Antifouling graphite fiber AlSiC composite material for electronic packaging and preparation method thereof

Abstract

The invention discloses an antifouling graphite fiber AlSiC composite material for electronic packaging. The antifouling graphite fiber AlSiC composite material for electronic packaging is prepared by the following raw materials in parts by weight: 11-13 of graphite fiber, 75-78 of SiC, 95-100 of 6061 aluminum alloy, 0.4-0.6 of aluminum oxide, 4-4.3 of phosphoric acid, 13-14 of pore forming agent, 2-2.5 of PVP, a proper amount of dichloromethane, a proper amount of DMF, 1.3-1.5 of nanometer lanthanum borate, 1.5-1.8 of nanometer silicon dioxide, 0.5-0.7 of boron anhydride, 0.4-0.6 of nanometer titanium dioxide, and 43-45 of ethanol. The antifouling graphite fiber AlSiC composite material for electronic packaging is added with the graphite fiber to form a linear cooling path, so that the cooling performance is improved compared with single point contact of SiC; the dirt resistance and the oxidation resistance of the material are improved through use of nanometer silicon dioxide and nanometer titanium dioxide; and boron anhydride improves the heat resistance and the wear resistance of an aluminum alloy.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic packaging, in particular to a graphite fiber AlSiC composite material for antifouling electronic packaging and a preparation method thereof. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. AlSiC composite materials have outstanding advantages such as cheap raw materials, high thermal conductivity, and adjustable thermal expansion coefficient, and have been more and more widely used in the field of electronic packaging. In the experiment, ɑ-SiC particles were used as reinforcement, aluminum alloy as matrix, pore forming agent and binder to prepare AlSiC composite materials. The preparation process adopts the process of combining the molding method and the vacuum pressure im...

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Problems solved by technology

[0003] The obtained AlSiC composite material has good thermal conductivity and small thermal expansion coefficient, but the interface compatibility between SiC and aluminum is not good, and it is easy to separate, so that the performance of the material cannot be stable for a long time. Moreover, the pure granular SiC has a small contact point area and thermal conductivity. Reached the best, needs improvement, also needs to improve the anti-fouling properties of the material