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Metal surface micro-etching liquid

A metal surface and micro-etching solution technology, applied in the field of metal surface micro-etching solution, can solve the problems of micro-etched workpieces such as durability, poor stability, uneven roughness of the etched metal surface, easy to scratch the substrate, etc., to achieve fast Treatment, low toxicity, and improved cleanliness

Inactive Publication Date: 2016-07-06
广州恩源化工科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adjust every two hours, the operation is cumbersome, it is easy to cause poor durability and stability of the micro-etched workpiece, uneven roughness of the etched metal surface, easy to scratch the substrate, and it is difficult to remove oxides on the metal surface and affect the surface of the workpiece Bonding force with other materials

Method used

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Effect test

Embodiment 1

[0023] The metal surface microetching liquid of the present invention is made up of the raw material of following mass percent: mass fraction is 50% dilute sulfuric acid 15%, hydrogen peroxide 15%, stabilizing agent 2%, surfactant 1%, antibacterial agent 0.2%, water 66.8%.

[0024] The mass concentration of described hydrogen peroxide is 50%.

[0025] The stabilizer is an inorganic ammonia stabilizer.

[0026] The surfactant is polyoxyethylene ether.

[0027] Described antibacterial agent is sodium benzoate.

[0028] The specific steps of the preparation method of the metal surface microetching solution of the present invention are as follows: first, weigh various raw materials according to the formula; Add stabilizer, surfactant, hydrogen peroxide, and antibacterial agent in order, stir evenly, filter, and detect that the specific gravity of the metal surface microetching solution is 1.20-1.30; the volume concentration of hydrogen peroxide is 10-15%; the mass of sulfuric a...

Embodiment 2

[0035] The metal surface microetching solution of the present invention is made up of the following raw materials in mass percentage: mass fraction is 50% dilute sulfuric acid 25%, hydrogen peroxide 10%, stabilizer 5%, surfactant 0.5%, antibacterial agent 0.2%, water 59.3%.

[0036] The mass concentration of described hydrogen peroxide is 50%.

[0037] The stabilizer is an inorganic ammonia stabilizer.

[0038] The surfactant is fatty acid glyceride.

[0039] Described antibacterial agent is sodium polychlorphenate.

[0040] The specific steps of the preparation method of the metal surface microetching solution of the present invention are as follows: first, weigh various raw materials according to the formula; Add stabilizer, surfactant, hydrogen peroxide, and antibacterial agent in order, stir evenly, filter, and detect that the specific gravity of the metal surface microetching solution is 1.20-1.30; the volume concentration of hydrogen peroxide is 10-15%; the mass of su...

Embodiment 3

[0047] The metal surface microetching solution of the present invention is made up of the following raw materials in mass percentage: mass fraction is 50% dilute sulfuric acid 20%, hydrogen peroxide 13%, stabilizer 4%, surfactant 0.8%, antibacterial agent 0.2%, water 62%.

[0048] The mass concentration of described hydrogen peroxide is 50%.

[0049] The stabilizer is an inorganic ammonia stabilizer.

[0050] The surfactant is polyoxyethylene ether.

[0051] Described antibacterial agent is sodium polychlorphenate.

[0052] The specific steps of the preparation method of the metal surface microetching solution of the present invention are as follows: first, weigh various raw materials according to the formula; Add stabilizer, surfactant, hydrogen peroxide, and antibacterial agent in order, stir evenly, filter, and detect that the specific gravity of the metal surface microetching solution is 1.20-1.30; the volume concentration of hydrogen peroxide is 10-15%; the mass of sul...

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Abstract

The invention discloses metal surface micro-etching liquid and belongs to the technical field of chemical engineering micro-etching liquid. The metal surface micro-etching liquid is prepared from, by mass, 15-25% of dilute sulphuric acid with the mass fraction being 50%, 10-15% of hydrogen peroxide, 2-5% of a stabilizing agent, 0.5-1% of surfactant, 0.2% of an anti-mildew agent and the balance water. The metal surface micro-etching liquid has a quite remarkable effect on solder resist preprocessing and surface chemical treatment of a printed circuit board, the copper face of the circuit board has uniform roughness and cleanness, the binding force between the copper face and an image layer and a pasted film is increased, toxicity is low, pollution is small, use is convenient, metal surface oxide can be fast processed, and metal surface cleanness is improved. The micro-etching liquid product is wide in application range and mainly used for metal surface oxide removing preprocessing and metal coloring preprocessing. The metal surface micro-etching liquid can also be used for super roughening, oxide removing processing, machining, metal deep machining, spraying and other the metallurgical industries of electronic circuit board copper faces.

Description

technical field [0001] The invention relates to the technical field of chemical microetching liquid, in particular to a metal surface microetching liquid. Background technique [0002] At present, the simple hydrogen peroxide, sulfuric acid and imidazole mixture used in the metal surface microetching solution, and the current PCB circuit board industry adopts the brushing method. The brush is adjusted according to the thickness of different boards to achieve good quality. Adjust every two hours, the operation is cumbersome, it is easy to cause poor durability and stability of the micro-etched workpiece, uneven roughness of the etched metal surface, easy to scratch the substrate, and it is difficult to remove oxides on the metal surface and affect the surface of the workpiece Bonding power with other materials. Contents of the invention [0003] The purpose of the invention is to provide a kind of metal (copper metal is the best) microetching solution for the deficiencies...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/16
CPCC23F1/18C23F1/16
Inventor 何卫星黎永海
Owner 广州恩源化工科技有限公司
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