Epoxy resin composition, and prepreg and laminated board with epoxy resin composition

A technology of epoxy resin and composition, applied in the field of epoxy resin composition, prepreg, laminate and printed circuit board, which can solve the problem of low water absorption, moisture and heat resistance and dielectric properties, glass transition temperature problems such as low and low dielectric constant, to achieve the effect of good processability, good solubility, and improved heat resistance

Active Publication Date: 2016-07-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the reaction process of active ester as a curing agent and epoxy resin, there is no secondary hydroxyl group, which has low water absorption, heat and humidity resistance and good dielectric properties, but the current active ester curing agent used as a single curing agent will cause the system lower glass transition temperature
[0004] CN102985485A-discloses the use of active ester cured epoxy resin with low dielectric constant, low dielectric loss tangent, and heat resistance, but with the development of high-density interconnection and high frequency and high speed, active ester cured epoxy resin vitrification The problem of transition temperature has been unable to meet the needs of high multi-layer
[0005] CN101967265 and CN102504201 have introduced cyanate, yet, cyanate resin often because of the existence of moisture and a small amount of impurity in the monomer, causes moisture and heat resistance poor, when making laminated board, easy to appear between sheet material interlayer Layered bubbling, which has become a constraint for the application of cyanate resin in the field of copper clad laminates

Method used

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  • Epoxy resin composition, and prepreg and laminated board with epoxy resin composition
  • Epoxy resin composition, and prepreg and laminated board with epoxy resin composition
  • Epoxy resin composition, and prepreg and laminated board with epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0052] Preparation Example 1: Synthesis of imide-modified active ester curing agent A1

[0053] P-aminophenol 55g and 150g methyl ethyl ketone are added in the round-bottomed flask that has stirrer, thermometer, nitrogen inlet pipe and reflux condenser, water-bath heating accelerates its dissolution, and concentration is 10% (percentage by weight) cyclobutane Add 500 g of butanone solution of tetraformic dianhydride dropwise to the reactor, control the dropping speed so that it is added dropwise within 1 hour, continue to react for 2 hours at 40° C., evaporate butanone, add 80 parts by weight of DMF and 20 parts by weight of toluene part of mixed solvent, add 0.25 parts by weight of catalyst p-toluenesulfonic acid (P-TSA), and react at 110°C for 8h. After the reaction is completed, wash with water, filter, recrystallize, and dry in vacuo to obtain Structure of intermediates of hydroxyl compounds.

[0054] Add 38g of the intermediate obtained in the previous step in the round-...

preparation example 2

[0057] Preparation Example 2: Synthesis of imide-modified active ester curing agent A2

[0058] 8-amino-2-naphthol 80g and 250g butanone are added in the round-bottomed flask that has stirrer, thermometer, nitrogen inlet pipe and reflux condenser, and water-bath heating accelerates its dissolving, and concentration is 10% (percentage by weight) ) of butanone solution of cyclobutanetetracarboxylic dianhydride 500g was added dropwise to the reactor, the rate of addition was well controlled so that it was added dropwise within 1h, and the reaction was continued for 2h at 40°C, the butanone was distilled off, and DMF80 was added 20 parts by weight of toluene and 0.25 parts by weight of catalyst p-toluenesulfonic acid (P-TSA), reacted at 110°C for 8 hours, after the reaction was completed, washed with water, filtered, recrystallized, and dried in vacuo to obtain benzene-containing Intermediates for hydroxyl compounds with ring and imide structures.

[0059] Add 48g of the intermed...

preparation example 3

[0062] Preparation Example 3: Synthesis of imide-modified active ester curing agent A3

[0063] 8-amino-2-naphthol 80g and 250g butanone are added in the round-bottomed flask that has stirrer, thermometer, nitrogen inlet pipe and reflux condenser, and water-bath heating accelerates its dissolving, and concentration is 10% (percentage by weight) 550 g of butanone solution of pyromellitic dianhydride) was added dropwise to the reactor, and the rate of addition was well controlled so that it was added dropwise within 1 hour. The reaction was continued for 2 hours at 40° C., the butanone was distilled off, and 80 parts by weight of DMF was added. and a mixed solvent of 20 parts by weight of toluene, add 0.25 parts by weight of catalyst p-toluenesulfonic acid (P-TSA), react at 110°C for 8 hours, after the reaction is completed, wash with water, filter, recrystallize, and dry in vacuo to obtain Intermediates of hydroxyl compounds with imide structure.

[0064] Add 48g of the interm...

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Abstract

The invention relates to an epoxy resin composition, and a prepreg and a laminated board with the epoxy resin composition. The epoxy resin composition comprises imide-modified active ester and epoxy resin. The imide-modified active ester resin composition has good process workability and solubility. With the composition, the advantages of no secondary hydroxyl generation and intrinsic good dielectric properties of active ester resin cured epoxy resin are maintained. Also, imide group with better heat resistance is introduced into the main chain, such that the heat resistance of existing active ester is improved. The prepreg and laminated board prepared with the composition has the advantages of high glass transition temperature, low dielectric constant, low dielectric loss value and low water absorption.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to an epoxy resin composition and prepregs, laminates and printed circuit boards using the same. Background technique [0002] With the development of electronic components in the direction of small, light, thin, high performance, and multifunctional, it brings high frequency and high speed signal transmission. This requires that the dielectric constant and dielectric loss of electronic materials are relatively low, which are related to the structure of the material, and low dielectric constant and low dielectric loss resins generally have in structure: large free volume, low polarizability , Low water absorption, low dielectric constant structure and so on. [0003] During the reaction process of active ester as a curing agent and epoxy resin, there is no secondary hydroxyl group, which has low water absorption, heat and humidity resistance and good diele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08G59/50B32B27/04B32B27/38B32B15/092H05K1/03
CPCB32B15/092B32B27/04B32B27/38C08G59/50C08L63/04H05K1/03
Inventor 何烈相曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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