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Negative electron compressibility-ultrasteep subthreshold slope field effect transistor and its preparation method

A field-effect transistor and subthreshold slope technology, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of ferroelectric NCFET with large hysteresis, material fatigue, and large frequency dependence, so as to reduce leakage Electric current, avoid direct contact, simple preparation process

Active Publication Date: 2019-06-07
PEKING UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, due to the limitation of the lattice structure of ferroelectric materials, ferroelectric NCFETs have problems such as large hysteresis, large frequency dependence, and easy fatigue of materials.

Method used

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  • Negative electron compressibility-ultrasteep subthreshold slope field effect transistor and its preparation method
  • Negative electron compressibility-ultrasteep subthreshold slope field effect transistor and its preparation method
  • Negative electron compressibility-ultrasteep subthreshold slope field effect transistor and its preparation method

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Embodiment Construction

[0035] The present invention will be further elaborated below through specific embodiments in conjunction with the accompanying drawings.

[0036] Such as figure 1As shown, the negative electron compressibility ultra-steep subthreshold slope field effect transistor of this embodiment includes: a substrate 1, a source region 3, a drain region 4, a first conventional gate dielectric layer 5, and a negative electron compressibility NEC gate dielectric layer 7 , a second conventional gate dielectric layer 6, a control gate 8, an isolation layer 9, a gate electrode 10, a source electrode 11 and a drain electrode 12; wherein, a conventional gate dielectric material is deposited on the substrate 1 to form a first conventional gate dielectric layer 5 The negative electron compressibility grid dielectric layer 7 is transferred to the first conventional grid dielectric layer 5, and the negative electron compressibility grid dielectric layer 7 adopts a negative electron compressibility m...

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Abstract

The present invention discloses a negatron compression rate-ultra-steep sub-threshold slope field effect transistor and a preparation method thereof. According to the technical scheme of the invention, in the sub-threshold region of a device, a first conventional gate dielectric layer and a second conventional gate dielectric layer form a conventional gate dielectric capacitor. A negatron compression-rate gate dielectric layer forms an NEC capacitor. In this way, the capacitance value of the conventional gate dielectric capacitor is larger than the absolute value of the NEC capacitor, so that the above two series capacitors are negative in value. The gate control coefficient is less than 1 and the gate leakage current is inhibited. As a result, the gate voltage has an exceptional control capability over the surface of a channel, so that the device is ultra-steep in sub-threshold slope. Meanwhile, considering the variation at the electronic scale, the NEC capacitor of the device enables the macroscopic properties of the device to be free of the hysteresis and the material fatigue resistance any more. Therefore, on the basis that the power consumption of the device is reduced, the NCFET problem of the traditional ferroelectric material is solved. For the industry development of low-power-consumption integrated circuits in the future, the negatron compression rate-ultra-steep sub-threshold slope field effect transistor and the preparation method thereof have a wide application prospect.

Description

technical field [0001] The invention relates to a logic device of a field effect transistor, in particular to a negative electron compressibility-ultrasteep subthreshold slope field effect transistor and a preparation method thereof. Background technique [0002] Since the 20th century, the integrated circuit industry has been driven by the two wheels of economy and technology with the continuous rapid development of Moore's Law. Today, the traditional metal-oxide semiconductor field effect transistor MOSFET feature size has been reduced to the nanometer scale, but the ensuing challenges The problems brought about by the shrinking device size are also becoming more and more serious. The continuous proportional reduction of devices makes the short channel effect more and more serious. The hot electron effect, the leakage-induced barrier lowering effect and the breakdown of the drain PN junction will cause the increase of the off-state current. At the same time, the traditiona...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/739H01L29/10H01L29/08H01L29/06H01L21/336B82Y40/00
CPCB82Y40/00H01L29/06H01L29/08H01L29/1033H01L29/66325H01L29/739
Inventor 黄如王慧敏黄芊芊
Owner PEKING UNIV
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