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High-heat-conductivity heat-radiating nano composite coating

A nano-composite and composite coating technology, applied in the coating and other directions, to achieve the effects of excellent adhesion performance, increased heat dissipation rate, and improved heat dissipation and cooling effect

Inactive Publication Date: 2016-07-20
SUZHOU XIANGYUAN SPEICAL FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is to provide a nano-composite coating with high thermal conductivity and heat dissipation, which can solve the above-mentioned problems existing in the existing heat dissipation coatings

Method used

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Examples

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Comparison scheme
Effect test

Embodiment 1

[0016] A composite coating with high thermal conductivity and heat dissipation, comprising the following components in parts by weight: 50 parts of nano-alumina sol, 30 parts of high-density polyethylene, 1 part of carbon nanotube, 5 parts of titanium phosphate, 10 parts of composite filler, and 2 parts of polyvinylpyrrolidone , 5 parts of methyl methacrylate, 2 parts of ethyl acetate, 10 parts of isopropanol, 5 parts of acrylate emulsion, 3 parts of nano-copper powder with a particle diameter of 10-50 nm, and 1 part of triethanolamine, wherein the carbon The nanotube is a single-layer structure with a diameter of 10-13nm and a length of 5-10um.

[0017] The heat-dissipating filler includes the following components by weight: 5 parts of aluminum nitride, 4 parts of silicon carbide, 10 parts of nano-calcium carbonate, 13 parts of pyrophyllite, 0.5 parts of polybutyl acrylate and 5 parts of silane coupling agent. The preparation method is as follows: : Calcining the above-mentio...

Embodiment 2

[0019] A composite coating with high thermal conductivity and heat dissipation, comprising the following components in parts by weight: 60 parts of nano-alumina sol, 40 parts of high-density polyethylene, 3 parts of carbon nanotubes, 10 parts of titanium phosphate, 15 parts of composite filler, and 3 parts of polyvinylpyrrolidone , 9 parts of methyl methacrylate, 5 parts of ethyl acetate, 15 parts of isopropanol, 8 parts of acrylate emulsion, 5 parts of nano-copper powder with a particle size of 10-50 nm, and 3 parts of triethanolamine. Wherein, the carbon nanotube is a single-layer structure with a diameter of 10-13nm and a length of 5-10um.

[0020] The heat-dissipating filler includes the following components in parts by weight: 7 parts of aluminum nitride, 6 parts of silicon carbide, 13 parts of nano-calcium carbonate, 25 parts of pyrophyllite, 1.5 parts of polybutyl acrylate and 10 parts of silane coupling agent. The preparation method is as follows: : Calcining the above...

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Abstract

The invention discloses a high-heat-conductivity heat-radiating nano composite coating which comprises, by weight, 50-60 parts of nano alumina sol, 30-40 parts of high-density polyethylene, 1-3 parts of carbon nano tube, 5-10 parts of titanium phosphate, 10-15 parts of composite filler, 2-3 parts of polyvinylpyrrolidone, 5-9 parts of methyl methacrylate, 2-5 parts of ethyl acetate, 10-15 parts of isopropanol, 5-8 parts of acrylate emulsion, 3-5 parts of nano copper powder and 1-3 parts of triethanolamine. Through reasonable formulation designing, the composite coating has excellent adhesiveness and coating hardness, is efficient in heat radiating after being coated on the surface of an electronic device and is conducive to guiding out heat generated by the electronic device timely and efficiently, so that heat radiating rate is increased, cooling effect is improved, and the composite coating has excellent comprehensive performance and wide market prospect.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a nano-composite coating with high thermal conductivity and heat dissipation. Background technique [0002] With the development of the electronics industry, electronic components continue to develop in the direction of miniaturization and high-speed operation, and the heat generated by components during use is gradually increasing. Therefore, improving or increasing the heat dissipation of electronic components has become a limitation for the development of the electronics industry. One of the technical bottlenecks, the excellent heat dissipation effect is a powerful guarantee to ensure the efficient and accurate operation of electronic products. [0003] Traditional heat dissipation methods include stacking heat sinks on the back of heating electronic components and installing electronic fans, but both methods will greatly increase the volume of electronic products, which cannot meet th...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D4/06C09D7/12
CPCC09D4/06C09D7/61C09D7/62C09D7/63C08F255/02C08F265/06
Inventor 周建
Owner SUZHOU XIANGYUAN SPEICAL FINE CHEM
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