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Automotive Electronic Components

A technology for electronic components and electronic components, applied in the direction of electrical components, printed circuit components, electrical connection printed components, etc., can solve the problems of recording, no substrate connection terminal material, etc., to achieve suppression of resistance increase, excellent sliding characteristics, and miniaturization low effect

Active Publication Date: 2019-02-26
HITACHI ASTEMO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

An example of Ni / Au plating on phosphor bronze is described as the material of the connector terminal, but there is no description of the material of the board connection terminal

Method used

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  • Automotive Electronic Components
  • Automotive Electronic Components
  • Automotive Electronic Components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] In this embodiment, an example of electronic components installed in an engine compartment of an automobile to properly control the driving of the engine will be described.

[0038] figure 1This is an example of a block diagram of an automotive electronic component using a metal heat sink with a card edge connector structure. In the figure, electronic components 6, 7, 8, and 9 are mounted by solder bonding on a circuit board 3 composed of an organic insulating substrate 1 and Cu wiring 2, and are integrally formed between the electronic component mounting area and the connection terminal formation area. The insulating member 16 is formed. In addition, at the end of the substrate, a connection terminal 5 in which Cu wiring 2' is coated with Sn-based solder 4 containing an Ag-Sn intermetallic compound is formed. The Sn-based solder is provided by a dipping method in which an electronic component is mounted on a circuit board to form an insulating component, and then imm...

Embodiment 2

[0045] In this embodiment, an example of reliability evaluation results when the surface material of the connector terminal, the surface material and film thickness of the connection terminal, and the material of the protective coating film are changed will be described.

[0046] Figure 7 Reliability evaluation results when the surface material of the connector terminal, the surface material of the connection terminal, and the material of the protective coating film are changed are shown. When the surface of the connector terminal is Sn, reliability cannot be obtained at all when the surface material of the connection terminal is Cu, Ni / Au, Sn plated, Sn-Cu solder, and no protective coating. Reliability cannot be obtained even if fluorine-based oil as a protective coating agent is applied to easily oxidized Cu. When using Sn-3Ag-Cu solder that forms an Ag-Sn intermetallic compound, although the reliability is not enough without a protective coating, when a high-viscosity sil...

Embodiment 3

[0050] In this embodiment, an example of a resin-cased electronic component installed in an engine compartment of an automobile and appropriately controlling the driving of the engine will be described.

[0051] Figure 9 This is an example of a construction diagram of a resin case type automotive electronic component with a card edge connector structure. In the figure, electronic components 69, 70, 71, and 72 are mounted by solder bonding on a circuit board composed of an organic insulating substrate 61 and Cu wiring 62, and are integrally formed between the electronic component mounting region and the connection terminal forming region. An insulating member 73 is provided. Furthermore, connection terminals 67, 68 in which Cu wirings 62', 64 are coated with Sn-based solder 65, 66 containing Ag-Sn intermetallic compound are formed at the ends of the substrate. The Sn-based solder is provided by a dipping method in which an electronic component is mounted on a circuit board t...

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Abstract

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

Description

technical field [0001] The present invention relates to an in-vehicle electronic unit including a circuit board on which electronic components are mounted, a protective member such as a case for accommodating the circuit board and protecting it from the surrounding environment, and a mating connector mechanism for connecting the circuit board to an external circuit. Background technique [0002] The background art of this technical field is Japanese Unexamined-Japanese-Patent No. 2013-143202 (patent document 1). This gazette describes a structure including a circuit board on which electronic components are mounted and a case for accommodating the circuit board. The connector storage space of the edge connector; and the storage space of the circuit substrate, the end of the circuit substrate formed with the substrate connection terminal protrudes from the substrate storage space to the connector storage space, and is inserted into the substrate insertion space of the card edg...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/03H05K1/09H05K1/11
CPCH05K5/0069B23K1/0016B23K1/08B23K35/0222B23K35/0244B23K35/226B23K35/26B23K35/262H05K1/117H05K3/282H05K3/3405H05K3/3463H05K5/003H05K5/0034H05K2201/015H05K2201/10189H05K2201/2045H05K2203/122
Inventor 梶原良一鸭志田胜石井利昭
Owner HITACHI ASTEMO LTD
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