Method for inhibiting light degradation of p-type PERC solar cell
A technology of solar cells and light-induced attenuation, which is applied in the direction of circuits, photovoltaic power generation, electrical components, etc., can solve the problems that the technology cannot be popularized and implemented, and achieve the effect of solving the problem of light-induced attenuation, good compatibility, and suppressing light-induced attenuation
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Embodiment 1
[0015] The p-type PERC solar cell combined with the features of the present invention can be realized through the following specific technical solutions.
[0016] (1) Texture cleaning of p-type silicon wafers.
[0017] (2) A silicon oxide layer heavily doped with boron is deposited on the back of the silicon wafer by PECVD method.
[0018] (3) The phosphorus oxychloride on the front side of the silicon wafer is diffused on one side, and the boron diffusion on the back side is completed at the same time.
[0019] (4) Remove the oxide layer on the front and back of the silicon wafer, and perform edge cutting and other treatments.
[0020] (5) Preparation of aluminum oxide and silicon nitride layers on the back of the silicon wafer.
[0021] (6) Preparation of silicon nitride anti-reflection layer on the front side of the silicon wafer.
[0022] (7) Laser opening on the back of the silicon wafer, aluminum paste printing and drying.
[0023] (8) Print and dry the grid lines on...
Embodiment 2
[0027] The p-type PERC solar cell combined with the features of the present invention can be realized through the following specific technical solutions.
[0028] (1) Texture cleaning of p-type silicon wafers.
[0029] (2) A silicon oxide layer heavily doped with boron is deposited on the back of the silicon wafer by magnetron sputtering.
[0030] (3) The phosphorus oxychloride on the front side of the silicon wafer is diffused on one side, and the boron diffusion on the back side is completed at the same time.
[0031] (4) Remove the oxide layer on the front and back of the silicon wafer, and perform edge cutting and other treatments.
[0032] (5) Preparation of aluminum oxide and silicon nitride layers on the back of the silicon wafer.
[0033] (6) Preparation of silicon nitride anti-reflection layer on the front side of the silicon wafer.
[0034] (7) Laser opening on the back of the silicon wafer, aluminum paste printing and drying.
[0035] (8) Print and dry the grid ...
Embodiment 3
[0039] The p-type PERC solar cell combined with the features of the present invention can be realized through the following specific technical solutions.
[0040] (1) Texture cleaning of p-type silicon wafers.
[0041] (2) Single-sided diffusion of phosphorus oxychloride on the front side of the silicon wafer.
[0042] (3) The phosphosilicate glass layer is removed from the silicon wafer, and the edges are etched and the back is polished.
[0043] (4) Boron ion implantation on the back side, and high temperature annealing to restore the crystal lattice, and re-cleaning of the silicon wafer.
[0044] (5) Preparation of aluminum oxide and silicon nitride layers on the back of the silicon wafer.
[0045] (6) Preparation of silicon nitride anti-reflection layer on the front side of the silicon wafer.
[0046] (7) Laser opening on the back of the silicon wafer, aluminum paste printing and drying.
[0047] (8) Print and dry the grid lines on the front side of the silicon wafer. ...
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