Powder silicon-ingot-cutting adhesive with good fluidity and preparation method thereof

A fluidity and powder technology, applied in the field of anaerobic adhesive, can solve the problems of abnormal increase in silicon wafer cutting, uneven coating, viscosity increase, etc., to shorten the positioning time, improve the qualification rate, and increase the film thickness.

Active Publication Date: 2017-04-26
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of powder, the viscosity rises rapidly, and the poor fluidity leads to uneven coating of the adhesive during use, and the formation of voids

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A powder silicon ingot cutting adhesive with good fluidity, including an adhesive and an accelerator, the adhesive includes the following raw materials in parts by weight: 15 parts of polyurethane acrylate, 30 parts of hydroxypropyl methacrylate, filling 20 parts of silicon dioxide, 0.5 parts of fumed silica, 3 parts of large molecular weight thermoplastic resin, 1 part of methacrylic acid, 6 parts of epoxy acrylate, 0.5 parts of cumene hydroperoxide, N,N-dimethyl p- 0.5 part of toluidine, 0.2 part of o-benzoylsulfonimide, 0.01 part of polymerization inhibitor, and 1 part of coupling agent; wherein, the molecular weight of the large molecular weight thermoplastic resin is 20,000 to 50,000 molecular weight, and the above-mentioned parts by weight The raw materials of the adhesive are put into a stirring device, stirred at a speed of 500r / min for 2.5h, filtered, and vacuumed for 15min to obtain the adhesive;

[0024] The accelerator includes the following raw materials in...

Embodiment 2

[0027] A powder silicon ingot cutting adhesive with good fluidity, including an adhesive and an accelerator, the adhesive includes the following raw materials in parts by weight: 20 parts of polyurethane acrylate, 35 parts of hydroxypropyl methacrylate, filler 25 parts of silicon dioxide, 1 part of fumed silica, 8 parts of large molecular weight thermoplastic resin, 1.5 parts of methacrylic acid, 10 parts of epoxy acrylate, 1 part of cumene hydroperoxide, N,N-dimethyl p- 1 part of toluidine, 0.5 part of o-benzoylsulfonimide, 0.1 part of polymerization inhibitor, and 5 parts of coupling agent; wherein, the molecular weight of the large molecular weight thermoplastic resin is 20,000 to 50,000 molecular weight, and the above-mentioned parts by weight Put the raw materials of the adhesive into the stirring device, stir at a speed of 500r / min for 3.5h, filter, and vacuumize for 25min to obtain the adhesive;

[0028] The accelerator includes the following raw materials in parts by w...

Embodiment 3

[0031] A powder silicon ingot cutting adhesive with good fluidity, including an adhesive and an accelerator, the adhesive includes the following raw materials in parts by weight: 18 parts of polyurethane acrylate, 32 parts of hydroxypropyl methacrylate, filling 22 parts of silicon dioxide, 0.6 parts of fumed silica, 5 parts of large molecular weight thermoplastic resin, 1.2 parts of methacrylic acid, 8 parts of epoxy acrylate, 0.8 parts of cumene hydroperoxide, N,N-dimethyl p- 0.8 part of toluidine, 0.4 part of o-benzoylsulfonimide, 0.05 part of polymerization inhibitor, 3 parts of coupling agent; Wherein, the molecular weight of large molecular weight thermoplastic resin is molecular weight 20,000~50,000, the above-mentioned parts by weight The raw materials of the adhesive are put into a stirring device, stirred at a speed of 500r / min for 3 hours, filtered, and vacuumed for 20 minutes to obtain the adhesive;

[0032] The accelerator includes the following raw materials in pa...

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PUM

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Abstract

The invention discloses a powder silicon-ingot-cutting adhesive with good fluidity. The adhesive comprises gum and an accelerant. The adhesive is characterized in that the gum includes the raw materials which comprise, by weight, 15-20 parts of urethane acrylate, 30-35 parts of hydroxypropyl methacrylate, 20-25 parts of filled silica, 0.5-1 part of fumed silica, 3-8 parts of thermoplastic resin with large molecular weight, 1-1.5 parts of methacrylic acid, 6-10 parts of epoxy acrylate, 0.5-1 part of isopropyl benzene hydroperoxide, 0.5-1 part of N,N-dialkylarylamine, 0.2-0.5 part of benzoic sulfimide, 0.01-0.1 part of polymerization inhibitor and 1-5 parts of coupling agent. During the process of frictioning, the adhesive liquid with greatly improved fluidity is capable of rapidly and evenly being spread on a silicon ingot which needs cutting, and has the advantages of inhibiting the existence of hollow gel, ensuring the stability of the cutting progress and improving the pass rate of cutting products.

Description

technical field [0001] The invention relates to the technical field of anaerobic adhesives. More specifically, the present invention relates to a kind of powder silicon ingot cutting glue with good fluidity and its preparation method. Background technique [0002] As an important representative of the new energy industry, the photovoltaic industry has developed rapidly in China in recent years, and has become a major producer of photovoltaic products in the world, and has become a pivotal force in the international new energy market. At the same time, adhesives have also developed as an important auxiliary product in the silicon wafer cutting process in the photovoltaic industry. Due to its advantages of high strength, high hardness, good water resistance, and relatively low price, powder adhesives have become one of the adhesives with the most potential for development. However, due to the addition of powder, the viscosity rises rapidly, and the poor fluidity leads to une...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J201/00C09J163/10C09J11/04C09J11/06C09J11/08
Inventor 唐霞陈韬苏光临
Owner 广西珀源新材料有限公司
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