Packaging method for MEMS device based on LCP multilayer stacking technology
A technology of device packaging and multi-layer stacking, which is applied in the field of radar system/subsystem and microwave communication, can solve the problems of low generalization, poor air tightness and high loss of MEMS devices, achieve good insulation, maintain original performance, The effect of low moisture absorption
Active Publication Date: 2017-11-07
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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[0004] The purpose of the present invention is to provide a MEMS device packaging method based on LCP multilayer stacking technology, which is used to solve the technical problems of low generalization, poor airtightness and high loss of MEMS devices
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[0039] Below, combine figure 1 , figure 2 and image 3 The present invention is further described.
[0040] A MEMS device packaging method based on LCP multilayer stacking technology, its processing process is as follows figure 1 As shown, it specifically includes the following steps:
[0041] (1) Cleaning the silicon substrate with an organic cleaning solution.
[0042] Place a silicon substrate with a diameter of 100 mm, a thickness of 0.4 mm, and double-sided polishing in a beaker filled with acetone, use ultrasonic cleaning for 5 to 10 minutes, and then take out the silicon substrate and place it in a beaker filled with alcohol. Use ultrasonic cleaning for 5 minutes to 10 minutes to clean the dirt on the surface of the silicon substrate, and take it out for later use after cleaning.
[0043] (2) photolithography is carried out to the front side of the silicon substrate after cleaning in step (1), and a mask pattern of dry etching silicon grooves is formed on the fron...
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The invention discloses a packaging method for an MEMS device based on an LCP multilayer stacking technology. The method is characterized by that the MEMS device is obtained on a double-side polished silicon substrate through technologies such as sputtering, photoetching, etching and electroplating; moreover, a silicon groove which is easy to lead out and is accurate in alignment is formed; on the basis of the LCP multilayer stacking technology, a packaging cover cap part of the device is obtained on a multilayer LCP substrate through technologies such as laser cutting-up, alignment and lamination; and the device and the cover cap are packaged without assistance and are integrated highly precisely, and the MEMS device with low loss and good gas tightness is obtained. The MEMS device provided by the invention has the advantages of low loss, high isolation degree and good gas tightness. According to the method, the packaging protection is provided for the MEMS device with movable components, and the method is especially applicable to miniaturization application of microwave, millimeter wave communication and radar systems / subsystems and belongs to the key technology for realizing miniature and high-performance microwave communication and radar systems / subsystems.
Description
technical field [0001] The invention belongs to the key technical field of realizing miniaturized, high-performance, and highly generalized microwave communication and radar systems / subsystems, and specifically relates to a packaging method suitable for MEMS devices based on LCP multilayer stacking technology. Background technique [0002] With the increasing demand for miniaturization of T / R components and microwave / millimeter wave modules in communication systems and phased array radar systems, electronic equipment is gradually developing in the direction of miniaturization and high performance. The integration and performance of modules and components Increase accordingly. MEMS devices have played an increasingly important role in it, becoming a key component in the system to achieve reconfigurability, and its performance and volume directly affect the performance and integration of communication and radar systems / subsystems. [0003] MEMS devices contain moving parts, a...
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IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0032B81B7/02
Inventor 赵飞党元兰徐亚新梁广华刘晓兰唐小平王康
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP