BPADA type BDATHQ branched polyimide resin thin film and preparation method thereof

A technology of polyimide resin and polyamic acid resin, which is applied in the field of polyimide film and its preparation, can solve the problem of difficult preparation of high molecular weight polyimide resin, unpublished literature or patent reports, Problems such as the decline in comprehensive performance of film products, to achieve excellent dimensional stability, simple operation, and significant comprehensive performance superiority

Inactive Publication Date: 2017-03-08
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Its disadvantages are: (1) the raw material 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer is extremely expensive, resulting in very high cost of film products, which seriously hinders its further application; ( 2) Due to the low reactivity of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer and aromatic dibasic primary amine, it is difficult to prepare high molecular weight polyimide resin, Therefore, the overall performance of its film products is greatly reduced, especially its mechanical properties.
About BPADA type BDATHQ branched polyimide resin film and preparation method thereof at present, do not see open document or patent report yet

Method used

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  • BPADA type BDATHQ branched polyimide resin thin film and preparation method thereof
  • BPADA type BDATHQ branched polyimide resin thin film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 160.0 grams (0.8 moles) of 4,4'-diaminodiphenyl ether (44ODA), 22.6 grams (0.1 moles) of 3,3'-dimethyl-4,4'-diaminodiphenylmethane (MDT), 22.4 (0.1 mol) 2-(4-aminophenyl)-5-aminobenzimidazole (APABI) and 2200 grams of N-methyl-2-pyrrolidone (NMP) were added to the polymerization bottle, stirred at room temperature, after completely dissolving , cooled in an ice-water bath to below 5°C, added 525.7 g (1.01 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA), stirred, and reacted at 5°C After 1 hour, 2930.7 g of a homogeneous, transparent, and viscous BPADA polyamic acid resin solution was obtained, which was designated as BPADA-PAA-1. Using Brookfield CAP2000+ vertebral plate viscometer, its viscosity at 50°C is measured as 1034mPa.s.

Embodiment 2

[0037] 116.8 grams (0.4 moles) of 1,3-bis(4-aminophenoxy)benzene (134BAPB), 64.8 grams (0.6 moles) of p-phenylenediamine (PPDA), 1400 grams of N,N-dimethylacetamide ( DMAc) and 1,500 grams of N-methyl-2-pyrrolidone (NMP) were added to the polymerization bottle, stirred at room temperature, and after they were completely dissolved, cooled in an ice-water bath to below 5°C, and 546.5 grams (1.05 moles) of 2,2-bis[ 4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA), stirred, and reacted at 8°C for 3 hours to obtain 3628.1 grams of homogeneous, transparent, viscous BPADA type polyamic acid resin solution, denoted as BPADA-PAA-2. Using Brookfield CAP2000+ vertebral plate viscometer, the viscosity at 50°C was measured as 956mPa.s.

Embodiment 3

[0039] Add 108.0 grams (1.0 moles) of p-phenylenediamine (PPDA) and 4000 grams of N-methyl-2-pyrrolidone (NMP) into the polymerization bottle, stir at room temperature, after completely dissolving, cool in an ice-water bath to below 5°C, add 562.1 grams (1.08 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA), stirred, and reacted at 10°C for 6 hours to obtain 4670.1 grams of homogeneous, Transparent, viscous BPADA type polyamic acid resin solution, denoted as BPADA-PAA-3. Using Brookfield CAP2000+ vertebral plate viscometer, its viscosity at 50°C was measured to be 869mPa.s.

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Abstract

The invention relates to a BPADA type BDATHQ branched polyimide resin thin film and a preparation method thereof. The thin film comprises raw materials of BDATHQ and BPADA type linear polyamide acid resin with a mass ratio of 1: (100-800). The preparation method comprises the following steps: mixing aromatic primary diamine and a strong polar aprotic organic solvent, carrying out stirring at room temperature, carrying out cooling to 5 DEG C or below, adding BPADA, carrying out stirring, and carrying out a reaction at 5 DEG C to 10 DEG C for 1 to 6 h so as to obtain a BPADA type polyamide acid resin solution; mixing the resin solution and BDATHQ at room temperature, carrying out stirring, forming a film, carrying out heating, carrying out dehydration and thermal imidization, carrying out cooling, and carrying out demoulding. The method provided by the invention has the advantages of mild reaction conditions, simple operation, low cost, environmental friendliness, facilitation to realizing industrial large-scale production, and capability of being applied to the high-tech fields of flexible solar cells, space telescopes, large generator winding insulation, electromagnetic wire lapping electrical insulation materials, flexible copper-clad plates, etc.

Description

technical field [0001] The invention belongs to the field of polyimide film and its preparation, in particular to a BPADA type BDATHQ branched polyimide resin film and its preparation method. Background technique [0002] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, printing High-tech fields such as circuit boards, wires and cables, motor main insulation, shipping, aerospace, lasers, and optoelectronics. [0003] However, traditional polyimide films, such as the KAPTON film produced by the American DUPONT company and the domestic H film, have a molecular structure of pyromellitic dianhydride, that is, the main monomer raw material is pyromellitic acid di anhydride and 4,4'-diaminodiphenyl ether. [0004] NASA (NASA) plans to launch the Next Gen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18
CPCC08L79/08C08G73/1071C08J5/18C08J2379/08C08L2201/08C08L2203/16
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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