Glue liquor for flame-retardant paper-based copper-clad laminate, flame-retardant paper-based copper-clad laminate and preparation methods of glue liquor and flame-retardant paper-based copper-clad laminate

A copper clad laminate and flame retardant technology, which is applied in the field of copper clad laminate production, can solve the problems such as the inability to meet the heat resistance and thermal stability of printed circuit copper clad laminates, poor flame retardant performance, and poor heat resistance performance.

Active Publication Date: 2017-02-22
抚州市龙兴电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Phenolic resin is a synthetic resin that was first discovered and produced industrially, but at present, modified phenolic resin has poor heat resistance, and paper-based copper clad laminates prepared with modified phenolic re

Method used

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  • Glue liquor for flame-retardant paper-based copper-clad laminate, flame-retardant paper-based copper-clad laminate and preparation methods of glue liquor and flame-retardant paper-based copper-clad laminate

Examples

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Embodiment 1

[0061] An embodiment of the present invention provides a method for manufacturing a flame-retardant paper-based copper-clad laminate, including the following steps:

[0062] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1400 parts of epoxidized soybean oil, 565 parts of phenol, 1100 parts of bisphenol A, 8 parts of 2-methylimidazoles, 945 parts of formaldehyde , 80 parts of triethylamine, 27 parts of ammonia water, 2800 parts of methanol, 30 parts of graphene, 25 parts of graphene oxide;

[0063] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 180°C for 5 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and react at 100°C for 60 minutes, take samples ...

Embodiment 2

[0068] An embodiment of the present invention provides a method for manufacturing a flame-retardant paper-based copper-clad laminate, including the following steps:

[0069] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1200 parts of epoxidized soybean oil, 500 parts of phenol, 1000 parts of bisphenol A, 5 parts of 2-methylimidazoles, 800 parts of formaldehyde , 90 parts of triethylamine, 45 parts of ammonia water, 2500 parts of methanol, 25 parts of graphene, and 20 parts of graphene oxide;

[0070] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 180°C for 6 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and react at 105°C for 45 minutes, then take...

Embodiment 3

[0074] An embodiment of the present invention provides a method for manufacturing a flame-retardant paper-based copper-clad laminate, including the following steps:

[0075] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1450 parts of epoxidized soybean oil, 700 parts of phenol, 1100 parts of bisphenol A, 8 parts of 2-methylimidazoles, 1200 parts of formaldehyde , 70 parts of triethylamine, 30 parts of ammonia water, 2800 parts of methanol, 35 parts of graphene, 22 parts of graphene oxide;

[0076] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 150°C for 6 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water to cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and react at 95°C for 60 minutes, take samples to ...

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Abstract

The invention provides glue liquor for a flame-retardant paper-based copper-clad laminate, the flame-retardant paper-based copper-clad laminate and preparation methods of the glue liquor and the flame-retardant paper-based copper-clad laminate. The glue liquor for the flame-retardant paper-based copper-clad laminate is prepared from, by weight, epoxidized soybean oil-modified phenolic resin, epoxy resin, a flame retardant and an organic solvent, wherein the epoxidized soybean oil-modified phenolic resin is prepared from, by weight, 1,200-1,600 parts of epoxidized soybean oil, 500-700 parts of phenol, 1,000-1,300 parts of bisphenol A, 5-10 parts of 2-methylimidazole, 800-1,200 parts of formaldehyde, 60-150 parts of a basic catalyst, 2,500-3,000 parts of a solvent, 5-60 parts of graphene and 5-40 parts of graphene oxide. The copper-clad laminate is simple in preparation process, capable of saving energy and low in cost and has the good punching property, soldering resistance, flame retardance and processability.

Description

technical field [0001] The invention belongs to the technical field of production methods of copper-clad laminates, and in particular relates to a glue solution for flame-retardant paper-based copper-clad laminates, a flame-retardant paper-based copper-clad laminate and a preparation method thereof. Background technique [0002] Paper-based copper clad laminates are one of the main varieties of copper clad laminates, and are widely used in household electronic products such as TVs. During its production and use, safety and reliability are important standards for products. According to statutory requirements, the flame retardancy of paper-based copper-clad laminates used in some electronic products must reach the UL94V-0 level. At present, phenolic resins modified by bio-oils such as tung oil and phosphates have been added for flame retardancy, which has attracted people's attention. Phenolic resin is a synthetic resin that was first discovered and produced industrially, bu...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08L63/00C08K13/02C08K3/04C08K5/3445C08K5/523C08K5/521C08G8/32B32B15/12B32B15/20B32B29/00
CPCB32B15/12B32B15/20B32B29/00B32B29/005C08G8/32C08K2201/014C08L61/14C08L2201/02C08L2205/025C08L2205/03C08L63/00C08K13/02C08K3/04C08K5/3445C08K5/523C08K5/521
Inventor 曾金师李金梅黎忠良何庭玉
Owner 抚州市龙兴电子材料有限公司
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