Resin composition, adhesive, film type adhesive substrate, adhesive sheet, resin attached copper foil, copper-clad laminate board, wiring board

A resin composition and adhesive technology, applied in the directions of adhesives, adhesive additives, polymer adhesive additives, etc., can solve problems such as insufficient low dielectric properties, and achieve excellent low dielectric properties, good adhesive force, The effect of not easy to glue residue

Pending Publication Date: 2017-07-25
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As an adhesive composition that can be used as a low-dielectric material, a polyimide formed by reacting aromatic tetracarboxylic dianhydride and dimer diamine, a cross-linking agent such as epoxy resin, and a polyimide compound of an organic solvent are used. Imine-based adhesives are known (see Patent Document 1), but low dielectric properties may not be sufficient
[0006] On the other

Method used

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  • Resin composition, adhesive, film type adhesive substrate, adhesive sheet, resin attached copper foil, copper-clad laminate board, wiring board
  • Resin composition, adhesive, film type adhesive substrate, adhesive sheet, resin attached copper foil, copper-clad laminate board, wiring board
  • Resin composition, adhesive, film type adhesive substrate, adhesive sheet, resin attached copper foil, copper-clad laminate board, wiring board

Examples

Experimental program
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Effect test

Example Embodiment

[0129] Manufacturing example 1

[0130] A commercially available aromatic tetracarboxylic dianhydride (trade name "BTDA-UP", manufactured by Ebonic Japan Co., Ltd.; 3, 3', 4, The content of 4'-benzophenone tetracarboxylic dianhydride is 99.9% or more) 210.0 g, cyclohexanone 1008.0 g, and methylcyclohexane 201.6 g, and the solution is heated to 60°C. Next, 341.7 g of hydrogenated dimer diamine (trade name "PRIAMINE 1075", manufactured by Croda Japan Co., Ltd.) was added dropwise, and then the imidization reaction was carried out at 140°C for 10 hours to obtain a softening point of A solution of a polyimide resin (A1-1) having a weight average molecular weight of approximately 80°C and a weight average molecular weight of approximately 35,000 (non-volatile content 30.0%). In addition, the molar ratio of acid component / amine component was 1.03.

Example Embodiment

[0131] Manufacturing example 2

[0132] A commercially available aromatic tetracarboxylic dianhydride (trade name "BisDA2000", manufactured by SABIC Japan Contracting Corporation; 4,4'-[propane-2,2-diylbis( 1,4-Phenyleneoxy)] Diphthalic dianhydride (content of 99.5% or more) 60.0 g, 165.0 g of cyclohexanone, 27.5 g of methylcyclohexane, and the solution was heated to 60°C. Next, 59.3 g of PRIAMINE 1075 was added dropwise, and then imidization reaction was performed at 140°C for 10 hours, thereby obtaining a polyimide resin (A1) having a softening point of about 90°C and a weight average molecular weight of about 30,000. -2) solution (non-volatile content 31.9%). In addition, the molar ratio of acid component / amine component was 1.05.

Example

[0133] Comparative Example Manufacturing Example 1

[0134] A commercially available aromatic tetracarboxylic dianhydride (trade name "BisDA-1000", manufactured by SABIC Japan Contracting Corporation; 4,4'-[propane-2,2-diyl The content of bis(1,4-phenyleneoxy)]bisphthalic dianhydride is 98.0%) 65.0 g, 266.5 g of cyclohexanone, and 44.4 g of methylcyclohexane, and the solution is heated to 60°C. Next, 43.7 g of PRIAMINE 1075 and 5.4 g of 1,3-bisaminomethylcyclohexane were added dropwise, and then the imidization reaction was performed at 140°C for 10 hours, thereby obtaining a softening point of about 100°C. And a solution of a polyimide resin (A2-1) with a weight average molecular weight of about 30,000 (non-volatile content 29.2%). In addition, the molar ratio of acid component / amine component was 1.05.

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Abstract

The invention relates to a resin composition, an adhesive, a film type adhesive substrate, an adhesive sheet, a resin attached copper foil, a copper-clad laminate board and a wiring board. The invention provides a novel polyimide adhesive having an adhesive layer with good adhesiveness, heat resistance and low dielectric properties. A resin composition comprises polyimide (A1) obtained by performing reaction of a monomer group (1) comprising: an aromatic tetracarboxylic acid dianhydride (a1) having a free carboxylic acid content of less than 1 wt%; and hydrogenated dimer diamine (a2), and not comprising diaminopolysiloxane (a3).

Description

technical field [0001] The present invention relates to a resin composition, an adhesive, a film-like adhesive material, an adhesive sheet, a multilayer wiring board, a resin-coated copper foil, a copper-clad laminate, and a printed wiring board. Background technique [0002] Flexible printed wiring boards (FPWB: Flexible Printed Wiring Board) and printed circuit boards (PCB: Printed Circuit Board) and multilayer wiring boards using the above boards are used in mobile communication devices such as mobile phones and smartphones or their base station devices, servers It is widely used in network-related electronic equipment such as routers and large computers. [0003] In recent years, in these products, in order to transmit and process large-capacity information at high speed, high-frequency electrical signals are used, but high-frequency signals are easily attenuated. Therefore, it is required to suppress transmission loss as much as possible for the above-mentioned multilay...

Claims

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Application Information

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IPC IPC(8): C08G73/10C09J179/08C09J11/08C09J11/06C09J7/00H05K1/14H05K3/38
CPCH05K1/144H05K3/386C09J7/00C09J11/06C09J11/08C09J179/08C08G73/1007C08G73/105C08G73/1082H05K2201/0154C08L2205/025C08L2205/035C08L2312/00C09J2479/08C09J2301/312C08L79/08C08L63/00C08L61/06C08K5/544H05K1/0298H05K1/0313C09J7/20C08K5/5415C08L71/12
Inventor 田崎崇司盐谷淳中村太阳山口贵史杉本启辅
Owner ARAKAWA CHEM IND LTD
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