High-polymer epoxy heat-conducting material and preparation method thereof

Abstract

The invention discloses a high-polymer epoxy heat-conducting material which is prepared from the following raw materials in parts by weight: 2-3 parts of propenol, 0.4-1 part of tetrabutylammonium bromide, 37-40 parts of hexagonal boron nitride, 8-10 parts of methyl hexahydrophthalic anhydride, 0.4-1 part of neodymium acetylacetonate, 0.7-1 part of octadecylamine, 4-6 parts of 3,5-diamidobenzoic acid, 2-3 parts of triphenyl phosphite, 0.3-0.5 part of pyridine, 32-40 parts of N-methylpyrrolidone, 100-110 parts of epoxy resin E40, 0.6-1 part of polyacrylamide, 2-3 parts of sodium fluorborate, 3-4 parts of vinyl carboxylate, 0.6-1 part of polybenzimidazole, 10-12 parts of diatomite and 0.3-1 part of dodecyl glucoside. The added polyacrylamide can effectively enhance the dispersity of the filler among the resin and enhance the comprehensive properties of the finished product.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a polymer epoxy heat-conducting material and a preparation method thereof. Background technique [0002] As a functional material with great application prospects, high thermal conductivity polymer-based composite materials play a very important role in many manufacturing and high-tech fields such as microelectronics, aviation, aerospace, military equipment, electrical appliances, etc. important role. Especially in recent years, with the rapid development of electronic integration technology, the assembly density has increased rapidly, the volume of electronic components and logic circuits has been reduced by tens of thousands of times, and electronic instruments and equipment have become increasingly ultra-light, thin, short, and small. Under high-frequency operating frequency, the working thermal environment of semiconductors moves rapidly towards high temper...

AI Technical Summary

Problems solved by technology

Each layer of hexagonal BN is a planar hexagonal ring structure with B atoms and N atoms arranged alternately, and B atoms and N atoms are bonded together by SP2 hybrid covalent bonds, and the layers are bonded by Van der Waals force. Therefore, the structure of each layer of hexagonal BN is stable, but the layers are easy to peel off

At present, many researchers have established many models for predicting the thermal conductivity of binary systems based on theories such as the minimum thermal resistance method, thermal resistance network method, and homogenization method. Most of the models are only applicable to the corresponding system, and the universality is not high.