Method and composition for high-speed chemically depositing thick silver

A silver composition and composition technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as low luminous efficiency, complicated process, hazards to operators and the environment, and achieve good heat dissipation effect , process stability, environment-friendly effect

Active Publication Date: 2016-10-05
广东德瑞勤科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In terms of chemical immersion silver, there are many related patent documents at home and abroad to report, such as domestic patents: CN1676673, CN100564594C, foreign patents: PatentNo: 7479305; 5733599; 5173130; WO2004007798A1; US20060165909; It uses the replacement reaction of silver and copper itself, that is, when the copper on the surface is replaced by silver, the reaction stops, so the thickness cannot meet the requirements of "bonding" for silver thickness in actual production (silver thickness greater than 1 micron), and cannot Satisfy the application in the LED field that is gradually emerging
[0004] Looking at domestic and foreign patents, the application of surface welding technology can already meet the market demand. However, with the development of green lighting and the rise of the LED market, the demand for "bonding" has increased rapidly. At present, the "bonding" process mainly includes Two types: the first one, immersion gold is generally used as the "bonding" process, but there are the following obvious defects: 1. Immersion gold uses highly toxic cyanide as a raw material, and its use and waste water discharge have caused great harm to people and the natural environment Destruction; 2. The yellow surface of the gold surface has a great influence on the illuminance, resulting in low luminous efficiency; 3. Using gold as a BONGING carrier is expensive
[0005] The second is to use the electro-silver "bonding" process. In actual production, the thickness of the silver layer needs to be more than 1 micron to meet the production requirements of "bonding". Both are between 0.1-0.5 microns, which cannot meet the "bonding" requirements
Therefore, in the field of "bonding" of LEDs, the traditional process of using bracket electric silver, and then soldering the bracket to the circuit board, that is, using electric silver "bonding" technology, but its obvious disadvantages are; 1. Still Using highly toxic cyanide as a raw material will cause harm to operators and the environment; 2. One more bracket manufacturing process and re-welding process, the process is complicated and the cost increases; 3. The heat dissipation effect of the bracket process is poor

Method used

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  • Method and composition for high-speed chemically depositing thick silver
  • Method and composition for high-speed chemically depositing thick silver
  • Method and composition for high-speed chemically depositing thick silver

Examples

Experimental program
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Effect test

Embodiment 1

[0017] Embodiment one: preparation is used for the chemical thickening silver composition of high-speed chemical thickening silver method, preparation steps are as follows: a, under normal temperature, add 0.5-20g silver ion compound to the pure water of 500ml to form silver ion solution, silver ion compound Select one of silver nitrate, silver sulfate or silver carbonate; b, add 0.5-50 mg of photoinhibitor to the silver ion solution in the above step a, stir evenly and add a silver ion reaction accelerator according to the molar ratio of 1:1 in the solution, Stir evenly; choose one of hydroquinone, catechol, resorcinol, 2,4-dimethylphenol or a compound of several of them for photoinhibitor; choose phenolsulfonic acid or p-toluene for accelerator Compounding of one or both of the sulfonic acids; c, adding an inorganic acid having the same functional group as the silver ion compound in the step a to the mixed solution of the above step b, and adjusting its acid value to 0.2-1N; ...

Embodiment 2

[0021] Embodiment 2: This embodiment is the same as the steps of chemically precipitating silver in Example 1, except that the composition used for chemically precipitating silver is different.

[0022] Prepare the chemical heavy silver composition for the high-speed chemical heavy silver precipitation method, the preparation steps are as follows: a, at normal temperature, add 0.5-20g silver ion compound to 500ml of purified water to form a silver ion solution, and the silver ion compound is selected from methyl sulfonate one of silver acid, silver benzoate, silver p-toluenesulfonate, silver lactate or silver acetate; b, add 0.5-50mg of photoinhibitor to the silver ion solution in the above step a, and stir it according to the solution 1:1 Add silver ion reaction accelerator in molar ratio and stir evenly; photoinhibitor chooses one of hydroquinone, catechol, resorcinol, 2,4-dimethylphenol or a combination of several of them; The accelerator is selected from one of phenolsulfo...

Embodiment 3

[0025] Embodiment 3: This embodiment is the same as the steps of chemically precipitating silver in Example 1, except that the composition used for chemically precipitating silver is different.

[0026] Preparation of the chemical heavy silver composition for the high-speed chemical heavy silver precipitation method, the preparation steps are as follows: a, at normal temperature, add 0.5-20g silver ion compound to 500ml of purified water to form a silver ion solution, and the silver ion compound is selected from silver nitrate, Two or all of silver sulfate or silver carbonate are compounded; b, add 0.5-50 mg of photoinhibitor to the silver ion solution in the above step a, stir evenly and add a silver ion reaction accelerator according to the molar ratio of 1:1 in the solution, Stir evenly; choose one of hydroquinone, catechol, resorcinol, 2,4-dimethylphenol or a compound of several of them for photoinhibitor; choose phenolsulfonic acid or p-toluene for accelerator Compounding...

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PUM

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Abstract

The invention discloses a method and a composition for high-speed chemically depositing thick silver. The method includes the steps of acidic chemical oil removal, three steps of water washing, chemical micro-etching, three steps of water washing, pre-impregnation, preparation of the chemical silver deposition composition, chemical silver deposition, three steps of water washing, air drying, inspection on appearance, and package. The method can deposit a silver layer with the thickness being at least more than 1 [mu]m on the surface of a copper substrate within 1-3 min, satisfies a bonding requirement, can replace the gold and silver plating technologies using highly toxic cyanides in the prior art, is environment-friendly and is stable, and is simple in operations and low in cost. A product with the silver deposited, compared with a product with the gold deposited, has good luminance, and compared with framework connection of electronic-plated silver, the silver plate layer in the invention has good heat dissipation effect.

Description

technical field [0001] The invention relates to a method and composition for high-speed chemical deposition of silver. Background technique [0002] Chemical immersion silver has been used in the 1980s, but it almost disappeared due to easy discoloration and Giavanni phenomenon. In recent years, due to the needs of environmental protection, the hot air leveling process tends to be eliminated, and immersion silver has been re-emerged. Improvement, the current immersion silver process has many advantages such as good flatness, excellent welding performance, simple process, easy control, short process, and simple equipment, and has gradually become a new generation of mainstream surface treatment process. [0003] In terms of chemical immersion silver, there are many related patent documents at home and abroad to report, such as domestic patents: CN1676673, CN100564594C, foreign patents: PatentNo: 7479305; 5733599; 5173130; WO2004007798A1; US20060165909; It uses the replacemen...

Claims

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Application Information

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IPC IPC(8): C23C18/42
Inventor 吴昌根
Owner 广东德瑞勤科技有限公司
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