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Polyimide resin, resin composition using same, and laminated film

A technology of polyimide resin and resin composition, applied in the direction of synthetic resin layered products, film/sheet adhesives, applications, etc., can solve the problems of small molecular weight, high processing temperature, and inability to fully apply, etc. Achieve good adhesion and excellent heat resistance

Active Publication Date: 2018-08-28
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although polyimide resins have the problems of high processing temperature and difficult handling, silicone-based polyimide resins copolymerized with siloxane-based diamines (such as , see patent documents 1, 2)
However, the above-mentioned siloxane-based diamines can be used as adhesives due to the low molecular weight or small content of the siloxane-based diamines to be copolymerized, but they are not sufficiently suitable for applications requiring pressure at room temperature. Contact adhesive use

Method used

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  • Polyimide resin, resin composition using same, and laminated film
  • Polyimide resin, resin composition using same, and laminated film
  • Polyimide resin, resin composition using same, and laminated film

Examples

Experimental program
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Embodiment

[0076] Hereinafter, although an Example is given and this invention is demonstrated, this invention is not limited to these Examples. Evaluation methods for glass transition temperature, mass loss rate, adhesive force, and adhesive uniformity will be described.

[0077] (1) Determination of glass transition temperature

[0078]The polyamic acid resin solutions (PA-1-22) described in the following production examples 1 to 22, and the binder resin solutions in production examples 23 to 29 were applied to the glossiness of the electrolytic copper foil with a thickness of 18 μm using a bar coater. On the surface, make the thickness 20 μm, then dry at 80°C for 10 minutes, dry at 150°C for 10 minutes, and then heat-treat at 250°C for 10 minutes in a nitrogen atmosphere to convert it into polyimide, and obtain a laminated adhesive Resin copper foil. Next, the entire surface of the obtained copper foil laminated with the binder resin was etched with a ferric chloride solution to obt...

manufacture example 1

[0114] Production example 1 (polymerization of polyamic acid solution)

[0115] In the reaction kettle equipped with a thermometer, a dry nitrogen inlet, a heating and cooling device utilizing hot water and cooling water, and a stirring device, 688g (0.8mol) APPS1, 20g (0.1mol) 44DAE, 25.8g ( After dissolving 0.1 mol) BAP and 1566 g of CCH, 310.2 g (1 mol) of ODPA was added and reacted at room temperature for 1 hour, then at 60° C. for 5 hours to obtain 40% by mass of polyamic acid resin solution (PA1).

manufacture example 2～22

[0116] Production Examples 2-22 (Polymerization of Polyamic Acid Solution)

[0117] As shown in Table 1 and Table 2, the types and loadings of acid dianhydride and diamine were changed, except that, the same operation as that of Manufacturing Example 1 was carried out to obtain a 40% by mass polyamic acid resin solution (PA2- PA22).

[0118] [Table 1] Upper part: Composition ratio (mol%) / Lower part: Charged amount (g)

[0119]

[0120] [Table 2] Upper part: Composition ratio (mol%) / Lower part: Charged amount (g)

[0121]

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Abstract

The present invention provides a polyimide resin that has high heat resistance and can be uniformly pre-bonded without voids or the like even in a large area, a resin composition and a laminated film using the polyimide resin. This invention is a polyimide resin which has an acid anhydride residue and a diamine residue at least, and contains the residue of polysiloxane type diamine in 60 mol% or more of all diamine residues.

Description

technical field [0001] This invention relates to heat resistant adhesives. More specifically, it relates to a heat-resistant adhesive that does not generate volatile components due to the decomposition of the adhesive even in a high-temperature environment, has excellent adhesiveness, and can be used as a process material in the manufacture of electronic components. sex adhesive. Background technique [0002] Conventionally, rubber-based adhesives, such as natural rubber and styrene-butadiene rubber, have been commonly used as adhesives. However, since high heat resistance is required for process materials in the manufacture of electronic components, etc., they are gradually being used. Acrylic resin, silicone (silicon) resin. [0003] Acrylic resins are often used as optical materials for flat panel displays such as liquid crystal displays due to their high transparency. However, when left for a long time at temperatures above 200°C, and even above 250°C, the acrylic resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10B32B27/34C08K5/06C08L79/08C09J7/30C09J11/06C09J179/08H01L23/29H01L23/31C09J7/29
CPCC09J179/08H01L23/293B32B7/12B32B27/281B32B2307/304B32B2307/306B32B2457/00C08G73/1039C08G73/1046C08G73/106C08G73/1082C08G77/455H01L2924/0002C09J7/29C08L61/28B32B27/00H01L2924/00C08K5/06C08J5/18C08J7/00B32B7/06B32B2457/14C08G2170/00C09J2203/326H01L21/304H01L21/6836
Inventor 富川真佐夫渡边拓生李忠善
Owner TORAY IND INC
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