Method for the manufacture of solar cells
A technology of solar cells and wafers, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as wafer cracks
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[0060] General: Simple unstructured silicon wafers of 200 mm were etched in a microwave plasma etcher produced by Secon Semiconductor Equipment GmbH in Austria. The wafers were weighed before and after etching, and the difference in weight indicated the etch rate. In the absence of a water-cooled chuck, limit the etching time to a few 10 min intervals of 3 min for cooling. Example 1 and Example 4 are comparative examples.
[0061] 1. Test results
[0062]
[0063] Ar is used to improve the homogeneity of the plasma over the length of the microwave rod. It has no effect on Si etching reaction. Y / N indicates it is turned on or turned off.
[0064] Use the same MFC (mass flow controller) gas flow for SF 6 and COF 2 . The MFC for SF 6 calibration. to COF 2 A conversion factor of 2 (0.544 / 0.27) has been used.
[0065] These experiments show that carbonyl fluoride can be successfully used to etch the surface of silicon wafers, the etching time can be shortened and stil...
example 2
[0066] Example 2: Silicon Wafer Processing to Make Cracks Harmless
[0067]A boron-doped silicon wafer sawn from a polysilicon block had cracks at the edges. The wafer is transferred into a plasma chamber. The chamber was evacuated and carbonyl fluoride was introduced into the chamber to reach a pressure of 0.4 mbar and the plasma was started. During the plasma treatment, the initial sharp-edged crack is transformed into a keyhole-like structure that will not grow; in this way, the wafer is no longer useless, but can be used for further processing to obtain a Solar cells (doping with phosphorus, attaching electrodes, etc.).
example 3
[0068] Example 3: Removal of a P-containing glassy coating
[0069] A silicon wafer doped with boron and POCl 3 Contact and heat between 960°C and 1000°C to convert phosphorus compounds into P 2 o 5 . As a side reaction, a phosphorous-silica glassy coating is formed. To remove the glassy coating, the wafer was positioned in a plasma processing chamber, the chamber was evacuated, and neat carbonyl fluoride was introduced into the reactor until a pressure of 0.4 mbar was reached. Then, start the plasma. Once the glassy coating is etched away, the process is stopped.
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