Preparation method of organic silicon pouring sealant for LED (light emitting diode) encapsulation

A technology of silicone potting glue and LED packaging, which is applied in the direction of adhesives, adhesive additives, electrical components, etc., can solve the problems of not having good fluidity and excellent adhesion, and achieve reduced migration resistance and good compatibility , Improve the effect of low surface energy

Inactive Publication Date: 2017-10-03
CHANGZHOU OPTICAL MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem mainly solved by the present invention is to provide a preparation method of silicone potting compound for LED packaging in view of the defect that the existing silicone potting compound cannot have both good fluidity before curing and excellent adhesion after curing

Method used

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  • Preparation method of organic silicon pouring sealant for LED (light emitting diode) encapsulation

Examples

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Effect test

example 1

[0022] Take 100g of vinyl silicone oil, 350g of silicon micropowder, 10g of spherical alumina and 5g of silane coupling agent A-171 into a kneader, heat to 120°C and mix for 1 hour, then heat to 160°C for 1 hour, cool to room temperature and discharge To obtain the base material, take 360g of hydroxyl silicone oil, 200g of silane coupling agent KH-560, and 70g of tetramethyltetravinylcyclotetrasiloxane into a reaction kettle, heat to 50°C, and stir at 200r / min for 20min, Then add 0.15g of dibutyltin dilaurate, continue to stir and heat to 60°C, keep warm for 3 hours, then vacuumize to 100Pa, continue for 30min, keep warm for 1h, cool to room temperature, and discharge to obtain a tackifier, in parts by weight In total, take 200 parts of base material, 50 parts of vinyl silicone oil, 20 parts of tackifier, and 0.1 part of platinum catalyst in a kneader and mix them evenly, then grind and disperse them with a three-roller mill for 20 minutes to obtain component A. In terms of pa...

example 2

[0024] Take 110g of vinyl silicone oil, 385g of silicon micropowder, 30g of spherical alumina and 5g of silane coupling agent A-171 into the kneader, heat to 140°C and mix for 1 hour, then heat to 170°C for 1 hour, cool to room temperature and discharge To obtain the base material, take 380g of hydroxyl silicone oil, 220g of silane coupling agent KH-560, and 75g of tetramethyltetravinylcyclotetrasiloxane into a reactor, heat to 53°C, and stir at 250r / min for 25min, Then add 0.18g of dibutyltin dilaurate, continue to stir and heat to 63°C, vacuumize to 550Pa after heat preservation for 3 hours, continue for 35 minutes, heat heat for 1 hour, cool to room temperature, and discharge to obtain a tackifier, in parts by weight In total, take 225 parts of base material, 55 parts of vinyl silicone oil, 25 parts of tackifier, and 0.2 parts of platinum catalyst, put them into a kneader and mix them evenly, then grind and disperse them with a three-roller mill for 25 minutes to obtain comp...

example 3

[0026]Take 120g of vinyl silicone oil, 420g of silicon micropowder, 50g of spherical alumina and 6g of silane coupling agent A-171 into the kneader, heat to 160°C and mix for 2 hours, then heat to 180°C for 2 hours, cool to room temperature and discharge To obtain the base material, take 400g of hydroxyl silicone oil, 240g of silane coupling agent KH-560, and 80g of tetramethyltetravinylcyclotetrasiloxane into a reaction kettle, heat to 55°C, and stir at 300r / min for 30min, Then add 0.20g of dibutyltin dilaurate, continue to stir and heat to 65°C, keep warm for 4 hours, then vacuumize to 1000Pa, continue for 40 minutes, keep warm for 2 hours, cool to room temperature, and discharge to obtain a tackifier, in parts by weight In total, take 250 parts of base material, 60 parts of vinyl silicone oil, 30 parts of tackifier, and 0.3 parts of platinum catalyst in a kneader and mix them evenly, then grind and disperse them with a three-roller mill for 30 minutes to obtain component A. ...

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Abstract

The invention discloses a preparation method of an organic silicon pouring sealant for LED (light emitting diode) encapsulation, and belongs to the technical field of electronic pouring material preparation. Silicon micro powder, spherical aluminum oxide and the like are mixed and heated to prepare base materials; hydroxyl silicone oil, tetramethyl tetravinyl cyclotetrasiloxane and the like are mixed and heated to prepare tackifiers; then, the base materials, the tackifiers, platinum catalysts and the like are mixed and ground to prepare an ingredient A; then, the base materials, vinyl silicone oil, hydrogen-containing silicone oil and methylbutynol are used as raw materials; mixing grinding and dispersion are performed to prepare an ingredient B; the ingredient A and the ingredient B are uniformly mixed, are subjected to foam discharging and are then filled onto bonding base materials to be cured; the organic silicon pouring sealant for LED encapsulation can be obtained. The obtained organic silicon pouring sealant has good flowing performance and bonding performance; meanwhile, the pouring sealant has excellent heat conduction performance; wide application prospects are realized in the LED encapsulation field.

Description

technical field [0001] The invention discloses a method for preparing an organic silicon potting glue for LED packaging, and belongs to the technical field of preparation of electronic potting materials. Background technique [0002] With the development of LED lighting technology, power LED manufacturing technology is constantly improving and improving, and its luminous efficiency, brightness and power have been greatly improved. In the process of manufacturing power LED devices, in addition to chips, phosphors and heat dissipation technologies, LED packaging materials have an important impact on the performance of LED devices. [0003] With the continuous improvement of the performance requirements of LED packaging materials, LED packaging materials have gradually developed from epoxy resin, silicone modified epoxy resin to the current silicone potting glue. Silicone potting adhesive has the advantages of heat and cold shock resistance, ultraviolet radiation resistance, c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/06C09J183/05C09J11/04C09J11/06H01L33/56
CPCC08L2203/206C08L2205/025C08L2205/03C08L2205/05C09J11/04C09J11/06C09J183/04H01L33/56C08L83/04C08L83/06C08K13/06C08K9/06C08K3/36C08K7/18C08K5/5435
Inventor 孙建忠王之霖潘宏梅
Owner CHANGZHOU OPTICAL MATERIAL
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