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Resin precursor, resin composition containing same, polyimide resin membrane, resin film, and method for producing same

A technology of polyimide resin and resin composition, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, flat products, etc., and can solve the problems of low light transmittance, difficult to be used in fields requiring transparency, etc.

Active Publication Date: 2017-05-10
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, ordinary polyimide resins are colored brown or yellow due to their high aromatic ring density, and have low light transmittance in the visible light region, making it difficult to use in fields requiring transparency

Method used

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  • Resin precursor, resin composition containing same, polyimide resin membrane, resin film, and method for producing same
  • Resin precursor, resin composition containing same, polyimide resin membrane, resin film, and method for producing same
  • Resin precursor, resin composition containing same, polyimide resin membrane, resin film, and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0282] Hereinafter, the present invention will be described in more detail based on examples, but these are described for illustration only, and the scope of the present invention is not limited to the following examples.

[0283] Various evaluations in Examples and Comparative Examples were performed as follows.

[0284] (Determination of weight average molecular weight and number average molecular weight)

[0285] The weight average molecular weight (Mw) and the number average molecular weight (Mn) were measured by gel permeation chromatography (GPC) under the following conditions. As a solvent, N,N-dimethylformamide (manufactured by Wako Pure Chemical Industries, Ltd., for high performance liquid chromatography) was used, and lithium bromide monohydrate (manufactured by Wako Pure Chemical Industries, Ltd.) to which 24.8 mmol / L was added before measurement was used. Co., Ltd., purity 99.5%) and 63.2 mmol / L phosphoric acid (Wako Pure Chemical Industries, Ltd., for high perfo...

Synthetic example 1

[0296]A 50ml detachable flask was replaced with nitrogen, and 19.5 g of N-methyl-2-pyrrolidone (NMP) was put into the detachable flask, and then BTDA (benzophenone tetracarboxylate) as raw material compound 1 was put into the detachable flask. Acid dianhydride) 2.42g (7.5mmol) and 3-aminopropyltriethoxysilane (trade name: LS-3150, manufactured by Shin-Etsu Chemical Co., Ltd.) as raw material compound 2 3.321g (15mmol), react at room temperature 5 hours to obtain an NMP solution of alkoxysilane compound 1.

[0297] This alkoxysilane compound 1 was prepared as a 0.001% by mass NMP solution, filled in a quartz cuvette with a measurement thickness of 1 cm, and the absorbance when measured with UV-1600 (manufactured by Shimadzu Corporation) was 0.13.

Synthetic example 2～5

[0299] In the above-mentioned Synthesis Example 1, the usage amount of N-methyl-2-pyrrolidone (NMP) and the types and usage amounts of the raw material compounds 1 and 2 were set to the usage amounts described in Table 1, respectively. 1. NMP solutions of alkoxysilane compounds 2-5 were obtained in the same manner.

[0300] These alkoxysilane compounds were each made into a 0.001% by mass NMP solution, and the absorbance measured in the same manner as in Synthesis Example 1 above is shown in Table 1 together.

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Abstract

Provided is a resin composition including a polyimide precursor that has exceptional adhesiveness to glass substrates and that does not generate particles during laser detachment. A resin composition containing (a) a polyimide precursor, (b) an organic solvent, and (d) an alkoxysilane compound, wherein the resin composition shows polyimide obtained by imidation of the (a) polyimide precursor after application of the resin composition to the surface of a support, the residual stress with the support is from -5 MPa to 10 MPa, and the 308 nm absorbance of the (d) alkoxysilane compound when made into a 0.001 mass% NMP solution is from 0.1 to 0.5 at a solution thickness of 1 cm.

Description

technical field [0001] The present invention relates to, for example, a resin precursor used in a substrate for a flexible device and a resin composition containing the same, a polyimide resin film, a resin film and a method for producing the same, a laminate and a method for producing the same, and a display substrate and methods of manufacture thereof. Background technique [0002] Generally, for applications requiring high heat resistance, a film of polyimide (PI) resin is used as the resin film. Ordinary polyimide resins are prepared by polymerizing aromatic dianhydride and aromatic diamine solution to produce polyimide precursors, and then perform thermal imidization by ring-closing dehydration at high temperature, or use catalysts for chemical imidization. High heat-resistant resin produced by imidization. [0003] Polyimide resin is an insoluble and infusible super heat-resistant resin with excellent properties such as thermal oxidation resistance, heat resistance, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08B32B27/34C08G73/10C08J5/18C08J7/04C08K5/02C08K5/5415C08K5/544
CPCB32B27/34C08J5/18B29K2105/0073B29L2007/00B29C33/64B29C41/12C08G73/1039B29C2791/009C09D179/08B29C33/60B29C41/42B29K2079/08C08J2379/08G02F2201/50H01L27/1218C08K5/5455C08G73/10C08K5/02C08K5/5415C08K5/544C08K5/549C08J7/043C08J7/05C08L79/08B29C41/003C23C16/345G02F1/133305G02F1/133723H01L27/127B29L2007/002B29L2007/008B29C2035/0838C08L2201/10C08L2201/02C08L2201/08B29C41/02C08K5/5419B29C35/0805H01L27/1259
Inventor 宫本佳季奥田敏章米谷昌树饭塚康史金田隆行
Owner ASAHI KASEI KK
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