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Method for preparing high-heat dissipation LED substrate through abandoned straight-chain silica gel modification

A LED substrate, high heat dissipation technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of large thermal expansion coefficient of metal, low thermal conductivity of metal substrate, and restriction of heat dissipation performance, and achieve low cost, good heat dissipation performance, The effect of improving performance

Active Publication Date: 2016-11-09
PINGHU IENERGY LIGHTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention: for the LED substrate made of metal substrate, due to the large thermal expansion coefficient of the metal, a large thermal stress is generated, which affects the device, and at the same time, the thermal conductivity of the metal substrate is low, which restricts its heat dissipation performance. , provides a method of crushing waste linear silicone rubber and polyethylene plastic into mixed small pieces, and then mixing it with a solution prepared from cyclohexane and other substances to obtain a mixed modified sol, which is then used for subsequent use. 2 o 3 After ball milling with brass powder and other materials, mixing and stirring with polyvinyl alcohol, dry-pressing and drying to obtain a dry-pressed billet, and then coating the mixed modified sol on the dry-pressed billet and calcining, it can be prepared Method for High Heat Dissipation LED Substrate

Method used

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Examples

Experimental program
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Effect test

example 1

[0017] (2) First collect the waste linear silicone rubber and polyethylene plastic, wash and dry them separately, then place the dried silicone rubber and polyethylene plastic together in an airflow mill, and crush them into mixed small pieces with a diameter of 1cm. In parts by weight, 75 parts of toluene, 15 parts of cyclohexane, and 15 parts of absolute ethanol were selected respectively, stirred and mixed, and a solution was prepared, and then the mixed small pieces prepared above were mixed with the solid-to-liquid ratio of 1:8. The solution was stirred and mixed for 30 minutes, and after standing for 2 hours, the mixed modified sol was prepared and set aside; and then weighed 45 parts of Al 2 o 3 , 20 parts of brass powder, 15 parts of calcium carbonate, 15 parts of MgO and 20 parts of zinc oxide are placed in a ball mill, with absolute ethanol as the medium, and ball milled for 6 hours; , Stir and mix polyvinyl alcohol and ball mill powder, fill it into a mold, let it ...

example 2

[0019] (3) First collect the waste linear silicone rubber and polyethylene plastic, wash and dry them separately, then place the dried silicone rubber and polyethylene plastic together in an airflow mill, and crush them into mixed small pieces with a diameter of 1cm. Then in parts by weight, respectively select 60 parts of toluene, 15 parts of cyclohexane, and 15 parts of absolute ethanol, stir and mix to prepare a solution, and then mix the above-mentioned mixed small pieces with a solid-to-liquid ratio of 1:8. The solution was stirred and mixed for 25 minutes, and after standing for 1 hour, the mixed modified sol was prepared and set aside; and then weighed 25 parts of Al 2 o 3 , 25 parts of brass powder, 15 parts of calcium carbonate, 15 parts of MgO and 20 parts of zinc oxide are placed in a ball mill, with absolute ethanol as the medium, and ball milled for 6 hours; , Stir and mix polyvinyl alcohol and ball mill powder, fill it into a mold, let it stand at room temperatu...

example 3

[0021] (4) First collect the waste linear silicone rubber and polyethylene plastic, wash and dry them separately, then place the dried silicone rubber and polyethylene plastic together in an airflow mill, and crush them into mixed small pieces with a diameter of 1cm. Then in parts by weight, respectively select 65 parts of toluene, 20 parts of cyclohexane, and 20 parts of absolute ethanol, stir and mix to prepare a solution, then mix the above-mentioned mixed small pieces with a solid-to-liquid ratio of 1:8 The solution was stirred and mixed for 27 minutes, and after standing for 2 hours, the mixed modified sol was prepared and set aside; and then weighed 30 parts of Al 2 o 3 , 20 parts of brass powder, 12 parts of calcium carbonate, 12 parts of MgO and 17 parts of zinc oxide are placed in a ball mill, with absolute ethanol as the medium, and ball milled for 5 hours; , Stir and mix polyvinyl alcohol and ball mill powder, fill it into a mold, let it stand at room temperature f...

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Abstract

The invention relates to a method for preparing a high-heat dissipation LED substrate through abandoned straight-chain silica gel modification and belongs to the technical field of LED preparation. The method comprises the steps of crushing abandoned straight-chain silicone rubber and polyethylene plastic into mixed blocks; mixing the mixed blocks with a dissolved solution prepared from the substances of cyclohexane and the like to obtain mixed and modified sol for later use; carrying out ball-milling on the substances of Al2O3, brass powder and the like, mixing and stirring the product and polyvinyl alcohol, and carrying out dry pressing and drying to obtain a dried and dry-pressed blank; and coating the mixed and modified sol on the dried and dry-pressed blank and carrying out calcination to prepare the high-heat dissipation LED substrate. The prepared LED substrate is good in heat dissipation performance; the heat transfer coefficient is 2.0-3.0W / m.k; the thermal expansion coefficient is low; and the performance of a device is effectively improved.

Description

technical field [0001] The invention relates to a method for preparing a high heat dissipation LED substrate through modification of waste linear silica gel, and belongs to the technical field of LED preparation. Background technique [0002] LED lighting sources have the advantages of high efficiency, energy saving, and long service life. In today's energy shortage, research on LED lighting has far-reaching strategic significance. At present, due to the limited power of LEDs, single-chip packaging cannot generate enough luminous flux to meet people's requirements for display and lighting. It has become a trend in the development of LED devices to connect multiple chips (more than 6) in series and parallel into a group and package them into devices. [0003] A single LED chip can only convert nearly 20% of the electrical energy into light energy, while nearly 80% of the electrical energy is converted into heat, that is, the heat generated by the multi-chip package device wi...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/483H01L33/641H01L2933/0033H01L2933/0075
Inventor 郭舒洋薛培龙高玉刚
Owner PINGHU IENERGY LIGHTING CO LTD
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