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A kind of epoxy soybean oil modified phenolic resin and its preparation method and application

A technology of epoxidized soybean oil and phenolic resin, which is applied in the direction of chemical instruments and methods, layered products, lamination devices, etc., to achieve the effects of enhanced heat resistance, low raw material prices, and enhanced toughness

Active Publication Date: 2019-02-19
抚州市龙兴电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the approaches taken by the toughening and heat-resistant modification of phenolic resins are contradictory, and it is difficult to achieve both at the same time. research focus

Method used

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  • A kind of epoxy soybean oil modified phenolic resin and its preparation method and application

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Embodiment 1

[0040] The embodiment of the present invention provides a preparation method of epoxy soybean oil modified phenolic resin and a manufacturing method of copper clad laminate, comprising the following steps:

[0041] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1400 parts of epoxidized soybean oil, 565 parts of phenol, 1100 parts of bisphenol A, 8 parts of 2-methylimidazoles, 945 parts of formaldehyde , 80 parts of triethylamine, 27 parts of ammonia water, 2800 parts of methanol, 30 parts of graphene, 25 parts of graphene oxide;

[0042]Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 180°C for 5 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and reac...

Embodiment 2

[0046] The embodiment of the present invention provides a preparation method of epoxy soybean oil modified phenolic resin and a manufacturing method of copper clad laminate, comprising the following steps:

[0047] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1200 parts of epoxidized soybean oil, 500 parts of phenol, 1000 parts of bisphenol A, 5 parts of 2-methylimidazoles, 800 parts of formaldehyde , 90 parts of triethylamine, 45 parts of ammonia water, 2500 parts of methanol, 25 parts of graphene, and 20 parts of graphene oxide;

[0048] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 180°C for 6 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and...

Embodiment 3

[0052] The embodiment of the present invention provides a preparation method of epoxy soybean oil modified phenolic resin and a manufacturing method of copper clad laminate, comprising the following steps:

[0053] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1300 parts of epoxidized soybean oil, 600 parts of phenol, 1200 parts of bisphenol A, 6 parts of 2-methylimidazoles, 900 parts of formaldehyde , 100 parts of triethylamine, 25 parts of ammonia water, 2600 parts of methanol, 22 parts of graphene, and 28 parts of graphene oxide;

[0054] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 150°C for 6 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, an...

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Abstract

The invention provides epoxidized soybean oil modified phenolic resin as well as a preparation method and application thereof. The epoxidized soybean oil modified phenolic resin provided by the invention is prepared from the following raw materials in parts by weight: 1200-1600 parts of epoxidized soybean oil, 500-700 parts of phenol, 1000-1300 parts of bisphenol A, 5-10 parts of 2-methylimidazole, 800-1200 parts of formaldehyde, 60-150 parts of basic catalysts, 2500-3000 parts of solvents, 5-60 parts of graphene and 5-40 parts of graphene oxide. The epoxidized soybean oil modified phenolic resin provided by the invention has the beneficial effects that the epoxidized soybean oil modified phenolic resin utilizes the epoxidized soybean oil, graphene and graphene oxide to simultaneously achieve the effects of toughening modification and heat resistance modification and meets the performance requirements of the industry for phenolic resin; the epoxidized soybean oil modified phenolic resin provided by the invention is simple in preparation method and low in raw material prices, meets the increasing production requirements of a copper-clad plate and has high economic benefits; besides, the quality of the copper-clad plate prepared from the epoxidized soybean oil modified phenolic resin is improved while reduction of the production cost is ensured; the copper-clad plate has high use value.

Description

technical field [0001] The invention belongs to the technical field of production methods of copper clad laminates, and in particular relates to an epoxy soybean oil modified phenolic resin and its preparation method and application. Background technique [0002] With the rapid development of electrical and electronic fields and their composite materials, the demand for copper clad laminates continues to increase, and the performance requirements for phenolic resins are also getting higher and higher. The phenolic hydroxyl group and methylene group of pure phenolic resin are easily oxidized, which affects the heat resistance and oxidation resistance; the cured phenolic resin is brittle because the aromatic nuclei are only connected by methylene groups. With the advancement of science and technology, pure phenolic resin can no longer meet the requirements of many high-tech fields. Modification of phenolic resin by various methods (toughening modification and heat resistance m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/32C08K3/04C08L61/14B32B37/06
CPCB32B37/06C08G8/32C08K3/04C08K2201/014C08L61/14C08L2201/08
Inventor 曾金师李金梅黎忠良何庭玉
Owner 抚州市龙兴电子材料有限公司
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