Substrate and its manufacturing method
A technology for substrates and substrates, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., and can solve problems such as the formation of holes or cracks, and the thickness of copper on the surface of the holes.
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Examples
example 1
[0102] In this example, a single-sided rigid copper-clad laminate (CCL) is manufactured by using epoxy resin fiberglass cloth as a base material, specifically using FR-4 or FR-5 base material among the epoxy glass fiber cloth base materials.
[0103] First, wipe the upper surface of the FR-4 substrate lightly with gauze soaked in alcohol to remove the dirt attached to it. Next, the sealing agent is coated on the upper surface of the substrate for surface deposition treatment, wherein the sealing agent includes a filler composed of a mixed solution of aluminum oxide and silica colloid, aluminum hydrogen phosphate or diphosphate The adhesive composed of aluminum hydrogen and the crosslinking agent of copper oxide. Afterwards, the upper surface of the substrate is dried to remove moisture therein.
[0104] Next, put the dried FR-4 substrate into the ion implantation equipment through the discharge mechanism, and vacuumize to 2×10 -3 Pa, using Ni as the target material, selectin...
example 2
[0108] This example uses a ceramic-based material as a substrate to fabricate a single-sided rigid copper clad laminate (CCL), specifically an aluminum oxide ceramic plate as a substrate.
[0109] First, lightly wipe the upper surface of the aluminum oxide ceramic plate substrate with gauze soaked in alcohol to remove the dirt attached to it. Next, use laser drilling technology to drill several through holes with a diameter of about 20 μm and several blind holes with a diameter of about 20 μm and a depth of about 30 μm, and then use ultrasonic technology to thoroughly clean the surface of the substrate And the hole wall of the hole to remove the remaining drill cuttings and other dirt.
[0110] Next, put the cleaned substrate into the radio frequency sputtering device through the discharging mechanism. In this radio frequency sputtering equipment, Al2O3 is used as the target material of radio frequency sputtering, and in the sputtering chamber of argon atmosphere, the vacuum ...
example 3
[0114] This example uses a glass-based material as the substrate to fabricate a double-sided rigid copper-clad laminate (CCL), specifically an inorganic glass substrate whose composition may include silicon dioxide, aluminum oxide, sodium silicate or borosilicate etc.
[0115] First, lightly wipe the two surfaces of the glass substrate with gauze soaked in alcohol to remove the dirt attached to it. Next, put the cleaned substrate into the radio frequency sputtering device through the discharging mechanism. In the radio frequency sputtering equipment, silicon dioxide is used as the target material of radio frequency sputtering, and in the sputtering chamber of the argon atmosphere, the vacuum is evacuated to 8×10 -2 Pa, plus alternating current with a frequency of 13.56 MHz and a voltage of 3.5 kV as an excitation source, a layer of silicon dioxide is formed on both surfaces of the substrate by radio frequency sputtering deposition, and the deposition time is set to 30 minutes...
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