Method for preparing Ag-Cu/W nanometer multilayer film solder for brazing stainless steel

Abstract

The invention relates to a method for preparing Ag-Cu / W nanometer multilayer film solder for brazing stainless steel. The multilayer film solder contains 16.7 percent to 37.5 percent of silver, 12.5 percent to 33.3 percent of copper and 50 percent of tungsten. A silver-copper layer and a tungsten layer are alternately sputtered by utilization of a magnetron sputtering method. The silver-copper layer is sputtered by simultaneously sputtering a silver target and a copper target, and a tungsten target is used for independently sputtering. The thickness of each silver-copper layer is 8 nm to 14 nm, and the thickness of each W layer is smaller than 10 nm. The atom proportion of Ag to Cu in each silver-copper layer is (0.5 to 1) to (3 to 1). Alternating deposition is performed for 200 to 400 periods, so that the total thickness of a final film is 4 microns to 8 microns. The method provided by the invention has the advantages that the solder uniformity can be guaranteed; moreover, the solder thickness can be easily controlled through a sputtering period; the melting point of a nanometer particle is dramatically decreased by utilization of a melting point decreasing effect of the nanometer particle; during a brazing process, a reactive layer and a matrix can be formed into an eutectic structure with a low melting point or a hypo-eutectic structure with a low melting point, so that the brazing temperature is effectively lowered.

Description

technical field [0001] The invention belongs to the technical field of welding, and relates to an Ag-Cu / W nanometer multilayer film solder for brazing stainless steel. Background technique [0002] Stainless steel has strong corrosion resistance due to the formation of a thin and dense chromium oxide protective film on the surface, and is widely used in power stations, chemical and paper making processes, as well as many commercial products such as the construction industry and automobiles. The common method of low-temperature welding of stainless steel is brazing. The welding temperature of brazing is low, which has little effect on the performance of stainless steel, and the solder joints are beautiful. Therefore, the research on stainless steel brazing has high practical value. Commonly used solders for stainless steel brazing include copper-based solders, silver-based solders, etc. When copper-based solder is vacuum brazed, a large amount of evaporation will pollute the...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is designed and provided for the needs of low brazing temperature and high performance of brazed joints, as well as the deficiencies in the specific applications of the above-mentioned Au-based solder, Ni-based solder, pure copper solder and Ag-based solder. A kind of Ag-Cu / W nanometer multi-layer film solder for brazing stainless steel

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