Plasma jet device and method for suppressing charge accumulation on epoxy resin surface

A technology of plasma and jet devices, applied in the direction of plasma, electrical components, coatings, etc., can solve the problems that are not suitable for large-scale industrial production applications, it is difficult to control the uniformity of various raw materials, and the production process requires high technical requirements. Suppresses the accumulation of surface charges, improves surface conductivity, and is inexpensive

Active Publication Date: 2016-11-16
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method of adding fillers or micro-nano inorganic particles needs to be completed in the material preparation stage, which requires high production technology and is difficult to control the uniformity of mixing various raw materials
The fluorine gas used in surface fluorination has certain irritation and toxicity, and the waste gas produced has certain pollution to the environment
The cost of equipment in the ion implantation method is extremely high, and it is not suitable for large-scale industrial production applications

Method used

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  • Plasma jet device and method for suppressing charge accumulation on epoxy resin surface
  • Plasma jet device and method for suppressing charge accumulation on epoxy resin surface
  • Plasma jet device and method for suppressing charge accumulation on epoxy resin surface

Examples

Experimental program
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Effect test

Embodiment 1

[0058] Use the surface potential measuring device to measure the surface potential of the untreated epoxy resin sample. Specifically, after charging for 1 min with a 5kV DC power supply, the voltages at the three moments of voltage withdrawal 0s, voltage withdrawal 900s, and voltage withdrawal 1800s are respectively measured. The surface potential is scanned and measured, and its three-dimensional distribution diagram is as follows Figure 3a ~ Figure 3c shown. When the pressure was removed for 0s, the surface potential distribution of the sample was conical, with an obvious bulge near the center of the sample, which decreased radially to the surroundings, and the highest potential point of 2426V was at the coordinate (8,16). After 900s and 1800s of depressurization, the surface potential distribution is still conical, and the surface potential decays rapidly in the first 900s of depressurization, and the highest value of the surface potential is 1105V after 1800s of depressur...

Embodiment 2

[0060] Atmospheric pressure plasma jet deposition was used to process 2mm thick epoxy resin samples, the discharge voltage amplitude was set to 18kV, the repetition frequency was 1500Hz, the jet nozzle was 10mm away from the sample surface, the inert gas was argon, the carrier gas flow rate was set to 500 sccm, and the excitation gas flow rate was set to For 2slm, the heating platform is preheated to 60°C, and the processing time is 60s.

[0061] Use the surface potential measuring device to measure the surface potential of the treated epoxy resin sample. Specifically, after charging with a 5kV DC power supply for 1min, the voltages at the three moments of voltage withdrawal 0s, voltage withdrawal 900s and voltage withdrawal 1800s are respectively measured. The surface potential is scanned and measured, and its three-dimensional distribution diagram is as follows Figure 3d ~ Figure 3e shown. When the pressure is removed for 0 s, the surface potential distribution of the samp...

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Abstract

The invention relates to a plasma jet device and a method for suppressing charge accumulation on an epoxy resin surface. The plasma jet device comprises a hollow metal capillary tube and a heating platform, wherein a quartz glass tube sleeves the outside of the hollow metal capillary tube; the hollow metal capillary tube and the quartz glass tube are combined into a jet pipe of atmospheric plasma jet; the jet pipe is connected with a high-voltage power supply and simultaneously grounded; an air inlet is arranged in the top end of the hollow metal capillary tube; the heating platform is located at the bottom part of the jet pipe; a sample is placed on the heating platform; and the heating platform is grounded. The device is simple in structure; the method is simple and feasible; the effect is lasting; the treatment efficiency is high; and the environmental influence is small, so that the plasma jet device is suitable for industrial production and application.

Description

technical field [0001] The invention relates to a plasma jet device and a method for suppressing the accumulation of charges on the surface of epoxy resin. Background technique [0002] Epoxy resins and their doped materials are widely used in industrial fields such as floor coatings, power electronics, and aerospace because of their good mechanical and electrical properties. Especially in large-capacity direct current transmission systems, due to the excellent mechanical and insulating properties of epoxy resin materials, support insulators of gas insulated switchgear (GIS) are often made of epoxy resin and its doped materials. However, the epoxy resin materials used in high-voltage electrical equipment are very easy to accumulate charges at the three contact surfaces of metal conductor / insulation medium surface / gas under high field strength, especially high DC field strength, which will cause epoxy The electric field distortion on the surface of the resin is prone to flas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05H1/26C08J7/06C08L63/00
CPCC08J7/06C08J2363/00H05H1/26H05H2245/40
Inventor 邵涛海彬王瑞雪任成燕章程严萍
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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