Corrosion-resistant anti-creeping copper core conductor
A copper core wire and anti-leakage technology, applied in the direction of conductors, circuits, conductive materials, etc., can solve problems affecting normal transmission power loss, leakage accidents, electric corrosion, etc., to overcome lattice mismatch, less power loss, and better The effect of compatibility
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Embodiment 1
[0016] The copper core wire body is composed of the following elements in parts by weight: 0.04% boron, 0.04% silicon, 0.04% phosphorus, 0.03% sulfur, 0.02% magnesium, 0.03% silver, 0.05% potassium, 0.01% molybdenum, 0.04% zinc, Cobalt 0.02%, manganese 0.1%, and the balance is copper;
[0017] By adding a small amount of boron, silicon, phosphorus, sulfur, magnesium, silver, potassium, molybdenum and other trace elements to the copper core wire body and controlling the content of each element to increase the ductility of the copper core wire, it overcomes the ductility defect of the pure copper core wire.
[0018] The buffer layer is an aluminum nitride layer;
[0019] The silicon thin layer is composed of the following elements by weight: 97% silicon, 0.3% hydrogen, 1.5% nitrogen, 0.5% oxygen, 0.1% fluorine, and 0.2% potassium.
[0020] When the current passing through the copper core wire is constant, the thickness ratio of the copper core wire body, the buffer layer and th...
Embodiment 2
[0024] The copper core wire body is composed of the following elements in parts by weight: boron 0.06%, silicon 0.06%, phosphorus 0.05%, sulfur 0.03%, magnesium 0.04%, silver 0.05%, potassium 0.07%, molybdenum 0.02%, zinc 0.05%, Cobalt 0.03%, manganese 0.11%, the balance is copper;
[0025] By adding a small amount of boron, silicon, phosphorus, sulfur, magnesium, silver, potassium, molybdenum and other trace elements to the copper core wire body and controlling the content of each element to increase the ductility of the copper core wire, it overcomes the ductility defect of the pure copper core wire.
[0026] The buffer layer is an aluminum nitride layer;
[0027] The silicon thin layer is composed of the following elements by weight: 98% silicon, 0.5% hydrogen, 1.8% nitrogen, 0.7% oxygen, 0.3% fluorine, and 0.2% potassium.
[0028] When the current passing through the copper core wire is constant, the thickness ratio of the copper core wire body, the buffer layer and the s...
Embodiment 3
[0032] The copper core wire body is composed of the following elements in parts by weight: boron 0.07%, silicon 0.07%, phosphorus 0.08%, sulfur 0.04%, magnesium 0.06%, silver 0.08%, potassium 0.09%, molybdenum 0.03%, zinc 0.07%, Cobalt 0.05%, manganese 0.12%, the balance is copper;
[0033] By adding a small amount of boron, silicon, phosphorus, sulfur, magnesium, silver, potassium, molybdenum and other trace elements to the copper core wire body and controlling the content of each element to increase the ductility of the copper core wire, it overcomes the ductility defect of the pure copper core wire.
[0034] The buffer layer is an aluminum nitride layer;
[0035] The silicon thin layer is composed of the following elements by weight: 99% silicon, 0.7% hydrogen, 2.0% nitrogen, 0.8% oxygen, 0.4% fluorine, and 0.3% potassium.
[0036] When the current passing through the copper core wire is constant, the thickness ratio of the copper core wire body, the buffer layer and the s...
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