Thermosetting resin composition and prepregs and laminates produced by using the same
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A technology of resin composition and prepreg, applied in synthetic resin layered products, applications, household appliances, etc., can solve the problems of insufficient rigidity, low heat resistance, poor adhesion, etc.
Active Publication Date: 2017-01-25
SHENGYI TECH SUZHOU
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Problems solved by technology
A large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. However, there are still many problems to be solved in practical applications such as low transition temperature and poor adhesion.
For example, in the Chinese invention patent CN10544841B, a combination of hydrocarbon resin and allyl-modified phenolic resin is used to make printed circuit b
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Synthetic example 1
[0068] Put N-(4-hydroxyphenyl)maleimide (500g, 2.66mol), phenol (50g, 0.532mol) and oxalic acid (20g) into a three-necked flask equipped with a thermometer, a condenser, and a stirrer, and mix After stirring evenly, place it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (210mL, 37% formaldehyde aqueous solution, the ratio of phenol / aldehyde is 1 / 0.8) dropwise to the flask for 0.5 hours; After formaldehyde, maintain the temperature of 70°C and stir for 15 hours; then, dissolve and dilute the reaction product with 1000mL acetone, and then precipitate the reaction product with 40% methanol aqueous solution; repeat the above dissolution-precipitation operation 3~5 times, It was filtered, separated, and dried to obtain a pure nitrogen-containing polyfunctional phenolic compound; Add 10-phosphophenanthrene-10-oxa (287g, 0.270mol) into a three-necked flask equipped with a thermometer, condenser, and stirrer, add 2000mL of toluene-tetrah...
Synthetic example 2
[0074] With reference to the method for synthetic example 1, the phosphorus-containing maleimide ester (B-2) of following structure is obtained:
[0075]
[0076] Among them, Ar is , R is: phenyl;
[0077] Among them, n is 1~10, x is 1~20, y is 1~10, z is 1~20, the ratio of (x+z) to y is 5:1, and the ratio of x to z is 0.5:1. Among them, the N content is 2.77%, and the phosphorus content is 4.09%.
Synthetic example 3
[0079] With reference to the method for synthetic example 1, the phosphorus-containing maleimide ester (B-3) of following structure is obtained:
[0080]
[0081] Among them, Ar is , R is: phenyl;
[0082] Among them, n is 1~10, x is 1~20, y is 1~10, z is 1~20, the ratio of (x+z) to y is 5:1, and the ratio of x to z is 0.2:1.
[0083] Among them, the N content is 2.62%, and the phosphorus content is 4.64%.
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Abstract
The invention discloses a thermosetting resin composition. The thermosetting resin composition is prepared from, by solid weight: (a) 10-80 parts of hydrocarbon resin; (b) 100 parts of phosphoric maleimide; (c) 0.1-8 parts of initiator; (d) 5-100 parts of epoxy resin. he thermosetting resin composition applies the maleimide with multi-functional long-chain structure and rigid imide ring and combines with a flexible hydrocarbon resin to form a thermosetting composition through the interaction, and finally makes the thermosetting resin composition and prepregs and laminates produced by using the same for the printed circuit have the characteristics of excellent dielectrical property, heat resistance, adhesion, flame resistance, bending strength, toughness, high peel strength, low water absorption, excellent processing performance and others.
Description
technical field [0001] The invention relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition, and belongs to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in...
Claims
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