Preparation method of heat dissipating material used on electronic product

Abstract

The invention discloses a preparation method of a heat dissipating material used on an electronic product. The preparation method comprises the following preparation steps of: (a) mixing coal ash and mineral slags, washing with clean water, draining, then putting in a muffle furnace for treatment, cooling and grinding to obtain powder; (b) mixing magnesium oxide, conductive mica powder, ferric phosphate powder, tetrapod-like zinc oxide whiskers and powder in a mixing tank, adding a coupling agent into the mixing tank, and stirring to obtain mixed materials; (c) putting aluminosilicate cement, epoxy resin and diaminodiphenyl methane in a stirring tank, heating, stirring, putting ferrophosphorus powder, a composite compatilizer and the mixed materials into the stirring tank, stirring, then naturally cooling to room temperature and obtaining mixture; and (d) putting the mixture and a curing agent into the stirring tank, stirring, then carrying out vacuum defoaming to obtain the heat dissipating material. The heat dissipating material prepared by the preparation method is strong in adhesive force, difficult in falling, stable in use process and excellent in antistatic property.

Description

technical field [0001] The invention belongs to the technical field of electronic products, and in particular relates to a preparation method of a heat dissipation material used in electronic products. Background technique [0002] In electronic products, the heat dissipation of products has always been an urgent concern of people. With the deepening of the miniaturization and integration of electronic products nowadays, the requirements for heat dissipation are getting higher and higher, and the heat dissipation problem has become one of the main obstacles restricting the miniaturization of electronic products. There are many ways to improve the heat dissipation of electronic products, including improving the heat dissipation of bonding materials, increasing heat dissipation film materials, and using high heat dissipation rubber materials, etc. [0003] In electronic products, a thin film of heat dissipation material is often added on the electronic device. In the industry...

AI Technical Summary

Problems solved by technology

However, graphite flakes are also easy to fall off during use. If they accidentally fall into the electronic product, it will cause a short circuit in the electronic product, and in severe cases, it will cause fire and other dangers.