Resin composition, adhesive, film type adhesive substrate, adhesive sheet, resin attached copper foil, copper-clad laminate board, wiring board

[0129] Manufacturing example 1

[0130] A commercially available aromatic tetracarboxylic dianhydride (trade name "BTDA-UP", manufactured by Ebonic Japan Co., Ltd.; 3, 3', 4, The content of 4'-benzophenone tetracarboxylic dianhydride is 99.9% or more) 210.0 g, cyclohexanone 1008.0 g, and methylcyclohexane 201.6 g, and the solution is heated to 60°C. Next, 341.7 g of hydrogenated dimer diamine (trade name "PRIAMINE 1075", manufactured by Croda Japan Co., Ltd.) was added dropwise, and then the imidization reaction was carried out at 140°C for 10 hours to obtain a softening point of A solution of a polyimide resin (A1-1) having a weight average molecular weight of approximately 80°C and a weight average molecular weight of approximately 35,000 (non-volatile content 30.0%). In addition, the molar ratio of acid component/amine component was 1.03.

[0131] Manufacturing example 2

[0132] A commercially available aromatic tetracarboxylic dianhydride (trade name "BisDA2000", manufactured by SABIC Japan Contracting Corporation; 4,4'-[propane-2,2-diylbis( 1,4-Phenyleneoxy)] Diphthalic dianhydride (content of 99.5% or more) 60.0 g, 165.0 g of cyclohexanone, 27.5 g of methylcyclohexane, and the solution was heated to 60°C. Next, 59.3 g of PRIAMINE 1075 was added dropwise, and then imidization reaction was performed at 140°C for 10 hours, thereby obtaining a polyimide resin (A1) having a softening point of about 90°C and a weight average molecular weight of about 30,000. -2) solution (non-volatile content 31.9%). In addition, the molar ratio of acid component/amine component was 1.05.

[0133] Comparative Example Manufacturing Example 1

[0134] A commercially available aromatic tetracarboxylic dianhydride (trade name "BisDA-1000", manufactured by SABIC Japan Contracting Corporation; 4,4'-[propane-2,2-diyl The content of bis(1,4-phenyleneoxy)]bisphthalic dianhydride is 98.0%) 65.0 g, 266.5 g of cyclohexanone, and 44.4 g of methylcyclohexane, and the solution is heated to 60°C. Next, 43.7 g of PRIAMINE 1075 and 5.4 g of 1,3-bisaminomethylcyclohexane were added dropwise, and then the imidization reaction was performed at 140°C for 10 hours, thereby obtaining a softening point of about 100°C. And a solution of a polyimide resin (A2-1) with a weight average molecular weight of about 30,000 (non-volatile content 29.2%). In addition, the molar ratio of acid component/amine component was 1.05.