Photosensitive resin composition, photocurable pattern and image display device

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of reduced compatibility between photosensitive resin composition and inorganic powder, insufficient solution, and reduced substrate adhesion, etc., to achieve fine Excellent pattern formation, excellent storage stability, and strong pattern effect

Active Publication Date: 2017-07-21
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Recently, in order to solve such problems, Japanese Laid-Open Patent No. 2000-095896 discloses a method of adding inorganic powder to the photosensitive resin composition, but due to the reduction of the compatibility of the photosensitive resin composition and the inorganic powder As well as the problem of reduced developability caused by adhesion to the substrate, etc., there is a problem that the content of the inorganic powder cannot be sufficiently increased, and as a result, there is a limitation that the above-mentioned problem of the photosensitive resin composition cannot be sufficiently solved.

Method used

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  • Photosensitive resin composition, photocurable pattern and image display device
  • Photosensitive resin composition, photocurable pattern and image display device
  • Photosensitive resin composition, photocurable pattern and image display device

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0130] Synthesis of the first resin A-1-1

[0131] In a 1L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, flow nitrogen at 0.02L / min to form a nitrogen atmosphere, introduce 250 g of propylene glycol monomethyl ether acetate, and heat up to 100°C. In containing acrylic acid 36.0g (0.50 mole), 3-ethyl-3-oxetanyl methacrylate 51.1g (0.30 mole), vinyltoluene 23.6g (0.20 mole) and propylene glycol monomethyl ether acetic acid A solution obtained by adding 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) to a mixture of 150 g of ester was dropped into the flask from the dropping funnel, and stirring was continued at 100°C for 5 hours .

[0132] Next, the atmosphere in the flask was changed from nitrogen to air, and 49.8 g [0.35 mol (70 mol % relative to the acrylic acid used in this reaction)] of glycidyl methacrylate was put into the flask, and the reaction was continued at 110° C. hours, an unsaturated group-containing resin (A-1-1) having a solid con...

Synthetic example 1-2

[0133] Synthesis of First Resin A-1-2

[0134] In a 1L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, flow nitrogen at 0.02L / min to form a nitrogen atmosphere, introduce 250 g of propylene glycol monomethyl ether acetate, and heat up to 100°C. Containing 36.0g (0.50 mole) of acrylic acid, 51.1g (0.30 mole) of 3-ethyl-3-oxetanyl methacrylate, 33.6g (0.20 mole) of cyclohexyl methacrylate and propylene glycol monomethyl A solution obtained by adding 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) to a mixture of 150 g of ether acetate was added dropwise to the flask from the dropping funnel, and further stirring was continued at 100°C 5 hours.

[0135] Next, the atmosphere in the flask was changed from nitrogen to air, and 49.8 g [0.35 mol (70 mol % relative to the acrylic acid used in this reaction)] of glycidyl methacrylate was put into the flask, and the reaction was continued at 110° C. hours, an unsaturated group-containing resin (A-1-2) having ...

Synthetic example 2

[0136] Synthesis of the first resin A-1-3

[0137] In a 1L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, flow nitrogen at 0.02L / min to form a nitrogen atmosphere, introduce 250 g of propylene glycol monomethyl ether acetate, and heat up to 100°C. Containing 36.0g (0.50 mole) of acrylic acid, 51.1g (0.30 mole) of 3-ethyl-3-oxetanyl methacrylate, 20.8g (0.20 mole) of styrene and propylene glycol monomethyl ether acetate The solution obtained by adding 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) to 150 g of the mixture was dropped into the flask from the dropping funnel, and further stirring was continued at 100° C. for 5 hours.

[0138]Next, the atmosphere in the flask was changed from nitrogen to air, and 49.8 g [0.35 mol (70 mol % relative to the acrylic acid used in this reaction)] of glycidyl methacrylate was put into the flask, and the reaction was continued at 110° C. hours, an unsaturated group-containing resin (A-1-3) having a solid cont...

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Abstract

The invention relates to a photosensitive resin composition, photocurable pattern and image display device, more specifically, the abovementioned photosensitive resin composition contains an alkali-soluble resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C), a solvent (D) and an additive (E), the abovementioned alkali-soluble resin (A) contains specific resin, the specific resin contains a repetitive unit containing an oxetane functional group and a repetitive unit represented by the following chemical formula 1, and thus excellent adhesion, chemical resistance and storage stability are achieved due to high solidification density. In the chemical formula 1, R1 is hydrogen atom or methyl, and R2 is an alkyl group with 1 to 6 hydrogen atoms or carbon atoms.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photocured pattern formed therefrom, and an image display device comprising the photocured pattern. Background technique [0002] In the display field, photosensitive resin compositions are used for forming various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and column spacers. Specifically, the photosensitive resin composition is selectively exposed and developed by photolithography to form a desired photocuring pattern. In order to improve the yield of the process and improve the physical properties of the application object in this process, it is necessary to A photosensitive resin composition with high sensitivity. [0003] The patterning of the photosensitive resin composition utilizes a photolithography method, that is, utilizes a polarity change and a crosslinking reaction of a polymer produced by a photoreaction. In parti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004G03F7/032
CPCG03F7/004G03F7/027G03F7/032
Inventor 曺伯铉赵庸桓崔硕均
Owner DONGWOO FINE CHEM CO LTD
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