N-type bi-directional HEMT device based on CH3NH3PbI3 material and preparation method thereof
A device and N-type technology, applied in the field of N-type bidirectional HEMT devices and their preparation, can solve the problems of inability to meet the needs of photoelectric high electron mobility transistors, and achieve the effects of high photoelectric conversion efficiency, enhanced device performance, and high mobility
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Embodiment 1
[0050] Traditional HEMT high electron mobility transistors are complex and costly, while CH-based 3 NH 3 PB 3 The preparation of the material HEMT is simple and the cost is low; the traditional inorganic HEMT high electron mobility transistor belongs to the conversion of electric energy to electric energy, which cannot meet the demand for optoelectronic high electron mobility transistors in the visible light band, and the CH 3 NH 3 PB 3 The material has both the properties of organic / inorganic materials and its own excellent optoelectronic properties, which can well meet the market demand for optoelectronic high electron mobility transistors in the visible light band. Based on CH 3 NH 3 PB 3 The HEMT of the material can generate a large number of photogenerated carriers through light to realize the conversion of electric energy plus light energy to electric energy, and improve the conversion efficiency. In addition, based on CH 3 NH 3 PB 3 The HEMT of the material can...
Embodiment 2
[0084] Please also see Figure 4a-Figure 4h and Figure 5 and Figure 6 , Figure 4a-Figure 4h A schematic diagram of a preparation method for an N-type bidirectional HEMT device based on a CH3NH3PbI3 material provided by an embodiment of the present invention; Figure 5 A schematic structural diagram of a first mask plate provided by an embodiment of the present invention; Figure 6 A schematic structural diagram of a second mask plate provided by an embodiment of the present invention. In this embodiment, on the basis of the above-mentioned embodiments, the CH-based 3 NH 3 PB 3 The preparation method of the N-type bidirectional HEMT device of the material is described in detail as follows:
[0085] Step 1: See Figure 4a, to prepare sapphire Al 2 o 3 The substrate 1 has a thickness of 200 μm-600 μm.
[0086] The substrate is sapphire Al 2 o 3 Reason: Due to its low price and good insulation performance, it can effectively prevent the longitudinal leakage of bidi...
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