PMDA type fluorine-containing branched polyimide resin film and preparation method thereof

A technology of polyimide resin and polyamic acid resin, which is applied in the field of PMDA-type fluorine-containing branched polyimide resin film and its preparation, and can solve the problem of making high-molecular-weight polyimide resin and film products difficult Problems such as the decline of comprehensive performance and the high cost of thin film products have achieved the effects of excellent dimensional stability, significant comprehensive performance superiority, excellent electrical performance and optical performance

Inactive Publication Date: 2017-03-22
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Its disadvantages are: (1) the raw material 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer is extremely expensive, resulting in very high cost of film products, which seriously hinders its further application; ( 2) Due to the low reactivity of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer and aromatic dibasic primary amine, it is difficult to prepare high molecular weight polyimide resin, Therefore, the overall performance of its film products is greatly reduced, especially its mechanical properties.
At present, there is no published literature or patent report about PMDA type fluorine-containing branched polyimide resin film and its preparation method.

Method used

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  • PMDA type fluorine-containing branched polyimide resin film and preparation method thereof
  • PMDA type fluorine-containing branched polyimide resin film and preparation method thereof
  • PMDA type fluorine-containing branched polyimide resin film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0035] 160.0 grams (0.8 moles) of 4,4'-diaminodiphenyl ether (44ODA), 44.8 grams (0.2 moles) of 2-(4-aminophenyl)-5-aminobenzimidazole (APABI) and 1275 grams of N -Methyl-2-pyrrolidone (NMP) was added to the polymerization bottle, stirred at room temperature, and after it was completely dissolved, cooled in an ice-water bath to below 5°C, 220.2 grams (1.01 moles) of pyromellitic dianhydride (PMDA) was added, and stirred. After reacting at 5° C. for 1 hour, 1700 g of a homogeneous, transparent and viscous PMDA polyamic acid resin solution was obtained, which was designated as PMDA-PAA-1. The Brookfield CAP2000+ vertebral plate viscometer was used to measure the viscosity, and the performance data are shown in Table 1.

Embodiment 2

[0037] 146.0 grams (0.5 moles) of 1,4-bis(4-aminophenoxy)benzene (144BAPB), 54.0 grams (0.5 moles) of m-phenylenediamine (MPDA), 1000 grams of N,N-dimethylacetamide (DMAc) and 720 grams of N-methyl-2-pyrrolidone (NMP) were added to the polymerization bottle, stirred at room temperature, after they were completely dissolved, cooled in an ice-water bath to below 5°C, and 228.9 grams (1.05 moles) of pyromellitic acid di anhydride (PMDA), stirred, and reacted at 8° C. for 3 hours to obtain 2148.9 grams of a homogeneous, transparent, viscous PMDA-type polyamic acid resin solution, which was designated as PMDA-PAA-2. The Brookfield CAP2000+ vertebral plate viscometer was used to measure the viscosity, and the performance data are shown in Table 1.

Embodiment 3

[0039] Add 200.0 g (1.0 mole) of 4,4'-diaminodiphenyl ether (DADPE) and 2600 g of N-methyl-2-pyrrolidone (NMP) into the polymerization bottle, stir at room temperature, and cool in an ice-water bath after completely dissolving To below 5°C, add 235.4 grams (1.08 moles) of pyromellitic dianhydride (PMDA), stir, and react at 10°C for 6 hours to obtain 3035.4 grams of homogeneous, transparent, viscous PMDA-type polyamic acid resin solution , denoted as PMDA-PAA-3. The Brookfield CAP2000+ vertebral plate viscometer was used to measure the viscosity, and the performance data are shown in Table 1.

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PUM

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Abstract

The invention relates to a PMDA type fluorine-containing branched polyimide resin film and preparation method thereof. In the raw materials of the film, BDAPFP and PMDA linear polyamic acid resin are in a mass ratio of 1:100-800. The preparation method comprises the steps of: mixing aromatic binary primary amine with a strong polar non-protonic organic solvent, conducting stirring at room temperature, performing cooling to a temperature below 5DEG C, adding PMDA, conducting stirring, and carrying out reaction at 5DEG C-10DEG C for 1-6h to obtain a PMDA type polyamic acid resin solution; mixing the resin solution with BDAPFP at room temperature, conducting stirring, film-forming and heating, carrying out dehydration thermal imidization reaction, and performing cooling and demoulding, thus obtaining the PMDA type fluorine-containing branched polyimide resin film. The method provided by the invention has the advantages of mild reaction conditions, simple operation, low cost, and environmental friendliness, is conducive to realizing large-scale industrial production. And the PMDA type fluorine-containing branched polyimide resin film can be applied to flexible solar cells, space telescopes, large generator main insulation, electromagnetic wire wrapped electrical insulating materials, flexible copper-clad plates and other high-tech fields.

Description

technical field [0001] The invention belongs to the field of polyimide film and its preparation, in particular to a PMDA type fluorine-containing branched polyimide resin film and its preparation method. Background technique [0002] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, printing High-tech fields such as circuit boards, wires and cables, motor main insulation, shipping, aerospace, lasers, and optoelectronics. [0003] However, traditional polyimide films, such as the KAPTON film produced by the American DUPONT company and the domestic H film, have a molecular structure of pyromellitic dianhydride, that is, the main monomer raw material is pyromellitic acid di anhydride and 4,4'-diaminodiphenyl ether. [0004] NASA (NASA) plans to launch ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18
CPCC08G73/1071C08J5/18C08J2379/08C08L79/08C08L2201/08C08L2201/10C08L2203/16
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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