PMDA type fluorine-containing branched polyimide resin film and preparation method thereof

Abstract

The invention relates to a PMDA type fluorine-containing branched polyimide resin film and preparation method thereof. In the raw materials of the film, BDAPFP and PMDA linear polyamic acid resin are in a mass ratio of 1:100-800. The preparation method comprises the steps of: mixing aromatic binary primary amine with a strong polar non-protonic organic solvent, conducting stirring at room temperature, performing cooling to a temperature below 5DEG C, adding PMDA, conducting stirring, and carrying out reaction at 5DEG C-10DEG C for 1-6h to obtain a PMDA type polyamic acid resin solution; mixing the resin solution with BDAPFP at room temperature, conducting stirring, film-forming and heating, carrying out dehydration thermal imidization reaction, and performing cooling and demoulding, thus obtaining the PMDA type fluorine-containing branched polyimide resin film. The method provided by the invention has the advantages of mild reaction conditions, simple operation, low cost, and environmental friendliness, is conducive to realizing large-scale industrial production. And the PMDA type fluorine-containing branched polyimide resin film can be applied to flexible solar cells, space telescopes, large generator main insulation, electromagnetic wire wrapped electrical insulating materials, flexible copper-clad plates and other high-tech fields.

Description

technical field [0001] The invention belongs to the field of polyimide film and its preparation, in particular to a PMDA type fluorine-containing branched polyimide resin film and its preparation method. Background technique [0002] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, printing High-tech fields such as circuit boards, wires and cables, motor main insulation, shipping, aerospace, lasers, and optoelectronics. [0003] However, traditional polyimide films, such as the KAPTON film produced by the American DUPONT company and the domestic H film, have a molecular structure of pyromellitic dianhydride, that is, the main monomer raw material is pyromellitic acid di anhydride and 4,4'-diaminodiphenyl ether. [0004] NASA (NASA) plans to launch ...

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Problems solved by technology

[0006] Its disadvantages are: (1) the raw material 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer is extremely expensive, resulting in very high cost of film products, which seriously hinders its further application; ( 2) Due to the low reactivity of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer and aromatic dibasic primary amine, it is difficult to prepare high molecular weight polyimide resin, Therefore, the overall performance of its film products is greatly reduced, especially its mechanical properties.

At present, there is no published literature or patent report about PMDA type fluorine-containing branched polyimide resin film and its preparation method.

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