Ultraviolet LED packaging device

A technology of LED packaging and LED chips, which is applied in the field of ultraviolet LED, can solve the problems that cannot meet the high performance of ultraviolet LED, long service life, low light extraction rate and heat dissipation capacity, device reliability and shortened life, etc., to achieve the elimination of light loss, reduced Fresnel loss, reduced absorption effect

Pending Publication Date: 2017-09-19
GUANGDONG UNIV OF TECH
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  • Application Information

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Problems solved by technology

From the perspective of packaging level, ultraviolet light has high energy and is more demanding on packaging materials. The traditional LED packaging structure makes the light extraction rate and heat dissipation capacity of ultraviolet LED chips not high, and the performance reliability and life of the device are shortened, which cannot meet the requirements. Requirements for high performance and long life of UV LEDs

Method used

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Embodiment Construction

[0025] The content of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments thereof, but should not be construed as limiting the invention.

[0026] figure 1 It is a schematic diagram of the three-dimensional structure of the alumina ceramic substrate in the ultraviolet LED packaging device of the present invention. From the bottom surface of the groove of the alumina ceramic substrate 111 to the top layer of the substrate, there is a narrow strip symmetrical to the center line, which belongs to the area without copper plating as the insulating area. In this way, the insulating property of the alumina ceramic 111 itself divides the conductive copper plating layer 131 into two insulating parts.

[0027] Figure 2-Figure 5 Respectively, the structure I, II, III and IV of the ultraviolet LED packaging device of the present invention are figure 1 Schematic diagram of the longitudinal section structure along ...

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Abstract

The invention discloses an ultraviolet LED packaging device. The ultraviolet LED packaging device comprises an aluminum oxide ceramic substrate, an ultraviolet LED chip, a copper coating, a CuAlO2 transition layer, a silicon resin solid layer and quartz glass, and is characterized in that the ultraviolet LED chip comprises a positive electrode and a negative electrode, the chip is fixed in a packaging slot of the aluminum oxide ceramic substrate, the surface of the aluminum oxide ceramic substrate is coated with the copper coating, the CuAlO2 transition layer is arranged between the copper coating and the aluminum oxide ceramic substrate, the copper coating and the CuAlO2 transition layer are discontinuous conductive layers, an insulating area is arranged between the positive electrode and the negative electrode of the ultraviolet LED chip, and the insulating area runs through the surface of the whole aluminum oxide ceramic substrate and divides the copper coating into two insulated parts. The ultraviolet LED packaging device is of a three-layer packaging structure, and the light extraction rate and the heat dissipation capacity of the ultraviolet LED chip can be improved, so that the performance reliability and the service life of the device are improved.

Description

technical field [0001] The invention belongs to the technical field of ultraviolet LEDs, and more specifically relates to an ultraviolet LED packaging device. Background technique [0002] Light-emitting diodes (LEDs) are becoming more and more widely used in today's daily life and industry, and have won a lot of attention due to their low power consumption, fast luminous response, high reliability, high radiation efficiency, long life, no pollution to the environment, and compact structure. With a large market share, it is a promising green light source. Among them, divided by LED wavelength, the wavelength range of 320-400nm is near-ultraviolet UVA, the wavelength range of 275-320nm is mid-ultraviolet UVB, and the wavelength range of 100-275nm is far-ultraviolet UVC. The rapid development of ultraviolet LED is also penetrating deeper and deeper in various industries, such as screen printing, polymer curing, environmental protection, white light lighting, military detectio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/58H01L33/60H01L33/62H01L33/64
CPCH01L33/48H01L33/54H01L33/58H01L33/60H01L33/62H01L33/641
Inventor 何苗黄波熊德平杨思攀周海亮
Owner GUANGDONG UNIV OF TECH
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