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Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof

A silicone potting compound and lightweight technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problem of uniform thermal conductivity, achieve good fluidity, fast molding speed, and improve thermal conductivity performance effect

Active Publication Date: 2017-05-24
GUANGZHOU TINCI MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the relevant technologies in this field, there is no information disclosing a solution to unify the specific gravity and thermal conductivity well.

Method used

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  • Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof
  • Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof
  • Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Add 100 parts by mass of the unsaturated hydrocarbon group-terminated polydiorganosiloxane (a) and 0 parts by mass of the saturated hydrocarbon group-terminated polydiorganosiloxane (b) into the vacuum kneader, and divide it several times Add 50 parts by mass, particle size is 1um, density is 0.4g / cm 3 Hollow glass microsphere thermally conductive filler (c), 30 parts by mass of aluminum hydroxide flame-retardant filler (d) with a particle size of 5um and 10 parts by mass of 3-glycidoxypropyltrimethoxysilane treatment agent (e) , Stir and mix for 1.0 hour, then add 0 parts by mass of alkoxy-terminated polydimethylsiloxane (f), continue to stir and mix for 0.5 hours; increase the temperature to 120°C and heat and mix for 2.0 hours; remove the low molecular weight by vacuum 1.0 Hours; After cooling and filtering, it is made into a lightweight, thermally conductive, flame-retardant silicone potting base compound.

[0066] Add 100 parts by mass of the above silicone potting ba...

Embodiment 2

[0079] Add 100 parts by mass of the unsaturated hydrocarbon group-terminated polydiorganosiloxane (a) and 20 parts by mass of the saturated hydrocarbon group-terminated polydiorganosiloxane (b) into the vacuum kneader, and divide it several times Add 1 part by mass, particle size is 5um, density is 2.0g / cm 3 Hollow ceramic microsphere thermally conductive filler (c), 90 parts by mass of magnesium hydroxide flame-retardant filler (d) with a particle size of 2um and 5 parts by mass of 3-glycidoxypropylmethyldiethoxysilane treatment agent (e), stir and mix for 2.0 hours, then add 8 parts by mass of alkoxy-terminated polydimethylsiloxane (f), continue to stir and mix for 0.8 hours; increase the temperature to 130°C and heat and mix for 3.0 hours; vacuum removal Low molecular weight for 2.0 hours; after cooling and filtering, it is made into a lightweight, thermally conductive, flame-retardant silicone potting base compound.

[0080] Add 100 parts by mass of the aforementioned silicon...

Embodiment 3

[0092] Add 100 parts by mass of the unsaturated hydrocarbon group-terminated polydiorganosiloxane (a) and 40 parts by mass of the saturated hydrocarbon group-terminated polydiorganosiloxane (b) into the vacuum kneader, and divide it several times Add 25 parts by mass, particle size is 20um, density is 0.1g / cm 3 Hollow alumina microsphere thermal conductive filler (c), 5 parts by mass of aluminum hydroxide flame-retardant filler (d) with a particle size of 2um, and 7 parts by mass of 3-glycidyl ether oxypropyl trimethoxysilane treatment agent (e ), stir and mix for 0.8 hours, then add 5 parts by mass of alkoxy-terminated polydimethylsiloxane (f), continue to stir and mix for 0.8 hours; increase the temperature to 140°C and heat and mix for 4.0 hours; remove low molecular weight in vacuum 3.0 hours; After cooling and filtering, it is made into a lightweight, thermally conductive, flame-retardant silicone potting base compound.

[0093] Add 100 parts by mass of the aforementioned si...

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Abstract

The invention discloses a light-weight heat-conducting organosilicon pouring sealant base sizing material which comprises unsaturated hydrocarbon terminated polydiorgnosiloxane and light-weight heat-conducting filler with density of 0.1-2.0g / cm<3>. The invention aims at providing a light-weight heat-conducting organosilicon pouring sealant base sizing material and also provides a preparation method of the base sizing material, as well as a composition prepared by using the base sizing material and a preparation method thereof. A pouring sealant prepared by the base sizing material has the advantages of light weight, and good heat-conducting property.

Description

Technical field [0001] The invention relates to the technical field of organic silicon materials, in particular to a light-weight thermally conductive organic silicon potting glue base compound, a composition and a preparation method thereof. Background technique [0002] The potting materials commonly used in the market mainly include polyurethane, epoxy resin and silicone rubber. Among them, the polyurethane material has good low temperature resistance, weather resistance, low viscosity, good fluidity, simple processing equipment and technology, and easy to realize automatic operation. The disadvantage is that the polyurethane material is toxic and harmful to human health; when the epoxy resin is cured, there is no by-product, the shrinkage rate is small, and it has excellent heat resistance, electrical insulation and dielectric properties. The disadvantages are high brittleness, insufficient toughness, certain internal stress during curing, and cracks after curing; silicone r...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J183/04C09J11/04C09J11/06
CPCC08K3/22C08K5/5435C08K7/28C08K2003/2227C08K2201/003C08L2201/02C08L2203/206C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J11/06C09J183/04C08L83/04C08K7/24C08K2003/2224C08K2003/282C08K3/26C08K5/5425C08K3/14C08K2003/387
Inventor 杨思广杨化彪刘俊杰陈朝芳张利萍林祥坚张宇李响
Owner GUANGZHOU TINCI MATERIALS TECH
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