High-mobility transistor based on PMMA doped micro-molecule and preparation method thereof
A high-mobility, transistor-based technology, applied in the field of organic electronics, can solve problems such as hindering the further use of devices, large surface roughness, and reduced mobility, and achieve the effects of easy industrialization, simple preparation methods, and improved device performance
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Embodiment 1
[0036] A method for preparing a high-mobility transistor based on PMMA-doped small molecules described in this embodiment comprises the following steps:
[0037] S1: Preparation of C8-BTBT and PMMA mixed solution: use C8-BTBT and PMMA as solute and chlorobenzene as solvent to prepare a mixed solution of 0.5% mass ratio of C8-BTBT and 0.5% mass ratio of PMMA, and the prepared solution is sonicated for 10 minutes use, ready-to-use;
[0038] S2: Substrate cleaning: Select a P-type heavily doped silicon wafer containing silicon dioxide, cut it into a square with a side length of 1.5 cm with a silicon wafer knife, and clean it by ultrasonic: put acetone, isopropanol, and Deionized water, acetone, isopropanol, deionized water, and then rinse it with deionized water for two minutes to remove impurities such as organic matter on the surface, spray nitrogen with a nitrogen gun to dry the surface of the silicon wafer with deionized water, and then It is dried in an oven;
[0039] S3: ...
Embodiment 2
[0046] A method for preparing a high-mobility transistor based on PMMA-doped small molecules described in this embodiment comprises the following steps:
[0047] S1: Preparation of C8-BTBT and PMMA mixed solution: use C8-BTBT and PMMA as solute and chlorobenzene as solvent to prepare a mixed solution of 0.5% mass ratio of C8-BTBT and 0.5% mass ratio of PMMA, and the prepared solution is sonicated for 10 minutes use, ready-to-use;
[0048] S2: Substrate cleaning: Select a P-type heavily doped silicon wafer containing silicon dioxide, cut it into a square with a side length of 1.5 cm with a silicon wafer knife, and clean it by ultrasonic: put acetone, isopropanol, and Deionized water, acetone, isopropanol, deionized water, and then rinse it with deionized water for two minutes to remove impurities such as organic matter on the surface, spray nitrogen with a nitrogen gun to dry the surface of the silicon wafer with deionized water, and then It is dried in an oven;
[0049] S3: ...
Embodiment 3
[0055] A method for preparing a high-mobility transistor based on PMMA-doped small molecules described in this embodiment comprises the following steps:
[0056] S1: Preparation of C8-BTBT and PMMA mixed solution: use C8-BTBT and PMMA as solute and chlorobenzene as solvent to prepare a mixed solution of 0.5% mass ratio of C8-BTBT and 0.5% mass ratio of PMMA, and the prepared solution is sonicated for 10 minutes use, ready-to-use;
[0057] S2: Substrate cleaning: Select a P-type heavily doped silicon wafer containing silicon dioxide, cut it into a square with a side length of 1.5 cm with a silicon wafer knife, and clean it by ultrasonic: put acetone, isopropanol, and Deionized water, acetone, isopropanol, deionized water, and then rinse it with deionized water for two minutes to remove impurities such as organic matter on the surface, spray nitrogen with a nitrogen gun to dry the surface of the silicon wafer with deionized water, and then It is dried in an oven;
[0058] S3: ...
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