-0.8 part of fullerene, 0.1-1.5 parts of boric acid, 0.1-1.5 part of fluoboric acid, 0.3-0.5 part of sodium chloride, 3-6 parts of water, 2-4 parts of methylbenzene and 30-50 parts of ethanol. The adhesive force of the semiconductor electrothermal film prepared according to the method on a substrate is 180-200N; the leakage current is smaller than 0.10mA; the electrothermal conversion efficiency is greater than or equal to 99%; the square resistance is 20-500ohm / square; and the lifetime is over 5,000 hours.

Description

technical field [0001] The invention belongs to the field of electric heating films, and in particular relates to a composition for preparing a semiconductor electric heating film, an electric heating film and a preparation method thereof. Background technique [0002] Semiconductor electrothermal film technology is a kind of electric heating technology, which can be widely used in the fields of industry, agriculture, military, household appliances and other fields where the temperature is below 500 ° C. It can be used in various forms such as plate and tube. surface heating. Semiconductor electrothermal film technology, Europe, America, Japan and other countries have carried out theoretical research on it since the 1940s, but so far there has not been a relatively mature electrothermal film element that can really be applied to a certain product. Traditional heating materials. The usual electric heating device adopts metal resistance wire, which converts electric energy i...

AI Technical Summary

Problems solved by technology

[0006] Although the existing technology provides different types of semiconductor electrothermal films and their preparation methods to a certain extent, there are still the following technical problems: the stability of the electrothermal film is insufficient, the electrothermal film is not tightly bonded to the substrate, and it is easy to Defects such as cracking or falling off; difficulty in controlling sheet resistance; large leakage current

Images