Halogen-free flame-retardant electronic material and preparation method thereof

A technology of electronic materials and particles, applied in the field of halogen-free flame retardant electronic materials and their preparation, can solve the problems of reducing the thermal properties of materials and failing to achieve the flame retardant effect, so as to improve the thermal properties, avoid the decrease of the dielectric properties, and maintain the Effect of toughness and dielectric properties

Inactive Publication Date: 2017-10-27
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Application Information

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Problems solved by technology

However, if the existing technology does not use halogen flame retardants, it cannot achieve a good flame

Method used

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  • Halogen-free flame-retardant electronic material and preparation method thereof

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Embodiment 1

[0021] A method for preparing a halogen-free flame-retardant electronic material, comprising the following steps:

[0022] Add 5g of fullerene derivative PCBM to 4000g of cyanate chlorobenzene solution (25wt%), then add 100g of diethylphenylphosphate and 150g of enol silyl ether, and add 80g of dicarboxyphthalate after 80 minutes of reflux reaction Formimide, reacted for 75 minutes, then rotary evaporated, dried at 135°C to remove the solvent, and obtained a cyanate ester prepolymer; the cyanate ester prepolymer was mixed with 100g N-4-hydroxyphenyl maleic anhydride imide, 450g naphthalene Phenolic phenolic resin, 400g tetraglycidyl diaminodimethylbenzene mixed, stirred at 120°C for 45 minutes, then added 5g silicon carbide short fiber and 100g 1,8-octanedithiol, continued to stir for 20 minutes, cooled naturally to obtain cyanide Ester modified product; then crush the cyanate modified product, add 150g polyphenylene sulfide and 60g hollow alumina into the extruder, and extrud...

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Abstract

The invention provides a halogen-free flame-retardant electronic material and a preparation method thereof. The preparation method comprises the following steps: adding a fullerene derivative into a cyanate chlorobenzene solution, adding diethylbenzene phosphate and enol silyl ether, carrying out reflux reaction for 80 minutes, adding dicarboxyl phthalimide, reacting for 75 minutes, and simultaneously carrying out rotary evaporation and drying to remove a solvent, so as to obtain a cyanate prepolymer; mixing the cyanate prepolymer with N-4-hydroxyphenyl maleic anhydride alkylamine, naphthol phenolic resin and tetraglycidyl diaminomethylene, stirring at 120 DEG C for 45 minutes, adding silicon carbide short fibers and 1,8-octane dithiol, continuing to stir for 20 minutes, and naturally cooling, so as to obtain a cyanate modified matter; crushing the cyanate modified matter, adding the crushed cyanate modified matter, polyphenylene sulfide and hollow aluminum oxide into an extruder, carrying out extrusion at 155 DEG C, so as to obtain halogen-free flame-retardant particles; and carrying out hot-pressing on the halogen-free flame-retardant particles, so as to obtain the halogen-free flame-retardant electronic material. The prepared halogen-free flame-retardant electronic material has excellent flame retardance and very good dielectric property and thermal performance.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a halogen-free flame-retardant electronic material and a preparation method thereof. Background technique [0002] Electronic materials have a wide range of applications, and they need to have good heat resistance and flame retardancy. At the same time, dielectric properties and insulation properties are also critical, especially flame retardancy. However, if the prior art does not use a halogen flame retardant, it cannot achieve a good flame retardant effect, and at the same time, the phosphorus flame retardant will reduce the thermal performance of the material. Contents of the invention [0003] The invention provides a halogen-free flame-retardant electronic material and a preparation method thereof. [0004] In order to achieve the above-mentioned purpose of the invention, the present invention adopts the following technical solutions: [0005] A...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08L61/08C08L81/02C08K7/10C08K7/24C08G73/06
CPCC08L79/04C08G73/0638C08G73/065C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/03C08L2312/00C08L61/06C08L81/02C08K7/10C08K7/24
Inventor 彭代信韩建
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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