Preparation method for silver-plating copper powder

A technology of silver-plated copper powder and copper powder, which is applied in liquid chemical plating, metal processing equipment, coating, etc., can solve problems such as toxicity and human injury, and achieve broad application prospects, high conversion rate, and simple preparation process Effect

Inactive Publication Date: 2016-09-28
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent [CN104830247A] uses formaldehyde as a reducing agent to prepare flaky silver-plated copper powder, because formaldehyde is toxic and has certain harm to the human body

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] (1) Take 200-mesh spherical copper powder, add 5% dilute sulfuric acid to remove impurities such as the oxide layer on the surface of the copper powder, and wash with deionized water until neutral; use 10g / L SnCl 2 Sensitize copper powder with 20ml / L hydrochloric acid for 10min, wash and filter to neutral; then activate copper powder with 0.5g / L silver ammonia solution for 10min, wash and filter to neutral, and vacuum Filter the filter bottle for use;

[0019] (2) Dissolve sodium potassium tartrate (70g / L) and glucose (40g / L) in deionized water to prepare solution A. Dissolve silver nitrate in deionized water to a concentration of (10g / L), add ammonia water dropwise until the precipitate disappears, and prepare solution B. Add the pretreated copper powder into solution A and stir with a magnetic stirrer; then slowly add solution B and keep stirring for 40 minutes at a speed of 400 r / min, during which the pH of the plating solution is adjusted to 10 with NaOH. After th...

Embodiment 2

[0023] (1) Take 200 mesh spherical copper powder, add 5% dilute sulfuric acid to remove impurities such as the oxide layer on the surface of the copper powder, wash with deionized water until neutral; use 15g / L SnCl 2 Sensitize copper powder with 30ml / L hydrochloric acid for 10min, wash and filter to neutral; then activate copper powder with 1g / L silver ammonia solution for 10min, wash and filter to neutral, and vacuum filter bottle for use;

[0024] (2) Dissolve sodium potassium tartrate (90g / L) and glucose (20g / L) in deionized water to prepare solution A. Dissolve silver nitrate in deionized water to a concentration of (15g / L), add ammonia water dropwise until the precipitate disappears, and prepare solution B. Add the pretreated copper powder into solution A and stir with a magnetic stirrer; then slowly add solution B and keep stirring for 40 minutes at a speed of 400 r / min, during which the pH of the plating solution is adjusted to 10 with NaOH. After the reaction, the c...

Embodiment 3

[0028] (1) Take 200 mesh spherical copper powder, add 5% dilute sulfuric acid to remove impurities such as the oxide layer on the surface of the copper powder, wash with deionized water until neutral; use 20g / L SnCl 2 Sensitize copper powder with 40ml / L hydrochloric acid for 10 minutes, wash and filter to neutral; then activate copper powder with 2g / L silver ammonia solution for 10 minutes, wash and filter to neutral, and vacuum filter bottle for use;

[0029] (2) Dissolve sodium potassium tartrate (90g / L) and glucose (20g / L) in deionized water to prepare solution A. Dissolve silver nitrate in deionized water to a concentration of (20g / L), add ammonia water dropwise until the precipitate disappears, and prepare solution B. Add the pretreated copper powder to solution A and stir with a magnetic stirrer; then slowly add solution B and continue stirring for 40 minutes at a speed of 400 r / min, during which the pH of the plating solution is adjusted to 10 with NaOH. After the rea...

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Abstract

The invention relates to a novel preparation method for silver-plating copper powder, belonging to the technical field of surface treatment. The novel preparation method comprises three technological steps of pretreatment, surface silver plating and posttreatment. Firstly, copper powder is washed with dilute sulphuric acid so as to remove an oxide layer on the surface of copper, and then the copper powder is washed to be neutral with distilled water; then the copper powder is subjected to sensitization and activating treatment with stannous chloride and a silver-ammonia solution, and then the copper powder is washed to be neutral with distilled water; a silver nitrate solution is added into ammonium hydroxide to prepare a silver-ammonia solution; then the silver-ammonia solution and a reducing agent are added into the copper powder, and then magnetic stirring is performed so that reaction is performed uniformly; after the reaction is finished, the copper powder is washed with water, filtered and dried; and then a ball milling method is adopted, so that combination of copper and silver interfaces is closer, and the plating layer is more smooth. Through the novel formula and technological improvement, the surface of the copper powder is coated with a uniform and compact silver layer; the inoxidizability and electrical conductivity of the copper powder are improved; and the application range of the copper powder is expanded. The method provided by the invention is simple in technology and easy for operation; and the silver-plating copper powder which is uniform in plating layer, high in inoxidizability and controllable in plating layer thickness can be obtained.

Description

technical field [0001] The invention belongs to the technical field of surface treatment and relates to a preparation method of silver-plated copper powder. Background technique [0002] Micron-sized copper powder has many excellent physical properties, and is widely used in the preparation of electrode materials, conductive coatings and other materials. However, because the micron-sized copper powder has a large specific surface area and high surface Gibbs free energy, it is very easy to oxidize in the air to form cuprous oxide and copper oxide, thus losing its original excellent physical properties. Silver powder is the most widely used precious metal powder in the electronics industry. Silver powder has good electrical and thermal conductivity, but it is expensive and has disadvantages such as easy migration under direct current. If the surface treatment technology is used to coat a layer of metallic silver on the surface of the copper powder, the modified copper powder ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/18C23C18/44B22F9/04B22F9/24
CPCC23C18/1831C23C18/44B22F9/04B22F9/24B22F2009/043B22F1/17
Inventor 刘焕超耿浩然肖振代文燕
Owner UNIV OF JINAN
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