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Soluble polyamideimide resin, and flexible metal-clad and flexible printed circuit boards obtained therefrom

A technology of polyamide-imide resin and metal-clad plate, which is applied in the direction of printed circuit, printed circuit, circuit substrate material, etc., can solve the problem of insufficient linear thermal expansion coefficient and achieve the effect of excellent thermal expansion coefficient

Active Publication Date: 2020-08-14
苏州优瑞德新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this scheme shows a lack of linear thermal expansion coefficient

Method used

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  • Soluble polyamideimide resin, and flexible metal-clad and flexible printed circuit boards obtained therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Add 192.0 g of TMA (1.0 mol, produced by Amoco Company in the United States, the source of raw materials is the same below), 26.4 g of 3,3'-dimethyl-4,4'-biphenyl diisocyanate (0.10 mol, Japan Soda Co., Ltd., the source of raw materials is the same below), diphenylmethane-4,4'-diisocyanate 225.0 g (0.90 mol, produced by Wanhua Chemical Group Co., Ltd., the source of raw materials is the same below), sodium methoxide 1.0 g (Sinopharm Group Produced by Chemical Reagent Co., Ltd., the source of raw materials is the same below), N-methylpyrrolidone 2.0 kg (produced by Mitsubishi Chemical Co., Ltd., the source of raw materials is the same below), after fully dissolved, heated to 80~150 °C under the protection of nitrogen flow, and stirred 3~8 hours. Finally, the logarithmic reduced viscosity of the obtained resin solution was 1.30 dL / g.

[0062] Using a stainless steel knife coater, coat the resin obtained above on the rough surface of 18 μm electrolytic copper foil (Suzhou...

Embodiment 2

[0064] Add 79.2 g (0.30 mol) of 3,3'-dimethyl-4,4'-biphenyl diisocyanate and 175.0 g (0.70 mol) of diphenylmethane-4,4'-diisocyanate into the reaction flask, and the rest Same as Example 1. Finally, the logarithmic reduced viscosity of the obtained resin solution was 1.36 dL / g.

Embodiment 3

[0068] Add 21.0 g (0.10 mol) of 1,5-naphthalene diisocyanate and 225.0 g (0.90 mol) of diphenylmethane-4,4'-diisocyanate into the reaction flask respectively. , and the rest are the same as in Example 1. Finally, the logarithmic reduced viscosity of the obtained resin solution was 1.25 dL / g.

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Abstract

The invention provides a soluble polyamide imide resin with excellent heat resistance, economy and low thermal expansion and a flexible coated metal plate and a flexible printed-circuit board adopting the resin as a base film and a covering film. The flexible printed-circuit board is an at least single-faced flexible printed-circuit board, and metal foils are directly overlapped or overlapped layer by layer through the separation of adhesive layers to polyamide imide resin layer with trimellitic anhydride and methylene diphenyl diisocyanate as main components to form an inner-layer base film or outer surface covering film for use. The soluble polyamide imide resin is characterized in that (1) the logarithmic specific concentration viscosity is more than 0.9dL / g and less than 2.5dL / g when the temperature is 30.0 DEG C, the concentration is 0.5g / dL and N-methyl pyrrolidone is taken as a solvent; (2) the polyamide imide resin can be prepared into a dry film with the thickness of 10-100 microns by virtue of public manners without any stretching parallel to the direction of a membrane plane such as direct curtain coating, and the linear coefficient of thermal expansion is 20ppm / DEG C-35ppm / DEG C at 100-200 DEG C.

Description

technical field [0001] The invention relates to a soluble polyamide-imide resin with excellent heat resistance, adhesion to metal foil, and economy, and a flexible metal-clad plate and a flexible printed circuit using the resin as a base film and a cover film plate. Background technique [0002] Flexible metal-clad laminates and their downstream flexible printed circuit board products are widely used in electronic fields such as capacitive touch screens and liquid crystal modules. With the growth of smart devices, downstream industries such as related electronic products and accessories ushered in further development. [0003] Taking single-sided flexible CCL as an example, there are two common flexible CCL structures: three-layer adhesive flexible CCL (composed of copper foil / adhesive / film) and two-layer non-adhesive flexible CCL (composed of copper foil / film composition). Its manufacturing process can be coated with polyamic acid resin on copper foil, or thermoplastic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/14C08J5/18C08L79/08B32B15/088H05K1/03
CPCB32B15/088B32B2307/306B32B2457/08C08G73/14C08J5/18C08J2379/08C08L79/08C08L2201/08C08L2203/16C08L2203/20H05K1/0346H05K2201/0154
Inventor 杨未
Owner 苏州优瑞德新材料有限公司
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