Heat-resistant cable surface layer material and preparation method thereof

A surface material and cable technology, applied in the direction of plastic/resin/wax insulators, organic insulators, etc., can solve the problems of unusable wires and cables, and achieve the effect of increased filling density, reasonable composition and excellent comprehensive performance.

Inactive Publication Date: 2017-06-20
QINGDAO XIANGZHI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for some special industries such as petrochemical, steel, aerospace, shipbuilding, military, pharmaceutical, food, plastic machinery, boilers and other industries related to heat and high temperature, wires and cables that can withstand a certain higher temperature are required. The cable obviously can't be used

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0018] Add 1Kg of p-aminobenzoic acid into the dry reactor, then add 25Kg of ethanol, and stir under reflux for 50 minutes; then add 100g of imine dibasic acid, and reflux for 2 hours; then add 800g of pentaerythritol tetraacrylate, and reflux for 2 hours An organic solution was obtained.

Synthetic example 2

[0020] Add 1Kg of ytterbium nitrate into water to prepare an aqueous solution, then add 1Kg of zirconium oxychloride octahydrate aqueous solution with a mass concentration of 20%, stir, then react at 180°C for 10 hours, cool naturally, and centrifuge to obtain a solid; then treat at 1250°C for 80 Minutes later, it was naturally cooled to obtain a powder filler with an average particle size of 80 nm.

Embodiment 1

[0022] Dissolve 30g of tetramethylbisphenol F cyanate resin monomer into 150g of epoxy resin E44, stir at 150°C for 80 minutes; then add butanone, stir at 50°C for 10 minutes; then add 30g of isomeric tridecanol Polyoxyethylene ether, stirring; then add 230g of organic matter solution, 80g of filler, and stir at 60°C for 1 hour; then add 20g of polymethylsilsesquioxane (molecular weight: 12,000 to 16,000), and stir to obtain a surface layer solution; finally, the surface layer The melt is dried at 80°C, and cured at 120°C / 1 minute + 150°C / 30 seconds to obtain a heat-resistant cable surface material.

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PUM

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Abstract

The invention discloses a preparation method of a heat-resistant cable surface material. The tetramethylbisphenol F cyanate resin monomer is dissolved in epoxy resin E44, stirred at 150°C for 80 minutes; Stir at ℃ for 10 minutes; then add isomeric tridecanol polyoxyethylene ether, stir; then add organic solution and filler, and stir at 60°C for 1 hour; then add polymethylsilsesquioxane (molecular weight: 1.2 to 16,000) , stirred to obtain a surface layer solution; finally, the surface layer melt was dried at 80°C, cured at 120°C / 1 minute + 150°C / 30 seconds to obtain a heat-resistant cable surface layer material. In the method disclosed by the invention, each raw material is easy to obtain, the utilization rate is high, and the reaction is uniform; the reaction operation is simple, the reaction process is short, the efficiency is high, and it is suitable for industrial production. There are good applications in the field.

Description

technical field [0001] The invention relates to a cable material, in particular to a heat-resistant cable surface material and a preparation method thereof, belonging to the technical field of electronic materials. Background technique [0002] The history of the use of composite materials can be traced back to ancient times. The straw or wheat straw reinforced clay that has been used since ancient times and the reinforced concrete that has been used for hundreds of years are composed of two materials. Composite materials can be mainly divided into two categories: structural composite materials and functional composite materials. Functional composite materials are generally composed of functional body components and matrix components. The matrix not only plays the role of forming a whole, but also can produce synergistic or enhanced functions. It is a material that provides other physical properties besides mechanical properties, such as: conductivity, superconductivity, se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08L71/02C08L83/04C08K9/00C08K5/18C08K3/28H01B3/40
CPCC08L63/00C08L2201/08C08L2203/202C08L2205/035H01B3/40
Inventor 李春花
Owner QINGDAO XIANGZHI ELECTRONICS TECH CO LTD
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