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Heat-conducting grease composition free of oligosiloxane volatilization and preparation method of heat-conducting grease composition

An oligomeric siloxane and composition technology, applied in the field of thermal interface materials, can solve the problems of loss of interface thermal conductivity, poor heat transfer effect, poor reliability performance, etc., to improve heat dissipation efficiency and service life, enhance heat resistance and Weather resistance, the effect of improving thermal conductivity

Active Publication Date: 2017-07-18
广州天宸高新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The disadvantages of existing thermal conductive silicone grease include: (1) methyl silicone oil tends to migrate slowly during long-term use, and the migrated methyl silicone oil has potential adverse effects on some electronic components, especially for optical screens, it will It leads to increased haze, which affects the use; (2) only pays attention to the improvement of thermal conductivity, but does not consider that thermal resistance is also a key factor affecting the application performance of thermal conductive silicone grease, such as: the thermal conductivity is as high as 5.0W / (m·K), But its contact thermal resistance is as high as 0.4K cm 2 / W, resulting in poor heat transfer effect; (3) Poor reliability, it will dry and harden after 2-3 years of use above 80 ° C, thus losing the effect of interface heat conduction; (4) There is a certain amount of siloxane volatilization , although silicon-containing base oil has good thermal conductivity and service temperature range, there is a problem of siloxane volatilization

Method used

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  • Heat-conducting grease composition free of oligosiloxane volatilization and preparation method of heat-conducting grease composition

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Experimental program
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Effect test

Embodiment 1

[0031] Embodiment 1 Modification of thermally conductive filler

[0032] The preparation method of the thermally conductive filler modification comprises the following steps: putting the thermally conductive filler composed of carbon nanotubes, boron nitride and particulate matter in a weight ratio of 9:1:40 into the reactor, and adding aluminum acid according to 3% of the weight of the thermally conductive filler As an ester coupling agent, mix hexamethyldisilazane and water at a molar ratio of 1:3 to obtain a mixed solution, then spray the mixed solution into the reactor according to 4% of the weight of the thermally conductive filler, and stir for 40 minutes. Then heated to 120°C, vacuumed to remove low boilers, and cooled to room temperature to obtain a modified thermally conductive filler. The particles are composed of the first spherical alumina and the second spherical alumina with different particle sizes at a weight ratio of 6:1; the particle size D50 of the first sph...

Embodiment 2

[0033] Embodiment 2 Modification of thermally conductive filler

[0034] The preparation method of the thermally conductive filler modification comprises the following steps: putting the thermally conductive filler composed of carbon nanotubes, boron nitride and particulate matter in a weight ratio of 5:1:44 into the reactor, and adding aluminum acid according to 4% of the weight of the thermally conductive filler As an ester coupling agent, mix hexamethyldisilazane and water at a molar ratio of 1:3 to obtain a mixed solution, then spray the mixed solution into the reactor according to 5% of the weight of the thermally conductive filler, and stir for 50 minutes. Then heated to 125°C, vacuumed to remove low boilers, and cooled to room temperature to obtain a modified thermally conductive filler. The particles are composed of the first spherical alumina and the second spherical alumina with different particle sizes at a weight ratio of 5:1; the particle size D50 of the first spher...

Embodiment 3

[0044] Example 3 Thermal grease composition without oligosiloxane volatilization

[0045] The thermally conductive grease composition without oligosiloxane volatilization includes the following components and their parts by weight: 450 parts of the modified thermally conductive filler prepared in Example 1, 150 parts of silicon-free thermally conductive oil, 90 parts of auxiliary dispersant, and 20 parts of high temperature additives. The silicon-free heat-conducting oil is composed of 120 parts of perfluoropolyether grease and 30 parts of fluorinated polyolefin, the auxiliary dispersant is nano-scale zinc oxide, and the high-temperature resistant additive is iron acetylacetonate.

[0046] The preparation method comprises the following steps:

[0047] S1 Weighing: Weigh the modified heat-conducting filler, silicon-free heat-conducting oil, dispersant, and high-temperature resistance additive in proportion, and place it in a planetary mixer;

[0048] S2 Grinding: Mix evenly w...

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Abstract

The invention provides a heat-conducting grease composition free of oligosiloxane volatilization. The heat-conducting grease composition is prepared from the following components in parts by weight: 350-550 parts of a heat-conducting filler modifier, 100-200 silicon-free heat-conducting oil, 80-100 a nanoscale second dispersant and 10-30 a high-temperature resistance assistant, wherein a heat-conducting filler is prepared from a carbon nano tube, boron nitride and a particulate matter at the weight ratio of (5-15):(0.5-1):(35-45). The heat-conducting grease composition belongs to the technical field of thermal interfacial materials. The heat-conducting grease composition is good in stability, no oligosiloxane volatilizes in use, and the heat-conducting grease composition has ultra-low contact thermal resistance characteristics and good electric insulation property and dielectric property, is stable in room-temperature storage, free of oil leakage and good in weather resistance, and does not become dry and hard even if used below 180 DEG C for a long period of time.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a thermally conductive grease composition without volatilization of oligomeric siloxane and a preparation method thereof. Background technique [0002] With the improvement of integration and power density of electronic components, the heating of components has also increased significantly. Thermal interface materials are widely used because they can effectively reduce the interface thermal resistance between heat sources and heat sinks. Thermally conductive silicone grease composition is one of the most commonly used thermally conductive media. It is a material used to fill the gap between the heat source and the heat sink, and conducts the heat emitted by the heat source to the heat sink, so that the temperature of the heat source can be maintained at a stable temperature. The level of work can extend the service life of the device and prevent th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/00C08L23/28C08K13/06C08K9/06C08K9/04C08K7/24C08K3/38C08K5/56C08K5/07C08K3/22C09K5/14
CPCC08K3/22C08K3/38C08K5/07C08K5/56C08K7/24C08K9/04C08K9/06C08K13/06C08K2003/385C08K2201/001C08K2201/011C08K2201/014C08L71/00C08L2201/08C09K5/14C08L23/28
Inventor 黄海全邱浩孟戴思维温茂添
Owner 广州天宸高新材料有限公司
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