Method for Improving Density and Corrosion Resistance of Fuel Cell Metal Bipolar Plate Surface Coating
A metal bipolar plate, fuel cell technology, used in battery electrodes, circuits, electrical components, etc., can solve the problems of insufficient corrosion resistance of the oxide layer, pits, pinholes, particles, and improve the life of the electrode plate. Improved performance, low cost, and improved corrosion resistance
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Embodiment 1
[0037] (1) Put the stainless steel metal bipolar plate after ultrasonic cleaning into the unbalanced magnetron sputtering ion plating furnace cavity, vacuumize to 3×10-5torr, fill with argon, and keep the working pressure at 4×10-4torr , the bias voltage is -500V, the passivation layer is removed by ion bombardment, the ion plating sputtering cleaning process time is 30min, the sample is hung on the rotating support, and the support speed is 4r / min.
[0038] (2) Keep the bias voltage at -100V, turn on the Ti target current, and gradually increase the current from 0A to 5A, deposit a Ti layer on the surface of the metal plate, the deposition time is 15min, and the working pressure is maintained at 0.1Pa.
[0039] (3) put the pole plate behind the metal Ti layer into the vacuum anode layer ion source furnace chamber, feed 100sccm argon as the ion source of bombardment, increase the voltage of the ion source to be 1800V and the furnace chamber temperature to increase the ion energ...
Embodiment 2
[0042] (1) Put the stainless steel metal bipolar plate after ultrasonic cleaning into the unbalanced magnetron sputtering ion plating furnace cavity, vacuumize to 3×10-5torr, fill with argon, and keep the working pressure at 4×10-4torr , the bias voltage is -500V, the passivation layer is removed by ion bombardment, the ion plating sputtering cleaning process time is 30min, the sample is hung on the rotating support, and the support speed is 4r / min.
[0043] (2) Keep the bias voltage at -80V, turn on the Cr target current, and gradually increase the current from 0A to 6A, deposit a Cr layer on the surface of the metal plate, the deposition time is 5min, and the working pressure is maintained at 0.1Pa.
[0044] (3) put the polar plate after depositing the metal Cr layer into the vacuum anode layer ion source furnace chamber, feed 100sccm argon as the ion source of bombardment, increase the voltage of the ion source to be 1800V and the furnace chamber temperature to increase the ...
Embodiment 3
[0047] (1) Put the stainless steel metal bipolar plate after ultrasonic cleaning into the unbalanced magnetron sputtering ion plating furnace cavity, vacuumize to 3×10-5torr, fill with argon, and keep the working pressure at 4×10-4torr , the bias voltage is -500V, the passivation layer is removed by ion bombardment, the ion plating sputtering cleaning process time is 30min, the sample is hung on the rotating support, and the support speed is 4r / min.
[0048] (2) Keep the bias voltage at -100V, turn on the Ti target current, and gradually increase the current from 0A to 5A, deposit a Ti layer on the surface of the metal plate, the deposition time is 15min, and the working pressure is maintained at 0.1Pa.
[0049] (3) put the pole plate behind the metal Ti layer into the vacuum anode layer ion source furnace chamber, feed 100sccm argon as the ion source of bombardment, increase the voltage of the ion source to be 1800V and the furnace chamber temperature to increase the ion energ...
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