Three-dimensional ceramic substrate comprising cavity structure and fabrication method of three-dimensional ceramic substrate

Abstract

The invention discloses a three-dimensional ceramic substrate comprising a cavity structure. The three-dimensional ceramic substrate comprises a planar ceramic substrate and the cavity structure attached onto the planar ceramic substrate. The invention also discloses a fabrication method of the three-dimensional ceramic substrate. The fabrication method comprises the steps of firstly, fabricating the planar ceramic substrate with a surface comprising a metal circuit, designing and fabricating a die according to the cavity structure and the size requirement, and fabricating low-temperature cured ceramic paste; secondly, combining the die after the planar ceramic substrate and a plastic die are aligned, and uniformly filling the ceramic paste in a die cavity by modes such as mechanical vibration, pressure injection or vacuum pumping; and finally, allowing to stand for 15-60 minutes under a room temperature or a low temperature (lower than 100 DEG C), and removing the die after the paste is cured. The three-dimensional ceramic substrate has good thermal resistance, corrosion resistance and sealing performance; and the fabrication method of the three-dimensional ceramic substrate has the advantages of low material cost, simple process and high pattern accuracy, particularly, the ceramic paste can be cured under the room temperature or the temperature lower than 100 DEG C, and the hermetical package demands of white-light LED, ultraviolet-light LED and other electrical devices are satisfied.

Description

technical field [0001] The invention belongs to the field of electronic manufacturing, and in particular relates to a three-dimensional ceramic substrate with a cavity structure and a preparation method thereof. Background technique [0002] Compared with traditional lighting sources (incandescent lamps, fluorescent lamps, etc.), white LEDs (Light Emitting Diodes) have the advantages of high light efficiency, long service life, energy saving and environmental protection. At present, white light LEDs generally use blue LED chips to excite yellow phosphors to obtain white light. like figure 1 As shown, a white LED module generally includes a blue LED chip, an adhesive layer containing phosphor powder, gold wires, lenses, a heat dissipation substrate, and a metal circuit layer. The main purpose of adding a lens is to improve the light output efficiency and reliability of the module, which is usually prepared by an expensive mold top (Molding) process. Since the phosphor powd...

AI Technical Summary

Problems solved by technology

However, the existing substrate cavity structures are generally prepared by high-temperature processes (such as LTCC and HTCC), which are difficult to be compatible with existing packaging materials and processes, and the cost is high, which limits its mass production and application

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