Epoxy molding plastics for manufacturing light reflection components and method for preparing epoxy molding plastics

An epoxy molding compound, light reflection technology, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of high water absorption, high epoxy value, high hydroxyl content of cured products, high fluidity, high temperature yellow resistance The effect of strong variable ability and small thermal expansion coefficient

Inactive Publication Date: 2017-08-11
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy value of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate is high, the cured product has a high hydroxyl content and a high water absorption rate

Method used

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  • Epoxy molding plastics for manufacturing light reflection components and method for preparing epoxy molding plastics
  • Epoxy molding plastics for manufacturing light reflection components and method for preparing epoxy molding plastics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] (1) Take 60 parts by mass of alicyclic epoxy resin R2 and heat to 90°C, add 40 parts by mass of alicyclic epoxy resin R1, and stir slowly until the alicyclic epoxy resin R1 is completely dissolved to make resin R2 / resin R1 is 60 / 40 liquid mixed cycloaliphatic epoxy resin;

[0042] (2) Take 91 parts by mass of methylhexahydrophthalic anhydride, add 0.5 parts by mass of triphenylphosphine and 2 parts by mass of silane coupling agent, and stir until the triphenylphosphine is dissolved;

[0043] (3) Inject the mixed liquid epoxy resin and methylhexahydrophthalic anhydride into the vacuum mixer in turn, slowly add 30 parts by mass of titanium dioxide, 5 parts by mass of fumed white carbon black and 2 parts by mass of polyethylene wax powder at 50°C , And control the temperature not to exceed 70℃, stir for 10 minutes, slowly add 250 parts by mass of spherical silica powder, stir until the silica powder is infiltrated by the resin, then add 120 parts by mass of spherical silica pow...

Embodiment 2

[0048] (1) Take 70 parts by mass of alicyclic epoxy resin R2 and heat to 90°C, add 30 parts by mass of alicyclic epoxy resin R1, and stir slowly until the alicyclic epoxy resin R1 is completely dissolved to make resin R2 / resin R1 is 70 / 30 liquid mixed cycloaliphatic epoxy resin;

[0049] (2) Take 95 parts by mass of methylhexahydrophthalic anhydride, add 0.5 parts by mass of triphenylphosphine and 2 parts by mass of silane coupling agent, and stir until the triphenylphosphine is dissolved;

[0050] (3) Inject the liquid mixed epoxy resin and methylhexahydrophthalic anhydride into the vacuum mixer in turn, slowly add 30 parts by mass of titanium dioxide white pigment and 2 parts by mass of polyethylene wax powder at 50°C, and control the temperature not to exceed 70℃, stir for 10 minutes, slowly add 300 parts by mass of spherical silica powder, stir until the silica powder is infiltrated by the resin, then add 200 parts by mass of spherical silica powder, and stir until the silica p...

Embodiment 3

[0055] (1) Take 70 parts by mass of alicyclic epoxy resin R2 and heat to 90°C, add 30 parts by mass of alicyclic epoxy resin R1, and stir slowly until the alicyclic epoxy resin R1 is completely dissolved to make resin R2 / resin R1 is 70 / 30 liquid mixed cycloaliphatic epoxy resin;

[0056] (2) Take 95 parts by mass of methylhexahydrophthalic anhydride, add 1 part by mass of triphenylphosphine and 2 parts by mass of silane coupling agent, and stir until the triphenylphosphine is dissolved;

[0057] (3) Inject the liquid mixed epoxy resin and methylhexahydrophthalic anhydride into the vacuum mixer in turn, slowly add 10 parts by mass of titanium dioxide, 30 parts by mass of zinc oxide powder, 5 parts by mass of fumed silica, at 50°C. 2 parts by mass of polyethylene wax powder, control the temperature not to exceed 70°C, stir for 15 minutes, slowly add 300 parts by mass of spherical silica powder, stir until the silica powder is infiltrated by the resin, and then add 200 parts by mass o...

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Abstract

The invention discloses an epoxy molding compound for making a light reflection part and a preparation method thereof. The epoxy molding compound includes the following components: mixed cycloaliphatic epoxy resin, acid anhydride curing agent, curing accelerator, white pigment, filler and other auxiliary agents. The method for preparing the epoxy molding compound comprises the following steps: (1) placing the components in a mixer, stirring and mixing them evenly to obtain a mixed material; (2) die-casting the obtained mixed material and filling a mold, and reacting in the mold At the B stage, the mold is cooled and ejected to obtain the epoxy molding compound. The epoxy molding compound of the present invention has the advantages of low viscosity, good filling, high fluidity, small thermal expansion coefficient, high thermal conductivity and low ion content; the epoxy molding compound of the present invention has high visible light reflectivity after curing and processing, balanced It has the advantages of low water absorption, anti-ultraviolet aging, strong anti-yellowing ability at high temperature, good adhesion and sealing, and high reliability.

Description

Technical field [0001] The invention belongs to the field of polymer materials and optoelectronic device packaging, and in particular relates to an epoxy molding compound used for manufacturing light reflection parts, a preparation method thereof, and a preparation method of light reflection parts. Background technique [0002] There are many optoelectronic devices that need to use light reflective components to improve the use of the device. For example, LED chips need components that can reflect light radiation to improve the external quantum efficiency of the packaged LED chips and control the radiation projection direction. When using a lead frame to produce a packaged LED chip for surface assembly, a plastic cup that can reflect the radiation of the LED chip is preformed on the lead frame to make an LED bracket. [0003] The reflective cup on the traditional LED bracket is mainly filled with semi-aromatic nylon, such as polyhexamethylene terephthalamide (PA6T), polynonane tere...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L23/06C08K13/02C08K5/50C08K3/22C08K3/36C08G59/42H01L33/60
CPCC08L63/00C08G59/4215C08K2003/2241C08K2003/2296C08L2201/08C08L2203/206C08L2205/02C08L2205/035H01L33/60C08L23/06C08K13/02C08K5/50C08K3/22C08K3/36
Inventor 李建雄潘日辉
Owner SOUTH CHINA UNIV OF TECH
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