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Foam framework enhanced polymer composite material and preparation method thereof

A technology of foam skeleton and composite materials, which is applied in the field of foam skeleton reinforced polymer-based composite materials and its preparation, which can solve the problems of thin graphene, difficulty in meeting the heat dissipation requirements of high-power electronic devices, and small volume.

Active Publication Date: 2016-07-06
CENT SOUTH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Chinese invention patent CN102786756A discloses a three-dimensional continuous graphene network composite material and its preparation method, but the thickness of graphene is thin (nanoscale) and the volume is small. Therefore, a single graphene network is difficult to meet high-power, low thermal expansion coefficient electronic devices Cooling requirements
In addition, the hardness of graphene is small, and it is difficult to effectively control the mechanical properties of composite materials such as hardness, strength, and thermal expansion coefficient with a single graphene network.

Method used

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  • Foam framework enhanced polymer composite material and preparation method thereof
  • Foam framework enhanced polymer composite material and preparation method thereof
  • Foam framework enhanced polymer composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment one: (diamond)

[0053] Foamed diamond skeleton reinforced epoxy resin composite material. In this example, copper foam with a pore size of 0.2 mm is used as the substrate. The foamed diamond reinforcement accounts for 20% of the volume fraction of the composite material. After cleaning, adopt magnetron sputtering technology to deposit a molybdenum film with a thickness of 50nm on the surface of the copper foam three-dimensional network skeleton as an intermediate transition layer according to step (2); then obtain a large amount of nanocrystals and microcrystals embedded in the middle of the mesh according to step (3). Foam skeleton substrate of diamond particles; step (4) adopts hot wire CVD to deposit diamond film, deposition process parameters: hot wire distance 6mm, substrate temperature 800°C, hot wire temperature 2200°C, deposition pressure 3KPa, CH 4 / H 2 The volume flow ratio is 1:99, and the thickness of the diamond film is controlled to be 160 μm,...

Embodiment 2

[0054] Embodiment two: (graphene wall)

[0055] Foamed graphene skeleton reinforced silicone rubber composite material, in this example, the porous ceramic alumina with a pore size of 2mm is used as the substrate, and the foamed graphene reinforcement accounts for 10% of the volume fraction of the composite material. The substrate is cleaned, and then a tungsten film with a thickness of 200nm is deposited on the surface of the foamed alumina three-dimensional network skeleton by magnetron sputtering according to step (2) as an intermediate transition layer; then a large amount of mosaic in the middle of the mesh is obtained according to step (3). The foam skeleton substrate of nanocrystalline and microcrystalline diamond particles; (4) use plasma-assisted chemical vapor deposition to grow graphene in situ on the substrate surface, apply plasma-assisted growth on the foam skeleton substrate during the deposition process, and Add a magnetic field at the bottom to confine the pla...

Embodiment 3

[0056] Embodiment three: (diamond coated with graphene)

[0057] Foamed diamond skeleton reinforced polymethyl methacrylate (PMMA) composite material. In this example, foamed nickel with a pore size of 0.3 mm is used as the substrate. The foamed diamond reinforcement accounts for 30% of the volume fraction of the composite material. First, according to step (1) The foamed copper three-dimensional network substrate is cleaned. First, the surface of the foamed nickel three-dimensional network substrate (aperture is 0.05 mm) is pretreated according to step (1), and then the foamed nickel three-dimensional network skeleton is deposited on the foamed nickel three-dimensional network by the method of evaporation according to step (2). Surface deposition thickness is the chromium film of 300nm as intermediate transition layer; Then according to step (3), obtain the foam skeleton substrate of a large amount of nanocrystals and microcrystalline diamond particles inlaid in the middle of th...

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Abstract

Disclosed are a foam framework enhanced polymer composite material and a preparation method thereof. The composite material is composed of a foam framework, a surface strengthening material and a base material, or strengthening particles are added. The foam framework can be foam metal, foam ceramic or foam carbon, the surface strengthening material is one of or a combination of high-heat-conductivity materials like a diamond film, a graphene film and a carbon nano tube, the base material is a polymer material, and the strengthening particles are high-heat-conductivity diamond powder, graphene, the carbon nano tube, graphene coated diamond microspheres, carbon nano tube coated diamond microspheres or high-heat-conductivity ceramic particles improving mechanical strength of the composite material and lowering heat balance coefficient. With the help of high heat conductivity, high electroconductivity and excellent mechanical excellent of the foam framework with the surface modified, heat conductivity, electroconductivity and mechanical strength of the composite material are greatly improved when compared with conventional composite materials, and the composite material is a novel multifunctional composite material having a lot of potential.

Description

technical field [0001] The invention discloses a foam skeleton reinforced polymer-based composite material and a preparation method thereof, belonging to the technical field of composite material preparation. Background technique [0002] As the frequency of electronic devices is getting higher and higher, the power is getting higher and higher, and the heat generation is getting higher and higher, which poses challenges to the performance of electronic packaging materials and electronic substrate materials. It is imperative to develop a new generation of high thermal conductivity packaging materials. Research work carried out. The current most effective method is to add high thermal conductivity inorganic fillers to the plastic packaging materials. Many foreign research teams have obtained plastic packaging materials with a thermal conductivity greater than 4W / m K. Compared with ceramics and metal materials, there are still considerable gaps. difference. Based on the exis...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L83/04C08L33/12C08K9/02C08K3/04C08K9/10C08K7/24
CPCC08K3/04C08K7/24C08K9/02C08K9/10C08K2201/011C08L63/00C08L83/04C08L33/12
Inventor 周科朝马莉魏秋平余志明
Owner CENT SOUTH UNIV
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