Epitaxial wafer of light-emitting diode and growth method thereof
A technology for light emitting diodes and a growth method, which is applied to the epitaxial wafer of light emitting diodes and the field of growth thereof, can solve the problems of screw dislocation lattices, difficult to eliminate dislocations, defects, etc. Electrostatic ability, the effect of improving crystal quality
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Embodiment 1
[0028] An embodiment of the present invention provides an epitaxial wafer of a light emitting diode, see figure 1 , the epitaxial wafer includes a substrate 1 , and a buffer layer 2 , an undoped GaN layer 3 , an N-type GaN layer 4 , a light emitting layer 5 , and a P-type GaN layer 6 stacked on the substrate 1 in sequence.
[0029] In this embodiment, the buffer layer is doped with Mg.
[0030] Specifically, the doping concentration of Mg in the buffer layer is smaller than the doping concentration of the P-type dopant in the P-type GaN layer.
[0031] Optionally, the buffer layer may include one of GaN layers, AlGaN layers, InGaN layers, AlInGaN layers, alternately stacked InGaN layers, and AlGaN layers.
[0032] Optionally, the doping concentration of Mg in the buffer layer can be changed in one of the following ways: remain unchanged (such as Figure 2a shown), gradually increasing along the stacking direction of the epitaxial wafer (such as Figure 2b shown), and gradua...
Embodiment 2
[0045] An embodiment of the present invention provides a method for growing an epitaxial wafer of a light emitting diode, which is suitable for growing the epitaxial wafer provided in Embodiment 1. Realized using high-purity H 2 or N 2 As carrier gas, TMGa, TMAl, TMIn and NH 3 As Ga source, Al source, In source and N source respectively, using SiH 4 and Cp 2 Mg is used as an N-type dopant and a P-type dopant respectively, and metal organic chemical vapor deposition equipment or other equipment is used to complete the growth of epitaxial wafers.
[0046] Specifically, see Figure 4 , the growth method includes:
[0047] Step 201: growing a buffer layer on a substrate.
[0048] In this embodiment, the buffer layer is doped with Mg.
[0049]Specifically, the doping concentration of Mg in the buffer layer is smaller than the doping concentration of the P-type dopant in the P-type GaN layer.
[0050] Optionally, the buffer layer may include one of GaN layers, AlGaN layers, ...
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