Thermo-curable 3D printing photosensitive resin and preparation method thereof

A photosensitive resin, 3D printing technology, applied in the field of 3D printing and light curing, can solve the problems of aging degradation, limitation, uneven curing degree, etc., and achieve the effect of wide application, high tensile strength and flexural strength, and increased flexural strength.

Active Publication Date: 2017-07-14
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Usually, the post-curing method used after 3D printing is post-curing by ultraviolet light. However, due to the limited penetration depth of ultraviolet light, it will cause uneven curing. It is not suitable for thicker samples, and it is also not suitable for tape Color objects, especially objects in dark and shaded areas; ultraviolet light can also cause aging and degradation while initiating polymerization. limited in practice

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Mix 60 parts of urethane acrylate prepolymer, 16 parts of polyethylene glycol acrylate, 14 parts of pentaerythritol tetraacrylate, and 7 parts of hydroxyethyl methacrylate, place in an oven, heat to 80°C, stir until transparent, add light 2.5 parts of the initiator 1-hydroxycyclohexyl phenyl ketone was heated to 70° C. using a constant temperature magnetic stirring device, and stirred for 1 h in the dark. After the temperature of the resin is lowered to below 40°C, add 0.5 part of tert-butyl peroxybenzoate, and stir for 15 minutes under the condition of 40°C in the dark to prepare the resin for use.

[0038] Use a 405nm laser stereolithography (SLA) 3D printer for 3D printing and molding. The directly printed sample is tested with a universal mechanical testing machine. The tensile modulus is 642.19MPa, the tensile strength is 19.69MPa, and the elongation at break is 8.58%; flexural modulus 573.64MPa, flexural strength 25.64MPa. The samples were cured in an oven at 140...

Embodiment 2

[0040] Mix 60 parts of urethane acrylate prepolymer, 16 parts of polyethylene glycol acrylate, 14 parts of pentaerythritol tetraacrylate, and 7 parts of hydroxyethyl methacrylate, place in an oven, heat to 80°C, stir until transparent, add light 2.5 parts of the initiator 1-hydroxycyclohexyl phenyl ketone was heated to 70° C. using a constant temperature magnetic stirring device, and stirred for 1 h in the dark. After the temperature of the resin is lowered to below 40°C, add 0.5 part of tert-butyl peroxybenzoate, and stir for 15 minutes under the condition of 40°C in the dark to prepare the resin for use.

[0041] Using a 405nm laser stereolithography (SLA) 3D printer for 3D printing and molding, the directly printed sample was tested with a universal mechanical testing machine. The tensile modulus was 640.22MPa, the tensile strength was 19.62MPa, and the elongation at break was 8.59%; flexural modulus 574.88MPa, flexural strength 24.32MPa. The samples were cured in an oven ...

Embodiment 3

[0043]Mix 60 parts of urethane acrylate prepolymer, 16 parts of polyethylene glycol acrylate, 14 parts of pentaerythritol tetraacrylate, and 7 parts of hydroxyethyl methacrylate, place in an oven, heat to 80°C, stir until transparent, add light 2.5 parts of the initiator 1-hydroxycyclohexyl phenyl ketone was heated to 70° C. using a constant temperature magnetic stirring device, and stirred for 1 h in the dark. After the temperature of the resin is lowered to below 40°C, add 0.5 part of tert-butyl peroxybenzoate, and stir for 15 minutes under the condition of 40°C in the dark to prepare the resin for use.

[0044] Using a 405nm laser stereolithography (SLA) 3D printer for 3D printing and molding, the directly printed sample was tested using a universal mechanical testing machine. The tensile modulus was 638.25MPa, the tensile strength was 19.10MPa, and the elongation at break was 8.79%; flexural modulus 564.73MPa, flexural strength 23.96MPa. The samples were cured in an oven ...

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PUM

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Abstract

The invention discloses a thermo-curable 3D printing photosensitive resin and a preparation method and an application thereof. The photosensitive resin includes, by weight, 50-70 parts of a prepolymer, 30-50 parts of a diluent, 1-5 parts of a photo-initiator and 0.5-5 parts of a thermal-initiator, wherein the decomposition temperature of the thermal-initiator is higher than or equal to 100 DEG C when the half-life period thereof is 1 h. After photo-curing 3D printing shaping, the 3D printing photosensitive resin can be subjected to curing by heating as a post-curing method with a stable constant temperature heating device, such as a drying box and the like, so that the 3D printing photosensitive resin develops application in a non-transparent sample, a sample having complex shape, an ultra-thick sample, a colored sample and the like, and enables the samples to have better mechanical performances.

Description

technical field [0001] The invention relates to the field of 3D printing and photocuring, in particular to a thermal post-curable 3D printing photosensitive resin, a preparation method and a post-curing method thereof. Background technique [0002] Rapid Prototyping (RP) technology, also known as 3D printing, was born in the late 1970s. 3D printing has the advantages of not needing traditional processing equipment, short manufacturing cycle, capable of processing parts with complex structures, and high utilization rate of materials. , aerospace and film and television and other fields have been well applied. [0003] Light-curing 3D printing usually uses liquid resin as a material, and chain polymerization occurs under the trigger of ultraviolet light. The 3D printing technologies using photosensitive resin as printing materials mainly include: stereolithography rapid prototyping technology (Stereolithography, SLA) and DLP projection three-dimensional printing technology (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F290/06C08F222/14C08F2/48C08F4/34B29C64/124B33Y70/00
CPCB33Y70/00C08F2/48C08F4/34C08F290/062C08F290/067C08F222/104
Inventor 李悦微吴立新周煜王剑磊
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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