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Preparation method for electroporation electrode structure and application

An electrode structure and electroporation technology, applied in chemical instruments and methods, coating of superimposed layers, special treatment targets, etc., can solve problems such as high cost and high voltage, prevent corrosion, reduce work difficulty, and enhance electric field strength Effect

Active Publication Date: 2017-03-22
QINGDAO HAIER SMART TECH R & D CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the technical problem that electroporation technology requires high voltage, resulting in high cost, and provides a method for preparing an electrode structure that can realize electroporation effect at low voltage

Method used

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  • Preparation method for electroporation electrode structure and application
  • Preparation method for electroporation electrode structure and application
  • Preparation method for electroporation electrode structure and application

Examples

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Effect test

Embodiment 1

[0035] A preparation method of an electroporation electrode structure, the steps are: 1) successively adding sodium hydroxide and ammonium persulfate into deionized water to prepare an oxidizing solution, wherein the concentration of the sodium hydroxide aqueous solution is 2 mol / L, and the The molar concentration ratio of sodium and ammonium persulfate is 20:1, and it is cooled to room temperature for later use; the initial metal material copper foam is cleaned with organic solvents such as absolute ethanol or acetone and deionized water to remove surface oil and other impurities; The good foamed copper is completely immersed in the above oxidizing solution and oxidized for 30 minutes. 2) Take out the above oxidized copper material, rinse it with deionized water for 3-5 times, and then put it into a thermostat at 200°C for heat treatment for 3 hours. 3) The copper foam material after oxidation etching and heat treatment is placed on the sample base of the sputtering equipment...

Embodiment 2

[0037] A preparation method of an electroporation electrode structure, the steps are: 1) adding sodium hydroxide and ammonium persulfate successively to deionized water to prepare an oxidizing solution, wherein the concentration of the sodium hydroxide aqueous solution is 2.5mol / L, the hydrogen The molar concentration ratio of sodium oxide and ammonium persulfate is 30:1, and it is cooled to room temperature for use; the initial metal material aluminum is washed with organic solvents such as absolute ethanol or acetone and deionized water to remove surface oil and other impurities; The good aluminum was completely immersed in the above-mentioned oxidizing solution and oxidized for 20 minutes. 2) Take out the above oxidized aluminum material, rinse it with deionized water for 3-5 times, and then put it into a thermostat at 180°C for heat treatment for 5 hours. 3) The foamed aluminum material after oxidation etching and heat treatment is placed on the sample base of the sputteri...

Embodiment 3

[0039] A preparation method of an electroporation electrode structure, the steps are: 1) adding sodium hydroxide and ammonium persulfate successively to deionized water to prepare an oxidizing solution, wherein the concentration of the sodium hydroxide aqueous solution is 3 mol / L, and the The molar concentration ratio of sodium and ammonium persulfate is 25:1, and it is cooled to room temperature for use; the initial metal material copper foam is cleaned with organic solvents such as absolute ethanol or acetone and deionized water to remove surface oil and other impurities; The good foamed copper is completely immersed in the above oxidizing solution and oxidized for 10 minutes. 2) Take out the above oxidized copper material, rinse it with deionized water for 3-5 times, and then put it into a thermostat at 150°C for heat treatment for 6 hours. 3) The copper foam material after oxidation etching and heat treatment is placed on the sample base of the sputtering equipment, and na...

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PUM

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Abstract

The invention discloses a preparation method for an electroporation electrode structure. The method comprises the steps that (1) a metallic material is soaked in an oxidizing solution for oxidation etching at the room temperature; (2) the metallic material subjected to oxidation etching is placed in a calorstat for heat treatment after being washed; (3) the metallic material subjected to heat treatment is subjected to nano-silver sputtering; and (4) the electrode structure subjected to sputtering is washed then placed in the calorstat to be dried, and the electroporation electrode structure is obtained. The technical problems that an electroporation technology needs high voltage and high cost are solved, and the preparation method capable of achieving the electroporation effect under low voltage for the electrode structure is provided.

Description

technical field [0001] The invention belongs to the technical field of electrode structures, and in particular relates to a method for preparing an electrode structure for an electroporation device. Background technique [0002] Electroporation technology is an efficient technology that instantaneously improves the permeability of cell membranes and introduces nucleic acids, proteins and other molecules into various cells through the action of high-intensity electric fields. It has been widely used in biomedical and genetic engineering fields. The high-intensity electric fields produced by electroporation devices are achieved by applying high voltages of thousands to tens of thousands of volts across the electrodes. In order to ensure the stable operation of the electroporation equipment, extremely high requirements are placed on the performance of the electrode structure, resulting in high cost of the electrode structure of the existing electroporation equipment, complicate...

Claims

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Application Information

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IPC IPC(8): C02F1/467C23C28/00
CPCC02F1/46109C02F1/467C02F2001/46138C02F2303/04C23C28/322C23C28/345
Inventor 刘朝红杜宝亮
Owner QINGDAO HAIER SMART TECH R & D CO LTD
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