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A new method for preparing silicon micro-nano hierarchical structure

A hierarchical structure, silicon microtechnology, applied in chemical instruments and methods, silicon compounds, nanotechnology, etc., can solve the problem of high processing cost, and achieve the effects of low cost, large effective surface area, and simple operation

Inactive Publication Date: 2018-11-13
SOUTHWEST JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reactive ion etching process requires expensive equipment, such as inductively coupled plasma etcher or reactive ion etcher, resulting in higher processing costs

Method used

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  • A new method for preparing silicon micro-nano hierarchical structure
  • A new method for preparing silicon micro-nano hierarchical structure
  • A new method for preparing silicon micro-nano hierarchical structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] S0. Cleaning the silicon wafer: put the monocrystalline silicon (100) substrate in a mixed solution of ammonia water: hydrogen peroxide: deionized water at a temperature of 85°C and a volume ratio of 1:1:5, and clean it for 10 minutes, then take it out with a large amount of deionized water Rinse with water and blow dry with a nitrogen gun.

[0032] S1. Preparation of silicon microstructure array: in a water bath environment at 85°C, put the cleaned silicon wafer into a mixed solution of potassium hydroxide and isopropanol, the etching solution includes 80ml deionized water, 20ml isopropanol ( Analytical pure) and 3.09g potassium hydroxide (analytical pure). The etching solution was stirred by magnetic stirring, and the rotational speed was set at 400 rpm. The magneton cannot be in contact with the sample, and the distance between the magneton and the sample is set to ~10mm. During the etching process, it can be observed that the etching reaction is violent, and a lar...

Embodiment 2

[0039] Compared with the first embodiment, this embodiment is slightly different except step S1, and other steps are the same. Step S1 in this embodiment is specifically:

[0040] S1. Preparation of silicon microstructure array: In a water bath environment at 85°C, put the cleaned silicon wafer into an etching solution of potassium hydroxide and isopropanol. The etching solution contains 80ml of deionized water and 20ml of isopropanol (analytical pure) and 3.09g potassium hydroxide. The etching solution was stirred by means of mechanical stirring (OA2000, Shanghai Ouhe Mechanical Equipment Co., Ltd.), the rotation speed was set at 600 rpm, and the stirring paddle was set above the sample with a distance of about 20 mm from the sample. During the etching process, it can be observed that the etching reaction is violent, and a large number of bubbles are generated. Due to the stirring, the bubbles are quickly discharged. After the etching reaction was carried out for 30 minutes...

Embodiment 3

[0042] Compared with the first embodiment, this embodiment is slightly different except step S2, and the rest of the steps are the same. Step S2 in this embodiment is specifically:

[0043] S2. Integrating silver nano-films: integrating titanium / silver nano-films on the surface of the pyramid-shaped silicon microstructure array obtained in step S1 by using a resistive thermal evaporation coating apparatus (Wuhan Namei Technology Co., Ltd.). During the coating process, the thickness of the titanium nano film is 2nm. When plating silver nano film, the vacuum degree of coating instrument is set to 10 -4 Pa, the current is set to 110A, and a silver nano film with a thickness of about 50nm is deposited.

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Abstract

The invention discloses a new method for preparing a silicon micro-nano hierarchical structure. The method comprises the following steps: S1, putting a cleaned silicon slice into a mixed solution of potassium hydroxide and isopropanol in a heating and stirring state to be etched, so as to obtain a pyramid-shaped silicon micro structure array uniform in size and distribution; S2, integrating an adhesion layer / silver nano film on the surface of the pyramid-shaped silicon micro structure array; S3, putting a sample treated by the step S2 into a salt solution containing halide ions, and carrying out pitting reaction, so as to obtain island-shaped silver particles or a porous silver film; and S4, putting the sample treated by the step S3 into a mixed solution of hydrofluoric acid and hydrogen peroxide to be etched, so that a novel silicon micro-nano hierarchical structure is obtained. The preparation method has the advantages of low cost, simple operation and controllable process and is applicable to large-scale production, and the obtained novel silicon micro-nano structure has a very large effective surface area and an extremely strong practical value, thereby being worthy of popularization in the industry.

Description

technical field [0001] The invention belongs to the technical field of micro-nano structure manufacturing, and in particular relates to a new method for preparing a silicon micro-nano hierarchical structure. Background technique [0002] With the rapid development of micro / nano-electromechanical systems, micro-energy devices such as micro-lithium-ion batteries have received great attention. Silicon micro-nanostructures can be widely used in devices such as miniature lithium-ion batteries and photovoltaic solar cells, and can also be used in photoelectric sensors. The most commonly used preparation methods for silicon micro-nanostructures are metal-catalyzed etching and reactive ion etching. The reactive ion etching process requires expensive equipment, such as inductively coupled plasma etching machine or reactive ion etching machine, so the processing cost is relatively high. The preparation of silicon micro-nanostructures by metal-catalyzed etching has the advantage of l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B33/021B82Y40/00
CPCC01B33/021C01P2004/03C01P2004/60C01P2004/90
Inventor 蒋淑兰余丙军钱林茂韩京辉钟方尚王丰
Owner SOUTHWEST JIAOTONG UNIV