A curved focal plane detector with electrodes prepared by ion implantation and its preparation method
A focal plane detector and ion implantation technology, applied in electrical radiation detectors and other directions, can solve problems such as poor compatibility of integrated circuit manufacturing processes, affecting yield, contaminating equipment, etc., to save process steps, improve productivity and improve efficiency , the effect of increasing the area
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Embodiment 1
[0066] The preparation method of the curved surface focal plane detector of ion implantation preparation electrode comprises the following steps:
[0067] Step 1: Fabricate a metal reflective layer 2 on a semiconductor base 1 containing a readout circuit, and perform patterning on the metal reflective layer 2, and the patterned metal reflective layer 2 forms several metal blocks 2-1; the metal Block 2-1 is electrically connected to the readout circuit on the semiconductor base 1; then, an insulating dielectric layer 3 is deposited on the patterned metal reflective layer 2, such as figure 1 Shown; the thickness of metal reflective layer 2 is The metal reflective layer 2 has a reflectivity of more than 99% for infrared light with a wavelength of 8-14 μm, and the insulating medium layer 3 is a silicon nitride film or a silicon oxide film with a thickness of
[0068] Step 2: Deposit a sacrificial layer 4 on the insulating dielectric layer 3, and pattern the sacrificial layer...
Embodiment 2
[0077] The difference from Example 1 is that in step 9, the detector is first bent and shaped, and then its structure is released. The specific method is as follows: use a circular ring or cylinder 18 with a uniform force on the detector with a back film Fixed, use a flexible round head rod to squeeze the surface of the detector on the front, such as Figure 15 As shown; the radius of the round head of the round head mandrel 19 can be from 3mm to ∞, so that the detector forms a curved surface; then, the method of baking is used to keep the curved surface with a fixed curvature so that it does not return to a flat state, and finally, carry out Structure release, removing the sacrificial layer to form a microbridge structure, such as Figure 12 as shown, Figure 12 Only the shape of the curved focal plane detector is given in , and the internal structure is also deformed by bending. Figure 12 not shown in.
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