The embodiment of the invention provides a
nickel plating solution and a surface treatment method of an aluminum-based material. The
nickel plating solution comprises soluble
nickel salt, a complexing agent, a
styrene polymer and
ammonia water. The complexing agent comprises a compound as shown in a formula (I), and in the formula (I), X is an
ether bond-containing
alkyl chain, a phenyl-containing
alkyl chain or a polyenol chain; r1 and R2 are respectively and independently selected from
hydrogen, substituted or non-substituted
alkyl, substituted or non-substituted cycloalkyl, substituted or non-substituted alkenyl, substituted or non-substituted alkynyl, substituted or non-substituted ester, substituted or non-substituted
aryl, substituted or non-substituted heteroaryl or substituted or non-substituted alicyclic group, and R1 and R2 are independently selected from
hydrogen, substituted or non-substituted alkyl, substituted or non-substituted cycloalkyl, substituted or non-substituted alkenyl, substituted or non-substituted alkynyl, substituted or non-substituted ester, substituted or non-substituted
aryl, substituted or non-substituted heteroaryl or substituted or non-substituted alicyclic group; r1 and R2 are not heteroaryl containing
sulfur atoms at the same time. The nickel plating solution is high in stability, does not need to add a
reducing agent additionally, can be used for surface treatment of the aluminum-based material, enables the surface of the aluminum-based material to form a nickel film layer which is single in component, flat and uniform at
room temperature, and further facilitates proceeding of a subsequent plating process.