Polishing composition and polishing method using the polishing composition

A technology of composition and compound, which is applied in the direction of polishing composition containing abrasives, chemical instruments and methods, and other chemical processes, and can solve problems such as prolonged cleaning time, poor lubricity, and rough surface of the abrasive , to achieve the effect of excellent dissolution stability

Active Publication Date: 2016-11-30
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this polishing composition, the base material of the slurry is hydrocarbon oil, and there are following problems when cleaning the platform and the object to be polished after the polishing operation: a cleaning agent needs to be used, and the cleaning operation time becomes longer.
However, compared with oil-based slurry, there are disadvantages such as poor lubricity and poor processing such as surface roughness of the object to be ground.

Method used

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  • Polishing composition and polishing method using the polishing composition
  • Polishing composition and polishing method using the polishing composition
  • Polishing composition and polishing method using the polishing composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～18

[0159] Examples 1-18, Comparative Examples 1-7, and Reference Example 1

[0160] Polishing compositions were prepared according to the component compositions shown in Tables 1-7. The composition of each component is mass % with respect to the total amount of the polishing composition, and each component is as follows. In addition, ion-exchange water was used for water.

[0161] The preparation method of the polishing composition will be described below.

[0162] First, (E) component, (D) component, and (C) component are measured in a beaker sequentially, and it stirs and mixes until it becomes uniform with a magnetic stirrer. Next, add (B) component, stir until it dissolves, and obtains a liquid mixture. A polishing composition is obtained by further adding component (A) as abrasive grains to this liquid mixture.

[0163] Evaluations of dissolution stability, viscosity, and pH were performed using the liquid mixture obtained above. The evaluation of the dissolution stabil...

Embodiment 18

[0209] Example 18 is an example in which 1% by mass of a polyalkylene glycol derivative was added as an antifoaming agent, and it had excellent dissolution stability as in Examples 1 to 17, and a high polishing rate could be obtained. This shows that even when there is a fear of foaming during polishing, adding an antifoaming agent to the polishing composition does not impair the effect of the present invention.

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Abstract

The present invention provides a polishing composition which is excellent in dissolution stability and capable of polishing at a high polishing rate, and a polishing method using the polishing composition. Thus, there is provided a method of polishing a substrate comprising at least one material selected from the group consisting of sapphire, silicon carbide, gallium nitride and aluminum nitride using a polishing composition containing the following components (A) to (E) (A): one or more abrasive grains selected from the group consisting of diamond, boron nitride, boron carbide and silicon carbide, (B) a fatty acid having more than 10 and less than 22 carbon atoms, and (C) Nonionic surfactant, (D) component: organic amine compound, (E) dispersion medium. The abrasive grains of the component (A) have an average particle size which is greater than 1.0 [mu]m and less than 10.0 [mu]m, the content of the component (C) is 0.30 to 10% by mass, and the the molar ratio (D) / (B) between (D) and (B) is from 45 / 55 to 90 / 10.

Description

technical field [0001] The present invention relates to a polishing composition used for polishing a high hardness and high brittle substrate material, and a polishing method using the polishing composition. Background technique [0002] Sapphire substrates used in the manufacture of light-emitting diodes (hereinafter sometimes referred to as "LEDs"), silicon carbide (SiC) substrates, gallium nitride (GaN) substrates, aluminum nitride (AlN) substrates for power semiconductor devices, etc., It is a substrate material with high hardness and high brittleness. [0003] In recent years, sapphire substrates have been widely used as substrates for growing GaN epitaxial layers for LEDs. In addition, the use of cover glass (cover glass) for smartphones, tablet terminals, etc. is also expanding. [0004] Silicon carbide (hereinafter sometimes simply referred to as "SiC") substrates are excellent in heat resistance and voltage resistance, so they are used as high-efficiency power sem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14
CPCC09K3/1463C09G1/02C09K3/1409C09K3/1454H01L21/304H01L21/30625H01L33/00
Inventor 藤本广志
Owner SHOWA DENKO KK
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