Resin composition, adhesive, film type adhesive substrate, adhesive sheet, resin attached copper foil, copper-clad laminate board, wiring board
A resin composition and adhesive technology, applied in the directions of adhesives, adhesive additives, polymer adhesive additives, etc., can solve problems such as insufficient low dielectric properties, and achieve excellent low dielectric properties, good adhesive force, The effect of not easy to glue residue
Pending Publication Date: 2017-07-25
ARAKAWA CHEM IND LTD
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The invention relates to a resin composition, an adhesive, a film type adhesive substrate, an adhesive sheet, a resin attached copper foil, a copper-clad laminate board and a wiring board. The invention provides a novel polyimide adhesive having an adhesive layer with good adhesiveness, heat resistance and low dielectric properties. A resin composition comprises polyimide (A1) obtained by performing reaction of a monomer group (1) comprising: an aromatic tetracarboxylic acid dianhydride (a1) having a free carboxylic acid content of less than 1 wt%; and hydrogenated dimer diamine (a2), and not comprising diaminopolysiloxane (a3).
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Property | Measurement | Unit |
Softening point | 80.0 | °C |
Softening point | 90.0 | °C |
Softening point | 100.0 | °C |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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