Chemical plating solution for Ni-P plated layer and controllable preparation method of micro-nano mold
A technology of chemical plating solution and coating, applied in liquid chemical plating, coating, metal material coating process and other directions, can solve the problems of slow deposition rate, uniformity, hardness and corrosion resistance of the coating, and improve the processing Efficiency and processing quality, reduction of processing cost, effect of increased deposition speed
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[0054] As an embodiment of the present invention, this embodiment provides a Ni-P plating electroless plating solution, including NiSO as the main salt 4 ·6H 2 O, NaH as a reducing agent 2 PO 2 ·H 2 O, and complexing agent and stabilizer, among them, NiSO 4 ·6H 2 The concentration of O is greater than 25g / L; NaH 2 PO 2 ·H 2 The concentration of O is 16-28g / L.
[0055] A commonly used chemical plating solution for Ni-P coating in the prior art is: NiSO with a concentration of 25g / L 4 ·6H 2 O, NaH with a concentration of 25g / L 2 PO 2 ·H 2 O, sodium acetate with a concentration of 25g / L (CH 3 C OONa), boric acid with a concentration of 15~25g / L (H 3 BO 3 ), and thiourea with a concentration of 2g / L as a stabilizer, and the pH of the bath is adjusted to 5.8.
[0056] As a preference for this embodiment, NiSO is selected 4 ·6H 2 The concentration of O is 27g / L; the complexing agent is lactic acid and propionic acid, among which the concentration of lactic acid is 25g / L and the concentrati...
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